JPWO2025047577A1 - - Google Patents
Info
- Publication number
- JPWO2025047577A1 JPWO2025047577A1 JP2024574025A JP2024574025A JPWO2025047577A1 JP WO2025047577 A1 JPWO2025047577 A1 JP WO2025047577A1 JP 2024574025 A JP2024574025 A JP 2024574025A JP 2024574025 A JP2024574025 A JP 2024574025A JP WO2025047577 A1 JPWO2025047577 A1 JP WO2025047577A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Inorganic Chemistry (AREA)
- Conductive Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023137308 | 2023-08-25 | ||
| JP2023137308 | 2023-08-25 | ||
| PCT/JP2024/029864 WO2025047577A1 (ja) | 2023-08-25 | 2024-08-22 | 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2025047577A1 true JPWO2025047577A1 (https=) | 2025-03-06 |
| JP7713118B1 JP7713118B1 (ja) | 2025-07-24 |
| JPWO2025047577A5 JPWO2025047577A5 (https=) | 2025-08-06 |
Family
ID=94819131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024574025A Active JP7713118B1 (ja) | 2023-08-25 | 2024-08-22 | 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7713118B1 (https=) |
| CN (1) | CN120826747A (https=) |
| TW (1) | TW202513747A (https=) |
| WO (1) | WO2025047577A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060111496A1 (en) | 2004-11-24 | 2006-05-25 | Stijn Gillissen | Low temperature snap cure material with suitable worklife |
| JP5363793B2 (ja) * | 2008-11-28 | 2013-12-11 | 積水化学工業株式会社 | 導電性粒子、異方性導電材料、接続構造体及び導電性粒子の製造方法 |
| JP2012142255A (ja) * | 2010-12-16 | 2012-07-26 | Sekisui Chem Co Ltd | 異方性導電材料及び接続構造体 |
| JP5583611B2 (ja) * | 2011-01-27 | 2014-09-03 | 株式会社日本触媒 | 導電性微粒子 |
| JP6231257B2 (ja) | 2011-12-15 | 2017-11-15 | デクセリアルズ株式会社 | 導電性接着剤、及び電子部品の接続方法 |
| CN110300780A (zh) * | 2017-03-06 | 2019-10-01 | 迪睿合株式会社 | 树脂组合物、树脂组合物的制备方法和结构体 |
| JP7328856B2 (ja) * | 2019-09-26 | 2023-08-17 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
-
2024
- 2024-08-22 CN CN202480020372.2A patent/CN120826747A/zh active Pending
- 2024-08-22 JP JP2024574025A patent/JP7713118B1/ja active Active
- 2024-08-22 WO PCT/JP2024/029864 patent/WO2025047577A1/ja active Pending
- 2024-08-23 TW TW113131786A patent/TW202513747A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2025047577A1 (ja) | 2025-03-06 |
| TW202513747A (zh) | 2025-04-01 |
| JP7713118B1 (ja) | 2025-07-24 |
| CN120826747A (zh) | 2025-10-21 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20241217 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20241217 |
|
| A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20241217 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20250128 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250327 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20250617 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20250711 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7713118 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |