JPWO2024171883A1 - - Google Patents
Info
- Publication number
- JPWO2024171883A1 JPWO2024171883A1 JP2025501069A JP2025501069A JPWO2024171883A1 JP WO2024171883 A1 JPWO2024171883 A1 JP WO2024171883A1 JP 2025501069 A JP2025501069 A JP 2025501069A JP 2025501069 A JP2025501069 A JP 2025501069A JP WO2024171883 A1 JPWO2024171883 A1 JP WO2024171883A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023023242 | 2023-02-17 | ||
| PCT/JP2024/003849 WO2024171883A1 (ja) | 2023-02-17 | 2024-02-06 | 研削方法及び研削装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024171883A1 true JPWO2024171883A1 (https=) | 2024-08-22 |
| JPWO2024171883A5 JPWO2024171883A5 (https=) | 2025-10-27 |
Family
ID=92421765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025501069A Pending JPWO2024171883A1 (https=) | 2023-02-17 | 2024-02-06 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2024171883A1 (https=) |
| TW (1) | TW202438231A (https=) |
| WO (1) | WO2024171883A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI908478B (zh) * | 2024-11-20 | 2025-12-11 | 廣運機械工程股份有限公司 | 晶錠晶圓研磨系統 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001277084A (ja) * | 2000-03-28 | 2001-10-09 | Nippei Toyama Corp | 両頭研削盤 |
| JP5814111B2 (ja) * | 2011-12-28 | 2015-11-17 | Ntn株式会社 | 研削盤の測定異常機能付き加工径測定装置 |
| JP6023598B2 (ja) * | 2013-01-30 | 2016-11-09 | コマツＮｔｃ株式会社 | 研削加工方法 |
| JP2019155488A (ja) * | 2018-03-07 | 2019-09-19 | 株式会社東京精密 | 研削盤 |
-
2024
- 2024-02-06 JP JP2025501069A patent/JPWO2024171883A1/ja active Pending
- 2024-02-06 WO PCT/JP2024/003849 patent/WO2024171883A1/ja not_active Ceased
- 2024-02-06 TW TW113104592A patent/TW202438231A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024171883A1 (ja) | 2024-08-22 |
| TW202438231A (zh) | 2024-10-01 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250805 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250805 |