TW202437032A - 光阻去除用組成物及光阻之去除方法 - Google Patents

光阻去除用組成物及光阻之去除方法 Download PDF

Info

Publication number
TW202437032A
TW202437032A TW112148198A TW112148198A TW202437032A TW 202437032 A TW202437032 A TW 202437032A TW 112148198 A TW112148198 A TW 112148198A TW 112148198 A TW112148198 A TW 112148198A TW 202437032 A TW202437032 A TW 202437032A
Authority
TW
Taiwan
Prior art keywords
composition
photoresist
copper
mass
pattern
Prior art date
Application number
TW112148198A
Other languages
English (en)
Chinese (zh)
Inventor
黒澤伸也
杉本和志
曽根昌彌
玉井聡
宮下欣樹
Original Assignee
日商三菱瓦斯化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三菱瓦斯化學股份有限公司 filed Critical 日商三菱瓦斯化學股份有限公司
Publication of TW202437032A publication Critical patent/TW202437032A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Detergent Compositions (AREA)
TW112148198A 2022-12-12 2023-12-12 光阻去除用組成物及光阻之去除方法 TW202437032A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-198230 2022-12-12
JP2022198230 2022-12-12

Publications (1)

Publication Number Publication Date
TW202437032A true TW202437032A (zh) 2024-09-16

Family

ID=91485007

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112148198A TW202437032A (zh) 2022-12-12 2023-12-12 光阻去除用組成物及光阻之去除方法

Country Status (5)

Country Link
JP (1) JPWO2024128211A1 (https=)
KR (1) KR20250117429A (https=)
CN (1) CN120303619A (https=)
TW (1) TW202437032A (https=)
WO (1) WO2024128211A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7773670B1 (ja) 2024-06-21 2025-11-19 花王株式会社 基板の処理方法
JP7795674B1 (ja) * 2024-09-24 2026-01-07 花王株式会社 基板の処理方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5498768B2 (ja) * 2009-12-02 2014-05-21 東京応化工業株式会社 リソグラフィー用洗浄液及び配線形成方法
KR101089211B1 (ko) * 2010-12-02 2011-12-02 엘티씨 (주) 1차 알칸올 아민을 포함하는 ｌｃｄ 제조용 포토레지스트 박리액 조성물
WO2016076034A1 (ja) * 2014-11-13 2016-05-19 三菱瓦斯化学株式会社 半導体素子を洗浄するためのアルカリ土類金属を含む洗浄液、およびそれを用いた半導体素子の洗浄方法
JP6670100B2 (ja) * 2015-12-25 2020-03-18 花王株式会社 樹脂マスク剥離用洗浄剤組成物
CN112470079A (zh) 2018-07-27 2021-03-09 花王株式会社 清洗方法
CN113614648A (zh) * 2019-03-25 2021-11-05 松下知识产权经营株式会社 抗蚀剂剥离液

Also Published As

Publication number Publication date
WO2024128211A1 (ja) 2024-06-20
CN120303619A (zh) 2025-07-11
KR20250117429A (ko) 2025-08-04
JPWO2024128211A1 (https=) 2024-06-20

Similar Documents

Publication Publication Date Title
US6916772B2 (en) Sulfoxide pyrolid(in)one alkanolamine cleaner composition
JP5540031B2 (ja) ウェーハレベルパッケージングにおけるフォトレジストストリッピングと残渣除去のための組成物及び方法
JP2527268B2 (ja) レジスト用剥離剤組成物
TW202432817A (zh) 光阻去除用組成物及光阻之去除方法
WO2009023675A2 (en) Improved metal conservation with stripper solutions containing resorcinol
KR101420571B1 (ko) 드라이필름 레지스트 박리제 조성물 및 이를 이용한 드라이필름 레지스트의 제거방법
TW202437032A (zh) 光阻去除用組成物及光阻之去除方法
KR20180027638A (ko) 포토리소그래피에 사용되는 포토레지스트 세정 조성물 및 이로 기판을 처리하는 방법
KR20140045275A (ko) 두꺼운 필름 레지스트를 제거하기 위한 스트리핑 및 세정 조성물
TWI795433B (zh) 用於移除乾膜光阻的剝離組成物及使用所述組成物的剝離方法
TW202432816A (zh) 光阻去除用組成物及光阻之去除方法
TWI857112B (zh) 光阻除去用組成物
WO2020022491A1 (ja) 洗浄方法
KR20060064441A (ko) 비수성 비부식성 마이크로전자 세정 조성물
CA2605236A1 (en) Non-aqueous photoresist stripper that inhibits galvanic corrosion
CA2573788A1 (en) Non-aqueous microelectronic cleaning compositions containing fructose
JP3233379B2 (ja) レジスト用剥離液組成物
KR101341701B1 (ko) 레지스트 박리액 조성물 및 이를 이용한 레지스트의박리방법
JP4165209B2 (ja) レジスト剥離剤
TWI865549B (zh) 清潔方法、及清潔劑組合物之用途
KR20040088990A (ko) 포토레지스트 박리액 조성물
WO2020021721A1 (ja) 樹脂マスク剥離用洗浄剤組成物
CN121896052A (zh) 一种低腐蚀、易去除的光刻胶清洗剂及其制备方法与应用
TW202231863A (zh) 樹脂遮罩層剝離用洗淨劑組合物
KR20050087357A (ko) 포토레지스트 박리액 조성물