JP7713118B1 - 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法 - Google Patents

導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法

Info

Publication number
JP7713118B1
JP7713118B1 JP2024574025A JP2024574025A JP7713118B1 JP 7713118 B1 JP7713118 B1 JP 7713118B1 JP 2024574025 A JP2024574025 A JP 2024574025A JP 2024574025 A JP2024574025 A JP 2024574025A JP 7713118 B1 JP7713118 B1 JP 7713118B1
Authority
JP
Japan
Prior art keywords
conductive
conductive paste
less
substrate
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024574025A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025047577A5 (https=
JPWO2025047577A1 (https=
Inventor
雄太 山中
滉生 大倉
康晴 永井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of JPWO2025047577A1 publication Critical patent/JPWO2025047577A1/ja
Application granted granted Critical
Publication of JP7713118B1 publication Critical patent/JP7713118B1/ja
Publication of JPWO2025047577A5 publication Critical patent/JPWO2025047577A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2024574025A 2023-08-25 2024-08-22 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法 Active JP7713118B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023137308 2023-08-25
JP2023137308 2023-08-25
PCT/JP2024/029864 WO2025047577A1 (ja) 2023-08-25 2024-08-22 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法

Publications (3)

Publication Number Publication Date
JPWO2025047577A1 JPWO2025047577A1 (https=) 2025-03-06
JP7713118B1 true JP7713118B1 (ja) 2025-07-24
JPWO2025047577A5 JPWO2025047577A5 (https=) 2025-08-06

Family

ID=94819131

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024574025A Active JP7713118B1 (ja) 2023-08-25 2024-08-22 導電ペースト、ｒｆｉｄインレイ及びｒｆｉｄインレイの製造方法

Country Status (4)

Country Link
JP (1) JP7713118B1 (https=)
CN (1) CN120826747A (https=)
TW (1) TW202513747A (https=)
WO (1) WO2025047577A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010129455A (ja) * 2008-11-28 2010-06-10 Sekisui Chem Co Ltd 導電性粒子、異方性導電材料、接続構造体及び導電性粒子の製造方法
JP2012142255A (ja) * 2010-12-16 2012-07-26 Sekisui Chem Co Ltd 異方性導電材料及び接続構造体
JP2012156066A (ja) * 2011-01-27 2012-08-16 Nippon Shokubai Co Ltd 導電性微粒子
JP2021057101A (ja) * 2019-09-26 2021-04-08 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060111496A1 (en) 2004-11-24 2006-05-25 Stijn Gillissen Low temperature snap cure material with suitable worklife
JP6231257B2 (ja) 2011-12-15 2017-11-15 デクセリアルズ株式会社 導電性接着剤、及び電子部品の接続方法
CN110300780A (zh) * 2017-03-06 2019-10-01 迪睿合株式会社 树脂组合物、树脂组合物的制备方法和结构体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010129455A (ja) * 2008-11-28 2010-06-10 Sekisui Chem Co Ltd 導電性粒子、異方性導電材料、接続構造体及び導電性粒子の製造方法
JP2012142255A (ja) * 2010-12-16 2012-07-26 Sekisui Chem Co Ltd 異方性導電材料及び接続構造体
JP2012156066A (ja) * 2011-01-27 2012-08-16 Nippon Shokubai Co Ltd 導電性微粒子
JP2021057101A (ja) * 2019-09-26 2021-04-08 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体

Also Published As

Publication number Publication date
WO2025047577A1 (ja) 2025-03-06
TW202513747A (zh) 2025-04-01
CN120826747A (zh) 2025-10-21
JPWO2025047577A1 (https=) 2025-03-06

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