TW202414745A - Electronic device - Google Patents

Abstract

An electronic device includes a body, a fan, a heatsink assembly, a first thermal tube, a first heat source, a thermal plate, a second thermal tube and a second heat source. The body includes a through hole, an outer surface, and an inner surface opposite to the outer surface. The through hole penetrates through the outer surface and the inner surface. The fan is disposed on the outer surface of the body and having an air outlet. The heatsink assembly is disposed in the air outlet corresponding to the through hole. An end of the first thermal tube is assembled on the heatsink assembly and located on the outer surface. The first heat source is disposed at a location corresponding to the other end of the first thermal tube. The thermal plate is disposed in the body corresponding to the through hole, and a side of the thermal plate is abutted against the heatsink assembly and the inner surface. An end of the second thermal tube is connected to the other side of the thermal plate. The second heat source is disposed a location corresponding to the other end of the second thermal tube.

Description

Electronic devices

This case relates to electronic devices, and in particular to an electronic device with a heat dissipation mechanism.

With the popularity of electronic devices, users have higher and higher requirements for electronic devices. Not only must they have diverse functions, but they must also have sufficient performance to operate smoothly. The heat energy generated during the operation of electronic devices is one of the important factors that directly affects the operating performance, so the importance of the heat dissipation mechanism of electronic devices can be seen.

However, as the number of internal parts of electronic devices increases, and general heat dissipation mechanisms require fans and heat sinks, how to simultaneously meet space utilization and heat dissipation requirements has become an extremely important issue.

The present case provides an electronic device, including a body, a fan, a heat sink fin assembly, a first heat pipe, a first heat source, a heat conductive plate, a second heat pipe and a second heat source. The body includes a through-hole, an opposite outer surface and an inner surface, and the through-hole penetrates the outer surface and the inner surface. The fan is disposed on the outer surface of the body, and the fan has an air outlet. The heat sink fin assembly is disposed at the air outlet and corresponds to the through-hole. One end of the first heat pipe is assembled in the heat sink fin assembly and is located on the outer surface side. The first heat source is disposed at a position corresponding to the other end of the first heat pipe. The heat conductive plate is disposed in the body and corresponds to the through-hole, and one side of the heat conductive plate abuts against the heat sink fin assembly and the inner surface. One end of the second heat pipe is connected to the other side of the heat conductive plate. The second heat source is disposed at a position corresponding to the other end of the second heat pipe.

Thereby, the electronic device only needs a single fan to dissipate heat from the first heat source and the second heat source at different positions, thereby improving space utilization.

In some embodiments, the first heat source and the second heat source are disposed in the body and are not coplanar.

In some embodiments, the body further includes a side wall, and the outer surface of the body includes a first part, a second part and a third part, the second part is angularly connected to the first part and the third part, the first part and the third part are not coplanar, the side wall connects the first part, the second part and the third part, a groove is defined between the second part, the third part and the side wall, and the fan is disposed in the groove.

In some embodiments, the first heat source, the second heat source and the second heat pipe are located between the side wall and the inner surface.

In some embodiments, the side wall includes a plurality of through holes, each of which is connected to the groove.

In some embodiments, the heat conducting plate includes a contact portion and abutting portion connected to each other, the contact portion passes through the through hole and abuts against the heat sink fin assembly, and the abutting portion abuts against the inner surface.

Some embodiments further include a waterproof ring, which is disposed on the inner surface and surrounds the through opening, the contact portion passes through the waterproof ring and abuts against the heat sink fin assembly, and one side of the abutting portion abuts against the waterproof ring.

In some embodiments, the waterproof ring protrudes from the inner surface.

In some embodiments, the heat sink fin assembly includes a plurality of heat sink fins, each heat sink fin has a first side, a second side, a third side and a fourth side, the first side is parallel to the second side, the third side is parallel to the fourth side, and the third side and the fourth side are respectively connected between the first side and the second side, the first side is adjacent to the fan, the first heat pipe is arranged on the third side, and the heat conductive plate is arranged on the fourth side.

In some embodiments, the heat sink fin assembly further includes an upper plate and a lower plate, the upper plate is perpendicular to each heat sink fin and disposed on the third side, the lower plate is perpendicular to each heat sink fin and disposed on the fourth side, the first heat pipe is connected to the upper plate, and the heat conducting plate is connected to the lower plate.

In some embodiments, the fourth side includes a first section, a second section and a third section, the first section is vertically connected to the first side, the third section is vertically connected to the second side, the second section is vertically connected to the first section and the third section, and the position of the first section corresponds to the position of the through hole.

In some embodiments, the lower plate includes a first lower plate and a second lower plate, the first lower plate is disposed in the first section, the second lower plate is disposed in the third section, and the heat conducting plate abuts against the first lower plate.

In some embodiments, the body further includes an expansion port disposed on the outer surface for expansion connection to another body.

The present case also provides an electronic device, including a body, a fan, a heat sink fin assembly, a first heat pipe, a first heat source, a second heat pipe and a second heat source. The fan is disposed in the body and has an air outlet. The heat sink fin assembly is disposed at the air outlet. One end of the first heat pipe is assembled on one side of the heat sink fin assembly. The first heat source is disposed in the body at a position corresponding to the other end of the first heat pipe. One end of the second heat pipe is connected to the other side of the heat sink fin assembly. The second heat source is disposed in the body at a position corresponding to the other end of the second heat pipe, and the second heat source is not coplanar with the first heat source.

In some embodiments, the machine body has a groove, and the fan and the heat sink fin assembly are disposed in the groove.

In some embodiments, the body has a through-hole, which passes through the groove and corresponds to the heat sink fin assembly.

In some embodiments, the first heat pipe is located on the outer surface of the body, and the second heat pipe is located on the inner surface of the body.

In some embodiments, the electronic device further includes a waterproof ring, which surrounds the through opening and is sandwiched between the inner surface of the body and the second heat pipe.

In some embodiments, a portion of the heat sink fin assembly passes through the waterproof ring and abuts against the second heat pipe.

In some embodiments, the body further includes a plurality of through holes, each of which is connected to the groove.

Thereby, the electronic device can dissipate heat from the first heat source and the second heat source that are not coplanar on the electronic device through a single fan, thereby reducing the space required for achieving the heat dissipation function and improving the space utilization rate of the electronic device.

Referring to Figures 1 to 3, Figure 1 is a three-dimensional appearance schematic diagram of an embodiment of the electronic device of the present invention. Here, Figure 1 is a three-dimensional diagram drawn according to the X direction, the Y direction and the Z direction. Figure 2 is a three-dimensional cross-sectional schematic diagram of an embodiment of the electronic device of the present invention; Figure 3 is a planar cross-sectional schematic diagram of an embodiment of the electronic device of the present invention. Here, Figure 3 is drawn according to the XZ plane direction defined by the X direction and the Z direction. In some embodiments, the electronic device can be a computer host or an expansion socket, but the present invention is not limited to this. The electronic device includes a body 10, a fan 20, a heat sink fin assembly 30, a first heat pipe 40, a first heat source 50, a second heat pipe 70 and a second heat source 80.

Referring to Figures 4 to 9, Figure 4 is a partial enlarged view of the circled area 4 in Figure 3; Figure 5 is a partial structural decomposition schematic diagram of an embodiment of the electronic device of the present invention; Figure 6 is a partial structural decomposition schematic diagram of another embodiment of the electronic device of the present invention; Figure 7 is a three-dimensional cross-sectional schematic diagram of an embodiment of the electronic device of the present invention; Figure 8 is a two-dimensional cross-sectional schematic diagram of an embodiment of the electronic device of the present invention. Here, Figure 8 is drawn according to the YZ plane direction defined by the Y direction and the Z direction. Figure 9 is a three-dimensional cross-sectional schematic diagram of an embodiment of the electronic device of the present invention. The fan 20 is disposed on the body 10 and has an air outlet 21 (as shown in Figure 9). The heat sink fin assembly 30 is disposed at the air outlet 21. One end of the first heat pipe 40 is assembled on one side of the heat sink fin assembly 30. The first heat source 50 is disposed in the body 10 at a position corresponding to the other end of the first heat pipe 40 (as shown in FIG. 7 ). One end of the second heat pipe 70 is connected to the other side of the heat sink fin assembly 30 (see FIG. 4 ). The second heat source 80 is disposed in the body 10 at a position corresponding to the other end of the second heat pipe 70 (see FIG. 7 ), and the second heat source 80 is not coplanar with the first heat source 50 (as shown in FIG. 8 ).

Thus, the electronic device can dissipate heat from the first heat source 50 and the second heat source 80 that are not coplanar on the electronic device through a single fan 20, thereby reducing the space required for achieving the heat dissipation function and improving the space utilization of the electronic device.

Referring to FIGS. 3 to 5 , in some embodiments, the body 10 is a hollow frame structure and has an outer surface 11, an inner surface 12, and a through hole 13 penetrating the outer surface 11 and the inner surface 12. In these embodiments, the range surrounded by the inner surface 12 defines an internal accommodation space for accommodating the first heat source 50 and the second heat source 80, and the fan 20 is disposed on the outer surface 11 of the body 10.

Referring to FIG. 3 to FIG. 7 and FIG. 9 , in these embodiments, the position of the heat sink fin assembly 30 corresponds to the through-hole 13, so that one side of the heat sink fin assembly 30 is exposed on the outer surface 11, and the other side corresponds to the position of the through-hole 13. Thus, one end of the first heat pipe 40 can be assembled on the side of the heat sink fin assembly 30 exposed on the outer surface 11, and one end of the second heat pipe 70 can correspond to the other side of the heat sink fin assembly 30. In this way, the first heat pipe 40 can extend to the outer surface 11 of the body 10, and the first heat source 50 can be set at a position close to the outer surface 11 of the body 10, the second heat pipe 70 can extend to the internal space of the body 10, and the second heat source 80 can also be set in the internal space of the body 10, thereby meeting different requirements for the installation positions of the first heat source 50 and the second heat source 80.

Referring to FIGS. 3 to 6 , in order to ensure the waterproofness of the inner space of the housing 10, these embodiments further include a heat conducting plate 60, and the housing 10 further includes a side wall 15. The side wall 15 is arranged along the contours of the outer surface 11 and the inner surface 12 and defines an inner space with the inner surface 12. The heat conducting plate 60 is arranged in the housing 10 and corresponds to the position of the through-hole 13, and one side of the heat conducting plate 60 abuts against the other side of the heat sink fin assembly 30 and the inner surface 12. Thus, the through-hole 13 is closed by the heat conducting plate 60 to ensure the waterproofness of the inner space of the housing 10.

Referring to FIG. 6 , in another embodiment, the heat conducting plate 60 is a planar structure, and the heat conducting plate 60 seals the through opening 13 in a planar butt-jointed manner, but the present invention is not limited thereto.

4 and 5 , the structure of the heat conducting plate 60 is not limited to the planar structure of the aforementioned embodiments. In some embodiments, the heat conducting plate 60 includes a contact portion 61 and abutting portion 62 connected to each other. The contact portion 61 passes through the through hole 13 and abuts against the other side of the heat sink fin assembly 30, and the abutting portion 62 abuts against the inner surface 12 of the body 10 with one side.

One end of the second heat pipe 70 can be connected to the other side of the abutting portion 62 (as shown in FIG. 4 ), and the second heat source 80 is disposed at a position corresponding to the other end of the second heat pipe 70 (as shown in FIG. 3 ). Both the second heat pipe 70 and the second heat source 80 can be disposed in the waterproof internal space of the body 10. Furthermore, although the first heat pipe 40 extends to the outer surface 11 of the body 10, the first heat source 50 can still be disposed in the internal space formed by the side wall 15 and the inner surface 12. By disposing the first heat source 50 in the internal space close to the outer surface 11, the first heat pipe 40 can indirectly contact the first heat source 50 through the outer surface 11, thereby ensuring that the first heat source 50 is located in the waterproof internal space and can still be subjected to heat conduction by the first heat pipe 40 to achieve a heat dissipation effect.

Referring to FIG. 4 and FIG. 5 , in some embodiments, the outer shape of the contact portion 61 of the heat conducting plate 60 corresponds to the shape of the through hole 13, and the outer contour of the abutting portion 62 is larger than the outer contour of the contact portion 61, so that the entire side of the heat conducting plate 60 becomes a "convex" shape. In these embodiments, the contact portion 61 of the heat conducting plate 60 passes through the through hole 13 and abuts against the heat sink fin assembly 30 to ensure heat transfer, while the abutting portion 62 can abut against the inner surface 12 of the body 10 and cover the through hole 13, so that the through hole 13 can be closed by the heat conducting plate 60, reducing the moisture or dust on the outside of the body 10 from entering the inside of the body 10 through the through hole 13, ensuring the waterproof and dustproof properties of the through hole 13.

Referring to FIG. 4 and FIG. 5 , in some embodiments, in order to further improve the waterproofness of the internal space of the electronic device, the electronic device further includes a waterproof ring 63. In these embodiments, the waterproof ring 63 is made of a flexible material (for example, but not limited to silicone or rubber), and the waterproof ring 63 is sleeved on the contact portion 61 of the heat conducting plate 60. Thereby, the waterproof ring 63 can be closely attached to the contact portion 61. When the heat conducting plate 60 passes through the through opening 13 with the contact portion 61, the waterproof ring 63 surrounds the through opening 13, so that the waterproof ring 63 is sandwiched between the abutting portion 62 of the heat conducting plate 60 and the inner surface 12 of the body 10. Through the flexibility of the waterproof ring 63, the heat conducting plate 60 can be more closely assembled on the body 10, and the waterproofness is further improved.

Referring to FIG. 7 and FIG. 9 , in some embodiments, in order to ensure the flatness of the outer surface 11 of the electronic device after the fan 20 is installed, so as to facilitate the expansion and use or storage of the electronic device, the outer surface 11 of the electronic device is provided with a groove 14 to accommodate the fan 20. In these embodiments, the outer surface 11 of the body 10 includes a first portion 111, a second portion 112, and a third portion 113. The two ends of the second portion 112 are respectively connected to the first portion 111 and the third portion 113 at an angle, and the first portion 111 and the third portion 113 are not coplanar, and the side wall 15 is connected to the first portion 111, the second portion 112, and the third portion 113 at the same time. In this way, the second portion 112, the third portion 113 and the side wall 15 jointly define a groove 14, and the fan 20 and the heat sink fin assembly 30 are arranged in the groove 14. In addition, the through opening 13 is disposed through the third portion 113 , so that the air outlet 21 of the fan 20 accommodated in the groove 14 can be located corresponding to the heat dissipation fin assembly 30 disposed in the through opening 13 .

In some embodiments, to ensure the operation of the fan 20, a through hole 151 connected to the groove 14 is provided at a position of the side wall 15 corresponding to the groove 14. In these embodiments, the through hole 151 includes a plurality of first through holes 151a and a plurality of second through holes 151b, and the fan 20 can inhale air through the first through holes 151a to generate cooling airflow, as shown in Figures 1, 2, and 9. In addition, the fan 20 discharges the heat dissipation airflow through the second through holes 151b via the air outlet 21, as shown in Figures 1, 7, and 9.

Referring to FIGS. 9 to 13 , FIG. 10 is a schematic planar cross-sectional view of an embodiment of the electronic device of the present invention. Here, FIG. 10 is drawn according to the YZ plane direction defined by the Y direction and the Z direction. FIG. 11 is a partial enlarged view of the circled portion 11 in FIG. 10 ; and FIG. 12 is a partial enlarged view of the circled portion 12 in FIG. 11 . In some embodiments, the heat sink fin assembly 30 includes a plurality of heat sink fins 31 that are parallel to each other and spaced apart to form a whole (as shown in FIG. 9 ). Each heat sink fin 31 of the heat sink fin assembly 30 has a first side 311, a second side 312, a third side 313, and a fourth side 314, respectively. The first side 311 and the second side 312 are parallel to each other, the third side 313 and the fourth side 314 are parallel to each other, and the third side 313 and the fourth side 314 are respectively connected between the first side 311 and the second side 312 (see FIG. 12 ). In these embodiments, an air channel is formed between two adjacent heat sink fins 31 , and the first side 311 and the second side 312 of each heat sink fin 31 are two ends of the air channel. Therefore, the heat sink fin assembly 30 is adjacent to the fan 20 at the first side 311 , the first heat pipe 40 is arranged on the third side 313 , and the heat conducting plate 60 is arranged on the fourth side 314 . Here, the second through hole 151b is disposed on the side wall 15 of the housing 10 at a position corresponding to the second side 312 of each heat sink fin 31 for exhausting the gas flowing through the gas channel of the heat sink fin assembly 30 (as shown in FIGS. 9 and 12 ).

Referring to FIG. 12 , in some embodiments, in order to ensure that the gas discharged from the air outlet 21 of the fan 20 can actually flow through the gas channel between the heat sink fins 31 to actually achieve the heat dissipation effect, the heat sink fin assembly 30 further includes an upper plate 32 and a lower plate 33. The upper plate 32 is perpendicular to each heat sink fin 31 and disposed on the third side 313 of each heat sink fin 31, and the lower plate 33 is perpendicular to each heat sink fin 31 and disposed on the fourth side 314 of each heat sink fin 31. Thereby, it is ensured that the gas exhausted from the air outlet 21 of the fan 20 can completely enter the gas channel and contact each heat sink fin 31 to provide the best heat dissipation effect. In addition, the first heat pipe 40 can also be connected to the upper plate 32, and the heat conducting plate 60 is connected to the lower plate 33. In addition to improving the stability of the first heat pipe 40 and the heat conducting plate 60 assembled in the heat sink fin group 30, the upper plate 32 and the lower plate 33 can increase the area of the first heat pipe 40 and the heat conducting plate 60 contacting the heat sink fin group 30, thereby improving the heat dissipation effect.

12 , in some embodiments, the fourth side 314 of each heat sink fin 31 includes a first section 3141, a second section 3142, and a third section 3143. The first section 3141 is vertically connected to the first side 311, the third section 3143 is vertically connected to the second side 312, the second section 3142 is vertically connected to the first section 3141 and the third section 3143, and the position of the first section 3141 corresponds to the position of the through hole 13. In this way, the fourth side 314 of each heat sink fin 31 of the heat sink fin assembly 30 only needs to be provided with the first section 3141 so that the heat conductive plate 60 inserted into the through opening 13 can abut against it to achieve the heat dissipation effect, and the second section 3142 and the third section 3143 connected to the first section 3141 can extend the length of each heat sink fin 31, increase the area of the heat sink fin 31 contacted by the gas exhausted by the fan 20, and improve the heat dissipation efficiency.

Referring to FIG. 12 , in some embodiments, the first section 3141, the second section 3142, and the third section 3143 of the fourth side 314 of each heat sink fin 31 are not coplanar. In these embodiments, the third section 3143 is closer to the third side 313 than the first section 3141, thereby making the fourth side 314 of each heat sink fin 31 a step-shaped structure with a height difference. In these embodiments, the lower plate 33 includes a first lower plate 331 and a second lower plate 332, the first lower plate 331 is disposed at the first section 3141 of the fourth side 314, the second lower plate 332 is disposed at the third section 3143 of the fourth side 314, and the contact portion 61 of the heat conducting plate 60 abuts against the first lower plate 331. Thus, since the second lower plate 332 is disposed at the third section 3143 closer to the third side 313 than the first section 3141, a gap is generated between the second lower plate 332 and the adjacent outer surface 11 of the body 10, which can provide an escape space for fixing parts (such as screws) locked on the outer surface 11, thereby improving space utilization.

13 , in another embodiment where the heat conducting plate 60 is a planar structure, a portion of the heat dissipating fin 31 of the heat dissipating fin assembly 30 (e.g., the first section 3141 of the fourth side 314 ) passes through the through hole 13 and abuts against the heat conducting plate 60 to conduct heat and ensure the waterproof and dustproof properties of the through hole 13 .

Referring to FIG. 14 , in another embodiment, a portion of the heat sink fin 31a of the heat sink fin assembly 30a (e.g., the first section 3141 of the fourth side 314) passes through the through hole 13 and abuts against the second heat pipe 70a to conduct heat. The waterproof ring 63a surrounds the through hole 13 and a portion of the heat sink fin 31a, and the waterproof ring 63a is sandwiched between the inner surface 12 of the housing 10 and the second heat pipe 70a to ensure the waterproof and dustproof properties of the through hole 13.

Referring to FIG. 15 , in some embodiments where the electronic device is a docking station, the body 10 of the electronic device may include a first body 10A and a second body 10B. In these embodiments, the first body 10A further includes an expansion port 16 disposed on the outer surface 11 for overlapping and expanding connection with the second body 10B, thereby increasing usage diversity.

In addition, the first heat source 50 and the second heat source 80 are electronic components in the electronic device that generate heat due to operation, such as but not limited to communication modules (such as 4G/5G communication modules), memory, graphics card, CPU, GPU, battery or hard disk.

Although the present disclosure has been disclosed as above with some embodiments, it is not intended to limit the present disclosure. Anyone with ordinary knowledge in the relevant technical field may make some changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the scope of patent protection of this case shall be subject to the scope of the patent application attached to this specification.

10: Body 10A: First body 10B: Second body 11: Outer surface 111: First part 112: Second part 113: Third part 12: Inner surface 13: Through hole 14: Groove 15: Side wall 151: Through hole 151a: First through hole 151b: Second through hole 16: Expansion port 20: Fan 21: Air outlet 30, 30a: Heat sink fin assembly 31, 31a: Heat sink fin 311: First side 312: Second side 313: Third side 314: Fourth side 3141: First section 3142: Second section 3143: Third section 32: Upper panel 33: lower plate 331: first lower plate 332: second lower plate 40: first heat pipe 50: first heat source 60: heat conducting plate 61: contact part 62: abutment part 63, 63a: waterproof ring 70, 70a: second heat pipe 80: second heat source X, Y, Z: directions

[Figure 1] is a three-dimensional schematic diagram of the appearance of an embodiment of the electronic device of the present invention. [Figure 2] is a three-dimensional schematic diagram of a cross-sectional view of an embodiment of the electronic device of the present invention. [Figure 3] is a planar schematic diagram of a cross-sectional view of an embodiment of the electronic device of the present invention. [Figure 4] is a partial enlarged view of the circled area 4 in Figure 3. [Figure 5] is a partial structural decomposition schematic diagram of an embodiment of the electronic device of the present invention. [Figure 6] is a partial structural decomposition schematic diagram of another embodiment of the electronic device of the present invention. [Figure 7] is a three-dimensional schematic diagram of a cross-sectional view of an embodiment of the electronic device of the present invention. [Figure 8] is a planar schematic diagram of a cross-sectional view of an embodiment of the electronic device of the present invention. [Figure 9] is a three-dimensional schematic diagram of a cross-sectional view of an embodiment of the electronic device of the present invention. [Figure 10] is a planar schematic diagram of a cross-sectional view of an embodiment of the electronic device of the present invention. [Figure 11] is a partial enlarged view of the circled portion 11 in Figure 10. [Figure 12] is a partial enlarged view of the circled portion 12 in Figure 11. [Figure 13] is a schematic diagram of another implementation of the circled portion 12 in Figure 11. [Figure 14] is a schematic diagram of yet another implementation of the circled portion 12 in Figure 11. [Figure 15] is a schematic diagram of the body of the electronic device of this case being extended and connected to another body.

10: Body

11: External surface

111: Part 1

112: Part 2

113: Part 3

14: Groove

15: Side wall

151:Through hole

151a: first through hole

151b: Second through hole

16: Expansion port

20: Fan

40: First heat pipe

50: First heat source

70: Second heat pipe

80: Second heat source

X, Y, Z: direction

Claims (20)

An electronic device includes: A body including a through hole, an outer surface and an inner surface opposite to each other, wherein the through hole penetrates the outer surface and the inner surface; A fan disposed on the outer surface of the body, the fan having an air outlet; A heat sink fin assembly disposed at the air outlet and corresponding to the through hole; A first heat pipe, one end of which is assembled in the heat sink fin assembly and located on the side of the outer surface; A first heat source disposed at a position corresponding to the other end of the first heat pipe; A heat conducting plate disposed in the body and corresponding to the through hole, and one side of the heat conducting plate abuts against the heat sink fin assembly and the inner surface; A second heat pipe, one end of which is connected to the other side of the heat conducting plate; and A second heat source disposed at a position corresponding to the other end of the second heat pipe. An electronic device as described in claim 1, wherein the first heat source and the second heat source are disposed in the body and are not coplanar. An electronic device as described in claim 1, wherein the body further includes a side wall, and the outer surface of the body includes a first part, a second part and a third part, the second part is angularly connected to the first part and the third part, the first part and the third part are not coplanar, the side wall connects the first part, the second part and the third part, a groove is defined between the second part, the third part and the side wall, and the fan is disposed in the groove. An electronic device as described in claim 3, wherein the first heat source, the second heat source and the second heat pipe are located between the side wall and the inner surface. An electronic device as described in claim 3, wherein the side wall includes a plurality of through holes, each of which is connected to the groove. An electronic device as described in claim 1, wherein the heat conductive plate includes a contact portion and a supporting portion connected to each other, the contact portion passes through the through hole and abuts against the heat sink fin assembly, and the supporting portion abuts against the inner surface. The electronic device as described in claim 6 further includes a waterproof ring, which is arranged on the inner surface and surrounds the through hole, the contact portion passes through the waterproof ring and abuts against the heat sink fin assembly, and the side of the abutting portion abuts against the waterproof ring. An electronic device as described in claim 7, wherein the waterproof ring protrudes from the inner surface. An electronic device as described in claim 8, wherein the heat sink fin assembly includes a plurality of heat sink fins, each of the plurality of heat sink fins has a first side, a second side, a third side and a fourth side, the first side is parallel to the second side, the third side is parallel to the fourth side, and the third side and the fourth side are respectively connected between the first side and the second side, the first side is adjacent to the fan, the first heat pipe is arranged on the third side, and the heat conductive plate is arranged on the fourth side. An electronic device as described in claim 9, wherein the heat sink fin assembly further includes an upper plate and a lower plate, the upper plate is perpendicular to each of the heat sink fins and disposed on the third side, the lower plate is perpendicular to each of the heat sink fins and disposed on the fourth side, the first heat pipe is connected to the upper plate, and the heat conductive plate is connected to the lower plate. An electronic device as described in claim 9, wherein the fourth side includes a first section, a second section and a third section, the first section is vertically connected to the first side, the third section is vertically connected to the second side, the second section is vertically connected to the first section and the third section, and the position of the first section corresponds to the position of the through hole. An electronic device as described in claim 10, wherein the lower panel comprises a first lower panel and a second lower panel, the first lower panel is disposed in the first section, the second lower panel is disposed in the third section, and the heat conductive plate abuts against the first lower panel. An electronic device as described in claim 1, wherein the body further includes an expansion port disposed on the outer surface for expanding connection to another body. An electronic device includes: a body; a fan disposed on the body, the fan having an air outlet; a heat sink fin assembly disposed on the air outlet; a first heat pipe, one end of which is assembled on one side of the heat sink fin assembly; a first heat source disposed in the body at a position corresponding to the other end of the first heat pipe; a second heat pipe, one end of which is connected to the other side of the heat sink fin assembly; and a second heat source disposed in the body at a position corresponding to the other end of the second heat pipe, and the second heat source is not coplanar with the first heat source. An electronic device as described in claim 14, wherein the body has a groove, and the fan and the heat sink fin assembly are disposed in the groove. An electronic device as described in claim 15, wherein the body has a through-hole that passes through the groove and corresponds to the heat sink fin assembly. An electronic device as described in claim 16, wherein the first heat pipe is located on an outer surface of the body, and the second heat pipe is located on an inner surface of the body. The electronic device as described in claim 17 further includes a waterproof ring, which surrounds the through-hole and is sandwiched between the inner surface of the body and the second heat pipe. An electronic device as described in claim 18, wherein a portion of the heat sink fin assembly passes through the waterproof ring and abuts against the second heat pipe. An electronic device as described in claim 15, wherein the body further includes a plurality of through holes, each of which is connected to the groove.