JPWO2024190532A1 - - Google Patents
Info
- Publication number
- JPWO2024190532A1 JPWO2024190532A1 JP2025506741A JP2025506741A JPWO2024190532A1 JP WO2024190532 A1 JPWO2024190532 A1 JP WO2024190532A1 JP 2025506741 A JP2025506741 A JP 2025506741A JP 2025506741 A JP2025506741 A JP 2025506741A JP WO2024190532 A1 JPWO2024190532 A1 JP WO2024190532A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
- H10P52/40—Chemomechanical polishing [CMP]
- H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
- H10P90/12—Preparing bulk and homogeneous wafers
- H10P90/129—Preparing bulk and homogeneous wafers by polishing
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023039981 | 2023-03-14 | ||
| PCT/JP2024/008253 WO2024190532A1 (ja) | 2023-03-14 | 2024-03-05 | 研磨用組成物、研磨用組成物の濃縮液および研磨方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024190532A1 true JPWO2024190532A1 (https=) | 2024-09-19 |
Family
ID=92755003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025506741A Pending JPWO2024190532A1 (https=) | 2023-03-14 | 2024-03-05 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP4682939A1 (https=) |
| JP (1) | JPWO2024190532A1 (https=) |
| KR (1) | KR20250159664A (https=) |
| CN (1) | CN120858439A (https=) |
| TW (1) | TW202446901A (https=) |
| WO (1) | WO2024190532A1 (https=) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001110760A (ja) * | 1999-10-04 | 2001-04-20 | Asahi Denka Kogyo Kk | シリコンウェハー用研磨助剤 |
| JP4668528B2 (ja) * | 2003-09-05 | 2011-04-13 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| JP5625044B2 (ja) * | 2009-04-22 | 2014-11-12 | エルジー・ケム・リミテッド | 化学的機械的研磨用スラリー |
| JP5781287B2 (ja) * | 2009-10-01 | 2015-09-16 | ニッタ・ハース株式会社 | 研磨組成物 |
| DE112012004431B4 (de) * | 2011-10-24 | 2025-12-31 | Fujimi Incorporated | Zusammensetzung zu Polierzwecken, Polierverfahren unter Verwendung derselben und Verfahren zur Herstellung eines Substrates |
| TWI573864B (zh) * | 2012-03-14 | 2017-03-11 | 卡博特微電子公司 | 具有高移除率及低缺陷率之對氧化物及氮化物有選擇性之ｃｍｐ組成物 |
| BR122020023215B1 (pt) | 2013-05-03 | 2022-11-22 | Selecta Biosciences, Inc | Composição e kit de nanocarreadores sintéticos tolerogênicos para reduzir ou prevenir anafilaxia em resposta a um antígeno não alergênico |
| JP6306383B2 (ja) * | 2014-03-17 | 2018-04-04 | 日本キャボット・マイクロエレクトロニクス株式会社 | スラリー組成物および基板研磨方法 |
| JPWO2020009054A1 (ja) * | 2018-07-04 | 2021-08-05 | 住友精化株式会社 | 研磨用組成物 |
-
2024
- 2024-03-05 JP JP2025506741A patent/JPWO2024190532A1/ja active Pending
- 2024-03-05 WO PCT/JP2024/008253 patent/WO2024190532A1/ja not_active Ceased
- 2024-03-05 KR KR1020257030155A patent/KR20250159664A/ko active Pending
- 2024-03-05 EP EP24770642.7A patent/EP4682939A1/en active Pending
- 2024-03-05 CN CN202480017548.9A patent/CN120858439A/zh active Pending
- 2024-03-12 TW TW113108978A patent/TW202446901A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202446901A (zh) | 2024-12-01 |
| KR20250159664A (ko) | 2025-11-11 |
| EP4682939A1 (en) | 2026-01-21 |
| CN120858439A (zh) | 2025-10-28 |
| WO2024190532A1 (ja) | 2024-09-19 |