CN120826747A - 导电糊、rfid嵌体和rfid嵌体的制造方法 - Google Patents

导电糊、rfid嵌体和rfid嵌体的制造方法

Info

Publication number
CN120826747A
CN120826747A CN202480020372.2A CN202480020372A CN120826747A CN 120826747 A CN120826747 A CN 120826747A CN 202480020372 A CN202480020372 A CN 202480020372A CN 120826747 A CN120826747 A CN 120826747A
Authority
CN
China
Prior art keywords
conductive
conductive paste
less
particles
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480020372.2A
Other languages
English (en)
Chinese (zh)
Inventor
山中雄太
大仓滉生
永井康晴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of CN120826747A publication Critical patent/CN120826747A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN202480020372.2A 2023-08-25 2024-08-22 导电糊、rfid嵌体和rfid嵌体的制造方法 Pending CN120826747A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023137308 2023-08-25
JP2023-137308 2023-08-25
PCT/JP2024/029864 WO2025047577A1 (ja) 2023-08-25 2024-08-22 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法

Publications (1)

Publication Number Publication Date
CN120826747A true CN120826747A (zh) 2025-10-21

Family

ID=94819131

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480020372.2A Pending CN120826747A (zh) 2023-08-25 2024-08-22 导电糊、rfid嵌体和rfid嵌体的制造方法

Country Status (4)

Country Link
JP (1) JP7713118B1 (https=)
CN (1) CN120826747A (https=)
TW (1) TW202513747A (https=)
WO (1) WO2025047577A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060111496A1 (en) 2004-11-24 2006-05-25 Stijn Gillissen Low temperature snap cure material with suitable worklife
JP5363793B2 (ja) * 2008-11-28 2013-12-11 積水化学工業株式会社 導電性粒子、異方性導電材料、接続構造体及び導電性粒子の製造方法
JP2012142255A (ja) * 2010-12-16 2012-07-26 Sekisui Chem Co Ltd 異方性導電材料及び接続構造体
JP5583611B2 (ja) * 2011-01-27 2014-09-03 株式会社日本触媒 導電性微粒子
JP6231257B2 (ja) 2011-12-15 2017-11-15 デクセリアルズ株式会社 導電性接着剤、及び電子部品の接続方法
CN110300780A (zh) * 2017-03-06 2019-10-01 迪睿合株式会社 树脂组合物、树脂组合物的制备方法和结构体
JP7328856B2 (ja) * 2019-09-26 2023-08-17 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体

Also Published As

Publication number Publication date
WO2025047577A1 (ja) 2025-03-06
TW202513747A (zh) 2025-04-01
JP7713118B1 (ja) 2025-07-24
JPWO2025047577A1 (https=) 2025-03-06

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