TW202438231A - 研磨方法及研磨裝置 - Google Patents

研磨方法及研磨裝置 Download PDF

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Publication number
TW202438231A
TW202438231A TW113104592A TW113104592A TW202438231A TW 202438231 A TW202438231 A TW 202438231A TW 113104592 A TW113104592 A TW 113104592A TW 113104592 A TW113104592 A TW 113104592A TW 202438231 A TW202438231 A TW 202438231A
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TW
Taiwan
Prior art keywords
substrate
grinding
wafer
polishing
grinding wheel
Prior art date
Application number
TW113104592A
Other languages
English (en)
Chinese (zh)
Inventor
坂上貴志
Original Assignee
日商東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW202438231A publication Critical patent/TW202438231A/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
TW113104592A 2023-02-17 2024-02-06 研磨方法及研磨裝置 TW202438231A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-023242 2023-02-17
JP2023023242 2023-02-17

Publications (1)

Publication Number Publication Date
TW202438231A true TW202438231A (zh) 2024-10-01

Family

ID=92421765

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113104592A TW202438231A (zh) 2023-02-17 2024-02-06 研磨方法及研磨裝置

Country Status (3)

Country Link
JP (1) JPWO2024171883A1 (https=)
TW (1) TW202438231A (https=)
WO (1) WO2024171883A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI908478B (zh) * 2024-11-20 2025-12-11 廣運機械工程股份有限公司 晶錠晶圓研磨系統

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001277084A (ja) * 2000-03-28 2001-10-09 Nippei Toyama Corp 両頭研削盤
JP5814111B2 (ja) * 2011-12-28 2015-11-17 Ntn株式会社 研削盤の測定異常機能付き加工径測定装置
JP6023598B2 (ja) * 2013-01-30 2016-11-09 コマツＮｔｃ株式会社 研削加工方法
JP2019155488A (ja) * 2018-03-07 2019-09-19 株式会社東京精密 研削盤

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI908478B (zh) * 2024-11-20 2025-12-11 廣運機械工程股份有限公司 晶錠晶圓研磨系統

Also Published As

Publication number Publication date
WO2024171883A1 (ja) 2024-08-22
JPWO2024171883A1 (https=) 2024-08-22

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