TW202511453A - 蝕刻液、蝕刻方法及半導體裝置之製造方法 - Google Patents
蝕刻液、蝕刻方法及半導體裝置之製造方法 Download PDFInfo
- Publication number
- TW202511453A TW202511453A TW113124273A TW113124273A TW202511453A TW 202511453 A TW202511453 A TW 202511453A TW 113124273 A TW113124273 A TW 113124273A TW 113124273 A TW113124273 A TW 113124273A TW 202511453 A TW202511453 A TW 202511453A
- Authority
- TW
- Taiwan
- Prior art keywords
- etching solution
- silicon
- mass
- etching
- component
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/019—Manufacture or treatment of FETs having stacked nanowire, nanosheet or nanoribbon channels
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/025—Manufacture or treatment of FETs having insulated gates [IGFET] of vertical IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/60—Wet etching
- H10P50/64—Wet etching of semiconductor materials
- H10P50/642—Chemical etching
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/69—Etching of wafers, substrates or parts of devices using masks for semiconductor materials
- H10P50/691—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Weting (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023-105666 | 2023-06-28 | ||
| JP2023105665 | 2023-06-28 | ||
| JP2023-105665 | 2023-06-28 | ||
| JP2023-105662 | 2023-06-28 | ||
| JP2023105666 | 2023-06-28 | ||
| JP2023105662 | 2023-06-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202511453A true TW202511453A (zh) | 2025-03-16 |
Family
ID=93939238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW113124273A TW202511453A (zh) | 2023-06-28 | 2024-06-28 | 蝕刻液、蝕刻方法及半導體裝置之製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2025005205A1 (https=) |
| KR (1) | KR20260027156A (https=) |
| TW (1) | TW202511453A (https=) |
| WO (1) | WO2025005205A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3081171B2 (ja) * | 1996-08-12 | 2000-08-28 | 株式会社デンソー | エッチング液及びエッチング加工方法 |
| JP4975430B2 (ja) * | 2006-12-28 | 2012-07-11 | 関東化学株式会社 | 異方性エッチング液およびそれを用いたエッチング方法 |
| TWI683362B (zh) * | 2018-12-17 | 2020-01-21 | 許富翔 | 矽鰭片結構的修整方法 |
| JP2021012940A (ja) * | 2019-07-05 | 2021-02-04 | 株式会社デンソー | 半導体装置の製造方法 |
| US11508828B2 (en) * | 2020-07-06 | 2022-11-22 | Applied Materials, Inc. | Selective silicon etch for gate all around transistors |
| JP7765206B2 (ja) * | 2021-06-24 | 2025-11-06 | 花王株式会社 | シリコン用エッチング液 |
-
2024
- 2024-06-27 JP JP2025530207A patent/JPWO2025005205A1/ja active Pending
- 2024-06-27 KR KR1020257041995A patent/KR20260027156A/ko active Pending
- 2024-06-27 WO PCT/JP2024/023437 patent/WO2025005205A1/ja not_active Ceased
- 2024-06-28 TW TW113124273A patent/TW202511453A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2025005205A1 (https=) | 2025-01-02 |
| KR20260027156A (ko) | 2026-02-27 |
| WO2025005205A1 (ja) | 2025-01-02 |
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