TW202446901A - 研磨用組成物、研磨用組成物之濃縮液及研磨方法 - Google Patents

研磨用組成物、研磨用組成物之濃縮液及研磨方法 Download PDF

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Publication number
TW202446901A
TW202446901A TW113108978A TW113108978A TW202446901A TW 202446901 A TW202446901 A TW 202446901A TW 113108978 A TW113108978 A TW 113108978A TW 113108978 A TW113108978 A TW 113108978A TW 202446901 A TW202446901 A TW 202446901A
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TW
Taiwan
Prior art keywords
polishing
mass
polishing composition
water
compound
Prior art date
Application number
TW113108978A
Other languages
English (en)
Chinese (zh)
Inventor
向井貴俊
沼田圭祐
村瀬雄彦
希
土屋公亮
Original Assignee
日商福吉米股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商福吉米股份有限公司 filed Critical 日商福吉米股份有限公司
Publication of TW202446901A publication Critical patent/TW202446901A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/129—Preparing bulk and homogeneous wafers by polishing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW113108978A 2023-03-14 2024-03-12 研磨用組成物、研磨用組成物之濃縮液及研磨方法 TW202446901A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-039981 2023-03-14
JP2023039981 2023-03-14

Publications (1)

Publication Number Publication Date
TW202446901A true TW202446901A (zh) 2024-12-01

Family

ID=92755003

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113108978A TW202446901A (zh) 2023-03-14 2024-03-12 研磨用組成物、研磨用組成物之濃縮液及研磨方法

Country Status (6)

Country Link
EP (1) EP4682939A1 (https=)
JP (1) JPWO2024190532A1 (https=)
KR (1) KR20250159664A (https=)
CN (1) CN120858439A (https=)
TW (1) TW202446901A (https=)
WO (1) WO2024190532A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001110760A (ja) * 1999-10-04 2001-04-20 Asahi Denka Kogyo Kk シリコンウェハー用研磨助剤
JP4668528B2 (ja) * 2003-09-05 2011-04-13 株式会社フジミインコーポレーテッド 研磨用組成物
JP5625044B2 (ja) * 2009-04-22 2014-11-12 エルジー・ケム・リミテッド 化学的機械的研磨用スラリー
JP5781287B2 (ja) * 2009-10-01 2015-09-16 ニッタ・ハース株式会社 研磨組成物
DE112012004431B4 (de) * 2011-10-24 2025-12-31 Fujimi Incorporated Zusammensetzung zu Polierzwecken, Polierverfahren unter Verwendung derselben und Verfahren zur Herstellung eines Substrates
TWI573864B (zh) * 2012-03-14 2017-03-11 卡博特微電子公司 具有高移除率及低缺陷率之對氧化物及氮化物有選擇性之ｃｍｐ組成物
BR122020023215B1 (pt) 2013-05-03 2022-11-22 Selecta Biosciences, Inc Composição e kit de nanocarreadores sintéticos tolerogênicos para reduzir ou prevenir anafilaxia em resposta a um antígeno não alergênico
JP6306383B2 (ja) * 2014-03-17 2018-04-04 日本キャボット・マイクロエレクトロニクス株式会社 スラリー組成物および基板研磨方法
JPWO2020009054A1 (ja) * 2018-07-04 2021-08-05 住友精化株式会社 研磨用組成物

Also Published As

Publication number Publication date
KR20250159664A (ko) 2025-11-11
EP4682939A1 (en) 2026-01-21
JPWO2024190532A1 (https=) 2024-09-19
CN120858439A (zh) 2025-10-28
WO2024190532A1 (ja) 2024-09-19

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