KR20250159664A - 연마용 조성물, 연마용 조성물의 농축액 및 연마 방법 - Google Patents

연마용 조성물, 연마용 조성물의 농축액 및 연마 방법

Info

Publication number
KR20250159664A
KR20250159664A KR1020257030155A KR20257030155A KR20250159664A KR 20250159664 A KR20250159664 A KR 20250159664A KR 1020257030155 A KR1020257030155 A KR 1020257030155A KR 20257030155 A KR20257030155 A KR 20257030155A KR 20250159664 A KR20250159664 A KR 20250159664A
Authority
KR
South Korea
Prior art keywords
polishing
mass
polishing composition
less
water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257030155A
Other languages
English (en)
Korean (ko)
Inventor
다카토시 무카이
게이스케 누마타
다케히코 무라세
마키 아사다
고스케 츠치야
Original Assignee
가부시키가이샤 후지미인코퍼레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 후지미인코퍼레이티드 filed Critical 가부시키가이샤 후지미인코퍼레이티드
Publication of KR20250159664A publication Critical patent/KR20250159664A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H01L21/30625—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/129—Preparing bulk and homogeneous wafers by polishing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020257030155A 2023-03-14 2024-03-05 연마용 조성물, 연마용 조성물의 농축액 및 연마 방법 Pending KR20250159664A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023039981 2023-03-14
JPJP-P-2023-039981 2023-03-14
PCT/JP2024/008253 WO2024190532A1 (ja) 2023-03-14 2024-03-05 研磨用組成物、研磨用組成物の濃縮液および研磨方法

Publications (1)

Publication Number Publication Date
KR20250159664A true KR20250159664A (ko) 2025-11-11

Family

ID=92755003

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257030155A Pending KR20250159664A (ko) 2023-03-14 2024-03-05 연마용 조성물, 연마용 조성물의 농축액 및 연마 방법

Country Status (6)

Country Link
EP (1) EP4682939A1 (https=)
JP (1) JPWO2024190532A1 (https=)
KR (1) KR20250159664A (https=)
CN (1) CN120858439A (https=)
TW (1) TW202446901A (https=)
WO (1) WO2024190532A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001110760A (ja) * 1999-10-04 2001-04-20 Asahi Denka Kogyo Kk シリコンウェハー用研磨助剤
JP4668528B2 (ja) * 2003-09-05 2011-04-13 株式会社フジミインコーポレーテッド 研磨用組成物
JP5625044B2 (ja) * 2009-04-22 2014-11-12 エルジー・ケム・リミテッド 化学的機械的研磨用スラリー
JP5781287B2 (ja) * 2009-10-01 2015-09-16 ニッタ・ハース株式会社 研磨組成物
DE112012004431B4 (de) * 2011-10-24 2025-12-31 Fujimi Incorporated Zusammensetzung zu Polierzwecken, Polierverfahren unter Verwendung derselben und Verfahren zur Herstellung eines Substrates
TWI573864B (zh) * 2012-03-14 2017-03-11 卡博特微電子公司 具有高移除率及低缺陷率之對氧化物及氮化物有選擇性之ｃｍｐ組成物
BR122020023215B1 (pt) 2013-05-03 2022-11-22 Selecta Biosciences, Inc Composição e kit de nanocarreadores sintéticos tolerogênicos para reduzir ou prevenir anafilaxia em resposta a um antígeno não alergênico
JP6306383B2 (ja) * 2014-03-17 2018-04-04 日本キャボット・マイクロエレクトロニクス株式会社 スラリー組成物および基板研磨方法
JPWO2020009054A1 (ja) * 2018-07-04 2021-08-05 住友精化株式会社 研磨用組成物

Also Published As

Publication number Publication date
TW202446901A (zh) 2024-12-01
EP4682939A1 (en) 2026-01-21
JPWO2024190532A1 (https=) 2024-09-19
CN120858439A (zh) 2025-10-28
WO2024190532A1 (ja) 2024-09-19

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Legal Events

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PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

Q12 Application published

Free format text: ST27 STATUS EVENT CODE: A-1-1-Q10-Q12-NAP-PG1501 (AS PROVIDED BY THE NATIONAL OFFICE)

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000