JPWO2024237073A1 - - Google Patents
Info
- Publication number
- JPWO2024237073A1 JPWO2024237073A1 JP2025520489A JP2025520489A JPWO2024237073A1 JP WO2024237073 A1 JPWO2024237073 A1 JP WO2024237073A1 JP 2025520489 A JP2025520489 A JP 2025520489A JP 2025520489 A JP2025520489 A JP 2025520489A JP WO2024237073 A1 JPWO2024237073 A1 JP WO2024237073A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
- C01B33/141—Preparation of hydrosols or aqueous dispersions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
- C01B33/141—Preparation of hydrosols or aqueous dispersions
- C01B33/142—Preparation of hydrosols or aqueous dispersions by acidic treatment of silicates
- C01B33/143—Preparation of hydrosols or aqueous dispersions by acidic treatment of silicates of aqueous solutions of silicates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/51—Particles with a specific particle size distribution
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Silicon Compounds (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023079427 | 2023-05-12 | ||
| JP2023079426 | 2023-05-12 | ||
| JP2023141164 | 2023-08-31 | ||
| PCT/JP2024/016468 WO2024237073A1 (ja) | 2023-05-12 | 2024-04-26 | 研磨用シリカ微粒子分散液、研磨用組成物、および研磨用シリカ微粒子分散液の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024237073A1 true JPWO2024237073A1 (https=) | 2024-11-21 |
Family
ID=93519012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025520489A Pending JPWO2024237073A1 (https=) | 2023-05-12 | 2024-04-26 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2024237073A1 (https=) |
| KR (1) | KR20260009286A (https=) |
| TW (1) | TW202506953A (https=) |
| WO (1) | WO2024237073A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8052788B2 (en) | 2005-08-10 | 2011-11-08 | Nalco Company | Method of producing silica sols with controllable broad size distribution and minimum particle size |
| JP2009091197A (ja) * | 2007-10-09 | 2009-04-30 | Jgc Catalysts & Chemicals Ltd | 金平糖状無機酸化物ゾル、その製造方法および前記ゾルを含む研磨剤 |
| JP2010024119A (ja) * | 2008-07-24 | 2010-02-04 | Jgc Catalysts & Chemicals Ltd | 金平糖状シリカゾルの製造方法 |
| JP6927732B2 (ja) | 2017-04-10 | 2021-09-01 | 日揮触媒化成株式会社 | 異形シリカ粒子の製造方法 |
| JP7591376B2 (ja) * | 2019-10-09 | 2024-11-28 | 日揮触媒化成株式会社 | シリカ系粒子分散液およびその製造方法 |
-
2024
- 2024-04-26 WO PCT/JP2024/016468 patent/WO2024237073A1/ja not_active Ceased
- 2024-04-26 KR KR1020257037114A patent/KR20260009286A/ko active Pending
- 2024-04-26 JP JP2025520489A patent/JPWO2024237073A1/ja active Pending
- 2024-05-02 TW TW113116328A patent/TW202506953A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20260009286A (ko) | 2026-01-19 |
| TW202506953A (zh) | 2025-02-16 |
| WO2024237073A1 (ja) | 2024-11-21 |