TW202506953A - 研磨用二氧化矽微粒子分散液、研磨用組成物、及研磨用二氧化矽微粒子分散液之製造方法 - Google Patents

研磨用二氧化矽微粒子分散液、研磨用組成物、及研磨用二氧化矽微粒子分散液之製造方法 Download PDF

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Publication number
TW202506953A
TW202506953A TW113116328A TW113116328A TW202506953A TW 202506953 A TW202506953 A TW 202506953A TW 113116328 A TW113116328 A TW 113116328A TW 113116328 A TW113116328 A TW 113116328A TW 202506953 A TW202506953 A TW 202506953A
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TW
Taiwan
Prior art keywords
solution
silica
particle size
particles
polishing
Prior art date
Application number
TW113116328A
Other languages
English (en)
Chinese (zh)
Inventor
中山和洋
福澤薫子
碓田真也
村上智顕
向井達也
Original Assignee
日商日揮觸媒化成股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日揮觸媒化成股份有限公司 filed Critical 日商日揮觸媒化成股份有限公司
Publication of TW202506953A publication Critical patent/TW202506953A/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
    • C01B33/141—Preparation of hydrosols or aqueous dispersions
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
    • C01B33/141—Preparation of hydrosols or aqueous dispersions
    • C01B33/142—Preparation of hydrosols or aqueous dispersions by acidic treatment of silicates
    • C01B33/143—Preparation of hydrosols or aqueous dispersions by acidic treatment of silicates of aqueous solutions of silicates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/51—Particles with a specific particle size distribution
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Silicon Compounds (AREA)
TW113116328A 2023-05-12 2024-05-02 研磨用二氧化矽微粒子分散液、研磨用組成物、及研磨用二氧化矽微粒子分散液之製造方法 TW202506953A (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2023079427 2023-05-12
JP2023-079427 2023-05-12
JP2023079426 2023-05-12
JP2023-079426 2023-05-12
JP2023-141164 2023-08-31
JP2023141164 2023-08-31

Publications (1)

Publication Number Publication Date
TW202506953A true TW202506953A (zh) 2025-02-16

Family

ID=93519012

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113116328A TW202506953A (zh) 2023-05-12 2024-05-02 研磨用二氧化矽微粒子分散液、研磨用組成物、及研磨用二氧化矽微粒子分散液之製造方法

Country Status (4)

Country Link
JP (1) JPWO2024237073A1 (https=)
KR (1) KR20260009286A (https=)
TW (1) TW202506953A (https=)
WO (1) WO2024237073A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8052788B2 (en) 2005-08-10 2011-11-08 Nalco Company Method of producing silica sols with controllable broad size distribution and minimum particle size
JP2009091197A (ja) * 2007-10-09 2009-04-30 Jgc Catalysts & Chemicals Ltd 金平糖状無機酸化物ゾル、その製造方法および前記ゾルを含む研磨剤
JP2010024119A (ja) * 2008-07-24 2010-02-04 Jgc Catalysts & Chemicals Ltd 金平糖状シリカゾルの製造方法
JP6927732B2 (ja) 2017-04-10 2021-09-01 日揮触媒化成株式会社 異形シリカ粒子の製造方法
JP7591376B2 (ja) * 2019-10-09 2024-11-28 日揮触媒化成株式会社 シリカ系粒子分散液およびその製造方法

Also Published As

Publication number Publication date
JPWO2024237073A1 (https=) 2024-11-21
KR20260009286A (ko) 2026-01-19
WO2024237073A1 (ja) 2024-11-21

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