JPWO2024018872A1 - - Google Patents
Info
- Publication number
- JPWO2024018872A1 JPWO2024018872A1 JP2024535000A JP2024535000A JPWO2024018872A1 JP WO2024018872 A1 JPWO2024018872 A1 JP WO2024018872A1 JP 2024535000 A JP2024535000 A JP 2024535000A JP 2024535000 A JP2024535000 A JP 2024535000A JP WO2024018872 A1 JPWO2024018872 A1 JP WO2024018872A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3408—Docking arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
- H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022114694 | 2022-07-19 | ||
| PCT/JP2023/024330 WO2024018872A1 (ja) | 2022-07-19 | 2023-06-30 | ロードポート取付位置調整機構 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024018872A1 true JPWO2024018872A1 (https=) | 2024-01-25 |
Family
ID=89617690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024535000A Pending JPWO2024018872A1 (https=) | 2022-07-19 | 2023-06-30 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20260018447A1 (https=) |
| JP (1) | JPWO2024018872A1 (https=) |
| KR (1) | KR20250040629A (https=) |
| CN (1) | CN119563230A (https=) |
| TW (1) | TW202422762A (https=) |
| WO (1) | WO2024018872A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5910019U (ja) | 1982-07-12 | 1984-01-21 | 日産自動車株式会社 | 液面計測装置 |
| JPS5988076U (ja) | 1982-12-07 | 1984-06-14 | 三菱電機株式会社 | 乗客コンベヤの欄干装置 |
| US6138721A (en) * | 1997-09-03 | 2000-10-31 | Asyst Technologies, Inc. | Tilt and go load port interface alignment system |
| JP2000332079A (ja) * | 1999-05-18 | 2000-11-30 | Tdk Corp | 半導体製造装置用ロードポート、ロードポート取り付け機構及びロードポート取り付け方法 |
| TW461014B (en) * | 2000-10-11 | 2001-10-21 | Ind Tech Res Inst | A positioning method and device for wafer loading devices |
| JP3871535B2 (ja) * | 2001-09-17 | 2007-01-24 | 大日本スクリーン製造株式会社 | ロードポート装置及びこの装置と上位装置との取り付け機構 |
| US10541165B2 (en) * | 2016-11-10 | 2020-01-21 | Applied Materials, Inc. | Systems, apparatus, and methods for an improved load port backplane |
-
2023
- 2023-06-30 KR KR1020257001402A patent/KR20250040629A/ko active Pending
- 2023-06-30 CN CN202380054204.0A patent/CN119563230A/zh active Pending
- 2023-06-30 JP JP2024535000A patent/JPWO2024018872A1/ja active Pending
- 2023-06-30 US US18/995,509 patent/US20260018447A1/en active Pending
- 2023-06-30 WO PCT/JP2023/024330 patent/WO2024018872A1/ja not_active Ceased
- 2023-07-19 TW TW112126932A patent/TW202422762A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202422762A (zh) | 2024-06-01 |
| US20260018447A1 (en) | 2026-01-15 |
| KR20250040629A (ko) | 2025-03-24 |
| WO2024018872A1 (ja) | 2024-01-25 |
| CN119563230A (zh) | 2025-03-04 |