TW202513747A - 導電糊、rfid嵌體及rfid嵌體之製造方法 - Google Patents

導電糊、rfid嵌體及rfid嵌體之製造方法 Download PDF

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Publication number
TW202513747A
TW202513747A TW113131786A TW113131786A TW202513747A TW 202513747 A TW202513747 A TW 202513747A TW 113131786 A TW113131786 A TW 113131786A TW 113131786 A TW113131786 A TW 113131786A TW 202513747 A TW202513747 A TW 202513747A
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TW
Taiwan
Prior art keywords
conductive
conductive paste
substrate
particles
less
Prior art date
Application number
TW113131786A
Other languages
English (en)
Chinese (zh)
Inventor
山中雄太
大倉滉生
永井康晴
Original Assignee
日商積水化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商積水化學工業股份有限公司 filed Critical 日商積水化學工業股份有限公司
Publication of TW202513747A publication Critical patent/TW202513747A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW113131786A 2023-08-25 2024-08-23 導電糊、rfid嵌體及rfid嵌體之製造方法 TW202513747A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023137308 2023-08-25
JP2023-137308 2023-08-25

Publications (1)

Publication Number Publication Date
TW202513747A true TW202513747A (zh) 2025-04-01

Family

ID=94819131

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113131786A TW202513747A (zh) 2023-08-25 2024-08-23 導電糊、rfid嵌體及rfid嵌體之製造方法

Country Status (4)

Country Link
JP (1) JP7713118B1 (https=)
CN (1) CN120826747A (https=)
TW (1) TW202513747A (https=)
WO (1) WO2025047577A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060111496A1 (en) 2004-11-24 2006-05-25 Stijn Gillissen Low temperature snap cure material with suitable worklife
JP5363793B2 (ja) * 2008-11-28 2013-12-11 積水化学工業株式会社 導電性粒子、異方性導電材料、接続構造体及び導電性粒子の製造方法
JP2012142255A (ja) * 2010-12-16 2012-07-26 Sekisui Chem Co Ltd 異方性導電材料及び接続構造体
JP5583611B2 (ja) * 2011-01-27 2014-09-03 株式会社日本触媒 導電性微粒子
JP6231257B2 (ja) 2011-12-15 2017-11-15 デクセリアルズ株式会社 導電性接着剤、及び電子部品の接続方法
CN110300780A (zh) * 2017-03-06 2019-10-01 迪睿合株式会社 树脂组合物、树脂组合物的制备方法和结构体
JP7328856B2 (ja) * 2019-09-26 2023-08-17 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体

Also Published As

Publication number Publication date
WO2025047577A1 (ja) 2025-03-06
JP7713118B1 (ja) 2025-07-24
CN120826747A (zh) 2025-10-21
JPWO2025047577A1 (https=) 2025-03-06

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