TW202422762A - 裝載端口安裝位置調整機構 - Google Patents

裝載端口安裝位置調整機構 Download PDF

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Publication number
TW202422762A
TW202422762A TW112126932A TW112126932A TW202422762A TW 202422762 A TW202422762 A TW 202422762A TW 112126932 A TW112126932 A TW 112126932A TW 112126932 A TW112126932 A TW 112126932A TW 202422762 A TW202422762 A TW 202422762A
Authority
TW
Taiwan
Prior art keywords
loading port
wall surface
axis direction
transfer chamber
aforementioned
Prior art date
Application number
TW112126932A
Other languages
English (en)
Chinese (zh)
Inventor
Tatsuya Miura
小木曽真平
石原裕揮
小川建
鈴木淳志
松本祐貴
Original Assignee
日商昕芙旎雅股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商昕芙旎雅股份有限公司 filed Critical 日商昕芙旎雅股份有限公司
Publication of TW202422762A publication Critical patent/TW202422762A/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3408—Docking arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW112126932A 2022-07-19 2023-07-19 裝載端口安裝位置調整機構 TW202422762A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-114694 2022-07-19
JP2022114694 2022-07-19

Publications (1)

Publication Number Publication Date
TW202422762A true TW202422762A (zh) 2024-06-01

Family

ID=89617690

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112126932A TW202422762A (zh) 2022-07-19 2023-07-19 裝載端口安裝位置調整機構

Country Status (6)

Country Link
US (1) US20260018447A1 (https=)
JP (1) JPWO2024018872A1 (https=)
KR (1) KR20250040629A (https=)
CN (1) CN119563230A (https=)
TW (1) TW202422762A (https=)
WO (1) WO2024018872A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5910019U (ja) 1982-07-12 1984-01-21 日産自動車株式会社 液面計測装置
JPS5988076U (ja) 1982-12-07 1984-06-14 三菱電機株式会社 乗客コンベヤの欄干装置
US6138721A (en) * 1997-09-03 2000-10-31 Asyst Technologies, Inc. Tilt and go load port interface alignment system
JP2000332079A (ja) * 1999-05-18 2000-11-30 Tdk Corp 半導体製造装置用ロードポート、ロードポート取り付け機構及びロードポート取り付け方法
TW461014B (en) * 2000-10-11 2001-10-21 Ind Tech Res Inst A positioning method and device for wafer loading devices
JP3871535B2 (ja) * 2001-09-17 2007-01-24 大日本スクリーン製造株式会社 ロードポート装置及びこの装置と上位装置との取り付け機構
US10541165B2 (en) * 2016-11-10 2020-01-21 Applied Materials, Inc. Systems, apparatus, and methods for an improved load port backplane

Also Published As

Publication number Publication date
US20260018447A1 (en) 2026-01-15
KR20250040629A (ko) 2025-03-24
WO2024018872A1 (ja) 2024-01-25
JPWO2024018872A1 (https=) 2024-01-25
CN119563230A (zh) 2025-03-04

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