KR20260009286A - 연마용 실리카 미립자 분산액, 연마용 조성물, 및 연마용 실리카 미립자 분산액의 제조 방법 - Google Patents

연마용 실리카 미립자 분산액, 연마용 조성물, 및 연마용 실리카 미립자 분산액의 제조 방법

Info

Publication number
KR20260009286A
KR20260009286A KR1020257037114A KR20257037114A KR20260009286A KR 20260009286 A KR20260009286 A KR 20260009286A KR 1020257037114 A KR1020257037114 A KR 1020257037114A KR 20257037114 A KR20257037114 A KR 20257037114A KR 20260009286 A KR20260009286 A KR 20260009286A
Authority
KR
South Korea
Prior art keywords
solution
silica
particle size
silicic acid
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257037114A
Other languages
English (en)
Korean (ko)
Inventor
가즈히로 나카야마
가오루코 야마시타
신야 우스다
도모아키 무라카미
다츠야 무카이
Original Assignee
닛키 쇼쿠바이카세이 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛키 쇼쿠바이카세이 가부시키가이샤 filed Critical 닛키 쇼쿠바이카세이 가부시키가이샤
Publication of KR20260009286A publication Critical patent/KR20260009286A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
    • C01B33/141—Preparation of hydrosols or aqueous dispersions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
    • C01B33/141—Preparation of hydrosols or aqueous dispersions
    • C01B33/142—Preparation of hydrosols or aqueous dispersions by acidic treatment of silicates
    • C01B33/143—Preparation of hydrosols or aqueous dispersions by acidic treatment of silicates of aqueous solutions of silicates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/51—Particles with a specific particle size distribution
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Silicon Compounds (AREA)
KR1020257037114A 2023-05-12 2024-04-26 연마용 실리카 미립자 분산액, 연마용 조성물, 및 연마용 실리카 미립자 분산액의 제조 방법 Pending KR20260009286A (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2023079427 2023-05-12
JP2023079426 2023-05-12
JPJP-P-2023-079427 2023-05-12
JPJP-P-2023-079426 2023-05-12
JPJP-P-2023-141164 2023-08-31
JP2023141164 2023-08-31
PCT/JP2024/016468 WO2024237073A1 (ja) 2023-05-12 2024-04-26 研磨用シリカ微粒子分散液、研磨用組成物、および研磨用シリカ微粒子分散液の製造方法

Publications (1)

Publication Number Publication Date
KR20260009286A true KR20260009286A (ko) 2026-01-19

Family

ID=93519012

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257037114A Pending KR20260009286A (ko) 2023-05-12 2024-04-26 연마용 실리카 미립자 분산액, 연마용 조성물, 및 연마용 실리카 미립자 분산액의 제조 방법

Country Status (4)

Country Link
JP (1) JPWO2024237073A1 (https=)
KR (1) KR20260009286A (https=)
TW (1) TW202506953A (https=)
WO (1) WO2024237073A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012503586A (ja) 2008-09-24 2012-02-09 ナルコ カンパニー 制御可能な幅広い粒径分布及び最小粒径を有するシリカゾルの製造方法
JP2018177576A (ja) 2017-04-10 2018-11-15 日揮触媒化成株式会社 異形シリカ粒子の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009091197A (ja) * 2007-10-09 2009-04-30 Jgc Catalysts & Chemicals Ltd 金平糖状無機酸化物ゾル、その製造方法および前記ゾルを含む研磨剤
JP2010024119A (ja) * 2008-07-24 2010-02-04 Jgc Catalysts & Chemicals Ltd 金平糖状シリカゾルの製造方法
JP7591376B2 (ja) * 2019-10-09 2024-11-28 日揮触媒化成株式会社 シリカ系粒子分散液およびその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012503586A (ja) 2008-09-24 2012-02-09 ナルコ カンパニー 制御可能な幅広い粒径分布及び最小粒径を有するシリカゾルの製造方法
JP2018177576A (ja) 2017-04-10 2018-11-15 日揮触媒化成株式会社 異形シリカ粒子の製造方法

Also Published As

Publication number Publication date
JPWO2024237073A1 (https=) 2024-11-21
TW202506953A (zh) 2025-02-16
WO2024237073A1 (ja) 2024-11-21

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