CN116634725A - Electronic device - Google Patents

Electronic device Download PDF

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Publication number
CN116634725A
CN116634725A CN202211138206.1A CN202211138206A CN116634725A CN 116634725 A CN116634725 A CN 116634725A CN 202211138206 A CN202211138206 A CN 202211138206A CN 116634725 A CN116634725 A CN 116634725A
Authority
CN
China
Prior art keywords
heat
electronic device
heat pipe
hole
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202211138206.1A
Other languages
Chinese (zh)
Inventor
杨瑞霖
徐万琳
周鑫池
李坤政
张瑞祺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Getac Technology Corp
Original Assignee
Getac Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Getac Technology Corp filed Critical Getac Technology Corp
Priority to US17/981,342 priority Critical patent/US20230262923A1/en
Priority to EP22209288.4A priority patent/EP4227764A1/en
Priority to AU2022279481A priority patent/AU2022279481A1/en
Publication of CN116634725A publication Critical patent/CN116634725A/en
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1615—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function
    • G06F1/1616—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/02—Input arrangements using manually operated switches, e.g. using keyboards or dials
    • G06F3/0202—Constructional details or processes of manufacture of the input device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Mathematical Physics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

The electronic device comprises a machine body, a fan, a heat radiation fin group, a first heat pipe, a first heat source, a heat conducting plate, a second heat pipe and a second heat source. The machine body comprises a through hole, an opposite outer surface and an inner surface, wherein the through hole penetrates through the outer surface and the inner surface. The fan is arranged on the outer surface of the machine body and is provided with an air outlet. The heat radiation fin group is arranged at the air outlet and corresponds to the through hole. One end of the first heat pipe is arranged on the radiating fin group and positioned on the outer surface side. The first heat source is arranged at a position corresponding to the other end of the first heat pipe. The heat conducting plate is arranged in the machine body and corresponds to the through hole, and one side of the heat conducting plate is abutted against the radiating fin group and the inner surface. One end of the second heat pipe is connected to the other side of the heat conducting plate. The second heat source is arranged at a position corresponding to the other end of the second heat pipe.

Description

Electronic device
Technical Field
The present disclosure relates to electronic devices, and more particularly, to an electronic device with a heat dissipation mechanism.
Background
With the popularization of electronic devices, users have increasingly high demands for electronic devices, which not only have diversified functions, but also have to have sufficient performance to operate smoothly. The heat energy generated during the operation of the electronic device is one of the important factors directly affecting the operation performance, so that a spot is visible on the importance of the heat dissipation mechanism of the electronic device.
However, as the number of internal parts of the electronic device increases, and a fan and a heat dissipation fin are required to be disposed in a general heat dissipation mechanism, how to satisfy the space utilization and the heat dissipation requirement is an important issue.
Disclosure of Invention
The electronic device comprises a machine body, a fan, a heat radiation fin group, a first heat pipe, a first heat source, a heat conducting plate, a second heat pipe and a second heat source. The machine body comprises a through hole, an opposite outer surface and an inner surface, wherein the through hole penetrates through the outer surface and the inner surface. The fan is arranged on the outer surface of the machine body and is provided with an air outlet. The heat radiation fin group is arranged at the air outlet and corresponds to the through hole. One end of the first heat pipe is arranged on the radiating fin group and positioned on the outer surface side. The first heat source is arranged at a position corresponding to the other end of the first heat pipe. The heat conducting plate is arranged in the machine body and corresponds to the through hole, and one side of the heat conducting plate is abutted against the radiating fin group and the inner surface. One end of the second heat pipe is connected to the other side of the heat conducting plate. The second heat source is arranged at a position corresponding to the other end of the second heat pipe.
Therefore, the electronic device can radiate the first heat source and the second heat source at different positions only by a single fan, and the space utilization rate is improved.
In some embodiments, the first heat source and the second heat source are disposed in the body and are not coplanar.
In some embodiments, the housing further comprises a sidewall, the outer surface of the housing comprises a first portion, a second portion and a third portion, the second portion is connected to the first portion and the third portion at an angle, the first portion is not coplanar with the third portion, the sidewall is connected to the first portion, the second portion and the third portion, a groove is defined between the second portion, the third portion and the sidewall, and the fan is disposed in the groove.
In some embodiments, the first heat source, the second heat source, and the second heat pipe are located between the sidewall and the inner surface.
In some embodiments, the sidewall includes a plurality of through holes, each through hole communicating with the recess.
In some embodiments, the heat conducting plate includes a contact portion and an abutting portion, the contact portion abuts against the heat dissipating fin set through the through hole, and the abutting portion abuts against the inner surface.
In some embodiments, the heat dissipation device further comprises a waterproof ring, the waterproof ring is disposed on the inner surface and surrounds the through hole, the contact portion passes through the waterproof ring to be abutted to the heat dissipation fin group, and one side of the abutting portion is abutted to the waterproof ring.
In some embodiments, the waterproof ring protrudes from the inner surface.
In some embodiments, the heat dissipation fin set includes a plurality of heat dissipation fins, each of the heat dissipation fins has a first side, a second side, a third side and a fourth side, the first side is parallel to and opposite to the second side, the third side is parallel to and opposite to the fourth side, the third side and the fourth side are respectively connected between the first side and the second side, the first side is adjacent to the fan, the first heat pipe set is disposed on the third side, and the heat conductive plate set is disposed on the fourth side.
In some embodiments, the heat dissipation fin set further includes an upper plate perpendicular to each heat dissipation fin and disposed on the third side, and a lower plate perpendicular to each heat dissipation fin and disposed on the fourth side, the first heat pipe is connected to the upper plate, and the heat conducting plate is connected to the lower plate.
In some embodiments, the fourth side comprises a first section, a second section and a third section, the first section is vertically connected to the first side, the third section is vertically connected to the second side, the second section is vertically connected to the first section and the third section, and the position of the first section corresponds to the position of the through hole.
In some embodiments, the lower plate includes a first lower plate and a second lower plate, the first lower plate is disposed on the first section, the second lower plate is disposed on the third section, and the heat-conducting plate is abutted to the first lower plate.
In some embodiments, the body further comprises an expansion port disposed on the outer surface for expanding and connecting with another body.
The present disclosure further provides an electronic device, which includes a body, a fan, a heat dissipation fin set, a first heat pipe, a first heat source, a second heat pipe, and a second heat source. The fan is arranged on the machine body and provided with an air outlet. The heat radiation fin group is arranged at the air outlet. One end of the first heat pipe is arranged at one side of the radiating fin group. The first heat source is arranged in the machine body at a position corresponding to the other end of the first heat pipe. One end of the second heat pipe is connected to the other side of the heat radiation fin group. The second heat source is arranged in the machine body at a position corresponding to the other end of the second heat pipe, and the second heat source and the first heat source are not coplanar.
In some embodiments, the body has a groove, and the fan and the heat dissipation fin set are disposed in the groove.
In some embodiments, the body has a through hole, and the through hole penetrates through the groove and corresponds to the heat dissipation fin group.
In some embodiments, the first heat pipe is located on an outer surface of the body and the second heat pipe is located on an inner surface of the body.
In some embodiments, the electronic device further includes a waterproof ring, the waterproof ring surrounds the through hole, and the waterproof ring is sandwiched between the inner surface of the body and the second heat pipe.
In some embodiments, a portion of the fin group is abutted to the second heat pipe through the waterproof ring.
In some embodiments, the body further comprises a plurality of through holes, each through hole communicating with the recess.
Therefore, the electronic device can radiate the first heat source and the second heat source which are not coplanar on the electronic device through the single fan, so that the space required by the radiating function is reduced, and the space utilization rate of the electronic device is improved.
The invention will now be described in more detail with reference to the drawings and specific examples, which are not intended to limit the invention thereto.
Drawings
Fig. 1 is a schematic perspective view of an embodiment of an electronic device.
Fig. 2 is a schematic perspective cross-sectional view of an embodiment of the electronic device.
Fig. 3 is a schematic plan sectional view of an embodiment of the electronic device.
Fig. 4 is a partial enlarged view of the circled portion 4 in fig. 3.
Fig. 5 is a partially exploded view of an embodiment of the electronic device.
Fig. 6 is a partially exploded view of another embodiment of the electronic device.
Fig. 7 is a schematic perspective view of an embodiment of an electronic device.
Fig. 8 is a schematic plan view of an embodiment of an electronic device.
Fig. 9 is a schematic perspective cross-sectional view of an embodiment of the electronic device.
Fig. 10 is a schematic plan sectional view of an embodiment of the electronic device.
Fig. 11 is a partial enlarged view of the circled portion 11 in fig. 10.
Fig. 12 is an enlarged view of a portion of the encircled portion 12 of fig. 11.
Fig. 13 is a schematic view of another embodiment of the encircled portion 12 in fig. 11.
Fig. 14 is a schematic view of still another embodiment of the encircled portion 12 in fig. 11.
Fig. 15 is a schematic diagram of a body expansion connection of the electronic device of the present disclosure with another body.
Wherein reference numerals are used to refer to
10 body part
10A first body
10B second body
11 outer surface
111 first part
112 second part
113 third part
12 inner surface
13, wearing mouth
14 groove
15 side wall
151 through holes
151a first through hole
151b second through hole
16 expansion port
20 fan
21 air outlet
30. 30a radiating fin group
31. 31a radiating fin
311 first side
312 second side
313 third side
314 fourth side
3141 first section
3142 second section
3143 third section
32 upper plate
33 lower plate
331 first lower plate
332 second lower plate
40 first heat pipe
50 first heat source
60 heat conducting plate
61 contact portion
62 abutting part
63. 63a waterproof ring
70. 70a second heat pipe
80 second heat source
X, Y, Z direction of
Detailed Description
The structural and operational principles of the present invention are described in detail below with reference to the accompanying drawings:
referring to fig. 1 to 3, fig. 1 is a schematic perspective view of an embodiment of an electronic device. Here, fig. 1 is a perspective view of the X-direction, Y-direction, and Z-direction. FIG. 2 is a schematic perspective cross-sectional view of an embodiment of an electronic device; fig. 3 is a schematic plan sectional view of an embodiment of the electronic device. Here, fig. 3 is a drawing illustrating an XZ plane direction defined by an X direction and a Z direction. In some embodiments, the electronic device may be a host computer or a docking station, but the present invention is not limited thereto. The electronic device includes a body 10, a fan 20, a heat sink assembly 30, a first heat pipe 40, a first heat source 50, a second heat pipe 70, and a second heat source 80.
Referring to fig. 4 to 9, fig. 4 is a partially enlarged view of the circled portion 4 in fig. 3; FIG. 5 is a partially exploded view of an embodiment of an electronic device; FIG. 6 is a partially exploded view of another embodiment of an electronic device; FIG. 7 is a schematic diagram showing a second perspective cross-section of an embodiment of an electronic device; fig. 8 is a schematic plan view of an embodiment of an electronic device. Here, fig. 8 is a view of the YZ plane direction defined by the Y direction and the Z direction. Fig. 9 is a schematic perspective cross-sectional view of an embodiment of the electronic device. The fan 20 is disposed on the machine body 10 and has an air outlet 21 (shown in fig. 9). The heat dissipation fin set 30 is disposed at the air outlet 21. One end of the first heat pipe 40 is disposed at one side of the fin group 30. The first heat source 50 is disposed in the machine body 10 at a position corresponding to the other end of the first heat pipe 40 (as shown in fig. 7). One end of the second heat pipe 70 is connected to the other side of the fin group 30 (see fig. 4). The second heat source 80 is disposed in the machine body 10 at a position corresponding to the other end of the second heat pipe 70 (see fig. 7), and the second heat source 80 is not coplanar with the first heat source 50 (as shown in fig. 8).
Therefore, the electronic device can radiate the first heat source 50 and the second heat source 80 which are not coplanar on the electronic device through the single fan 20, so that the space required by the radiating function is reduced, and the space utilization rate of the electronic device is improved.
Referring to fig. 3-5, in some embodiments, the body 10 is a hollow frame structure and has opposite outer and inner surfaces 11, 12 and a through opening 13 extending through the outer and inner surfaces 11, 12. In these embodiments, the inner surface 12 surrounds a region defining an internal accommodating space for accommodating the first heat source 50 and the second heat source 80, and the fan 20 is disposed on the outer surface 11 of the machine body 10.
Referring to fig. 3 to 7 in conjunction with fig. 9, in these embodiments, the positions of the fin sets 30 correspond to the through holes 13, so that one side of the fin sets 30 is exposed to the outer surface 11, and the opposite side corresponds to the positions of the through holes 13. Thus, one end of the first heat pipe 40 can be assembled on one side of the heat dissipation fin set 30 exposed on the outer surface 11, and one end of the second heat pipe 70 can correspond to the other side of the heat dissipation fin set 30. In this way, the first heat pipe 40 can be extended to the outer surface 11 of the machine body 10, the first heat source 50 can be disposed at a position close to the outer surface 11 of the machine body 10, the second heat pipe 70 can be extended to the inner space of the machine body 10, and the second heat source 80 can be disposed in the inner space of the machine body 10, so as to meet different requirements of the positions of the first heat source 50 and the second heat source 80.
Referring to fig. 3 to 6, in order to ensure the waterproof performance of the internal space of the machine body 10, in these embodiments, the machine body 10 further includes a heat-conducting plate 60, and the side wall 15. The side walls 15 follow the contours of the outer surface 11 and the inner surface 12 and define an interior space with the inner surface 12. The heat conducting plate 60 is disposed in the machine body 10 and corresponds to the position of the through hole 13, and one side of the heat conducting plate 60 abuts against the other side of the heat dissipating fin set 30 and the inner surface 12. Thereby, the through hole 13 is closed by providing the heat conductive plate 60 to secure the water-proof property of the inner space of the body 10.
Referring to fig. 6, in another embodiment, the heat conducting plate 60 has a planar structure, and the heat conducting plate 60 seals the through hole 13 in a planar butt joint manner, but the present invention is not limited thereto.
Referring to fig. 4 and 5, the structure of the heat conducting plate 60 is not limited to the planar structure of the foregoing embodiment, in some embodiments, the heat conducting plate 60 includes a contact portion 61 and an abutting portion 62, the contact portion 61 abuts against the other side of the fin set 30 through the through hole 13, and the abutting portion 62 abuts against the inner surface 12 of the machine body 10 at one side.
One end of the second heat pipe 70 may be connected to the other side of the abutting portion 62 (as shown in fig. 4), and the second heat source 80 is disposed at a position corresponding to the other end of the second heat pipe 70 (as shown in fig. 3), and both the second heat pipe 70 and the second heat source 80 may be disposed in the waterproof interior space of the machine body 10. Further, although the first heat pipe 40 extends to the outer surface 11 of the machine body 10, the first heat source 50 can still be disposed in the inner space formed by the side wall 15 and the inner surface 12, and the first heat source 50 is disposed in the inner space near the outer surface 11, so that the first heat pipe 40 indirectly contacts the first heat source 50 through the outer surface 11, ensuring that the first heat source 50 is disposed in the inner space with waterproof property and still can be subjected to heat conduction of the first heat pipe 40 to achieve the heat dissipation effect.
Referring to fig. 4 and 5, in some embodiments, the contact portion 61 of the heat conducting plate 60 has an external shape corresponding to the shape of the through hole 13, and the abutting portion 62 has an external contour larger than that of the contact portion 61, so that the overall side surface of the heat conducting plate 60 has a "convex" external shape. In these embodiments, the contact portion 61 of the heat conducting plate 60 passes through the through hole 13 to be abutted against the heat dissipating fin set 30 to conduct heat, and the abutting portion 62 can be abutted against the inner surface 12 of the machine body 10 and cover the through hole 13, so that the through hole 13 is closed by the heat conducting plate 60, moisture or dust outside the machine body 10 is reduced from entering the machine body 10 from the through hole 13, and waterproof and dustproof properties at the through hole 13 are ensured.
Referring to fig. 4 and 5, in some embodiments, to further improve the waterproof performance of the internal space of the electronic device, the electronic device further includes a waterproof ring 63. In these embodiments, the waterproof ring 63 is made of a flexible material (such as but not limited to silica gel or rubber), and the waterproof ring 63 is sleeved on the contact portion 61 of the heat conducting plate 60. Therefore, the waterproof ring 63 is closely attached to the contact portion 61, when the heat conducting plate 60 passes through the through hole 13 with the contact portion 61, the waterproof ring 63 surrounds the through hole 13, so that the waterproof ring 63 is sandwiched between the abutting portion 62 of the heat conducting plate 60 and the inner surface 12 of the machine body 10, the heat conducting plate 60 is more closely assembled to the machine body 10 through the flexibility of the waterproof ring 63, and the waterproof performance is improved.
Referring to fig. 7 and 9, in some embodiments, in order to ensure the flatness of the outer surface 11 of the electronic device after the fan 20 is disposed, so as to facilitate the expansion or storage of the electronic device, the outer surface 11 of the electronic device is provided with a groove 14 for accommodating the fan 20. In such embodiments, the outer surface 11 of the body 10 includes a first portion 111, a second portion 112, and a third portion 113. The two ends of the second portion 112 are respectively connected to the first portion 111 and the third portion 113 in an angle, the first portion 111 and the third portion 113 are not coplanar, and the side wall 15 is simultaneously connected to the first portion 111, the second portion 112 and the third portion 113, so that the second portion 112, the third portion 113 and the side wall 15 together define a groove 14, and the fan 20 and the heat sink fin set 30 are disposed in the groove 14. In addition, the through hole 13 penetrates through the third portion 113, so that the position of the air outlet 21 of the fan 20 accommodated in the groove 14 can be correspondingly set in the heat dissipation fin set 30 of the through hole 13.
In some embodiments, to ensure the operation of the fan 20, the side wall 15 is provided with a through hole 151 communicating with the groove 14 at a position corresponding to the groove 14. In such embodiments, the through holes 151 include a plurality of first through holes 151a and a plurality of second through holes 151b, and the fan 20 can suck air through the first through holes 151a to generate a cooling air flow, as shown in fig. 1, 2 and 9. The fan 20 discharges the heat radiation air flow through the second through hole 151b via the air outlet 21, as shown in fig. 1, 7 and 9.
Referring to fig. 9 to 13, fig. 10 is a schematic plan sectional view of an embodiment of the electronic device. Here, fig. 10 is a view of the YZ plane direction defined by the Y direction and the Z direction. FIG. 11 is an enlarged view of a portion of encircled portion 11 in FIG. 10; fig. 12 is an enlarged view of a portion of the encircled portion 12 of fig. 11. In some embodiments, the fin group 30 includes a plurality of fins 31 spaced apart in parallel with each other to form a unit (as shown in fig. 9). Each fin 31 of the fin group 30 has a first side 311, a second side 312, a third side 313, and a fourth side 314. The first side 311 is parallel to the second side 312, the third side 313 is parallel to the fourth side 314, and the third side 313 and the fourth side 314 are respectively connected between the first side 311 and the second side 312 (see fig. 12). In these embodiments, two adjacent heat dissipation fins 31 form a gas channel therebetween, and the first side 311 and the second side 312 of each heat dissipation fin 31 are two ends of the gas channel. Therefore, the heat sink fin set 30 is adjacent to the fan 20 at the first side 311, the first heat pipe 40 is disposed at the third side 313, and the heat conducting plate 60 is disposed at the fourth side 314. Here, the second through hole 151b is disposed on the side wall 15 of the body 10 at a position corresponding to the second side 312 of each fin 31 for exhausting the gas flowing through the gas channel of the fin group 30 (as shown in fig. 9 and 12).
Referring to fig. 12, in some embodiments, in order to ensure that the air exhausted from the air outlet 21 of the fan 20 can reliably flow through the air channels between the heat dissipating fins 31 to achieve the heat dissipation effect, the heat dissipating fin set 30 further includes an upper plate 32 and a lower plate 33. The upper plate 32 is perpendicular to each of the heat dissipation fins 31 and disposed on a third side 313 of each of the heat dissipation fins 31, and the lower plate 33 is perpendicular to each of the heat dissipation fins 31 and disposed on a fourth side 314 of each of the heat dissipation fins 31. Therefore, the air exhausted from the air outlet 21 of the fan 20 can completely enter the air channel to contact each heat dissipation fin 31 to provide the best heat dissipation effect, besides, the first heat pipe 40 can also be connected to the upper plate 32, and the heat conducting plate 60 is connected to the lower plate 33, so that not only the stability of the first heat pipe 40 and the heat conducting plate 60 assembled on the heat dissipation fin set 30 can be improved, but also the area of the first heat pipe 40 and the heat conducting plate 60 contacting the heat dissipation fin set 30 can be increased by the upper plate 32 and the lower plate 33, and the heat dissipation effect is improved.
Referring to fig. 12, in some embodiments, the fourth side 314 of each fin 31 includes a first segment 3141, a second segment 3142, and a third segment 3143. The first segment 3141 vertically engages the first side 311, the third segment 3143 vertically engages the second side 312, the second segment 3142 vertically engages the first segment 3141 and the third segment 3143, and the position of the first segment 3141 corresponds to the position of the through opening 13. In this way, the fourth side 314 of each heat dissipating fin 31 of the heat dissipating fin set 30 can be abutted by the heat conducting plate 60 penetrating into the through hole 13 only by providing the first segment 3141, and the second segment 3142 and the third segment 3143 connected to the first segment 3141 can extend the length of each heat dissipating fin 31, increase the area of the air exhausted by the fan 20 contacting the heat dissipating fin 31, and improve the heat dissipating efficiency.
Referring to fig. 12, in some embodiments, the first segment 3141, the second segment 3142, and the third segment 3143 of the fourth side 314 of each fin 31 are not coplanar. In these embodiments, the third segment 3143 is closer to the third side 313 than the first segment 3141, so that the fourth side 314 of each fin 31 is stepped with a height difference. In these embodiments, the lower plate 33 includes a first lower plate 331 and a second lower plate 332, the first lower plate 331 is disposed on the first segment 3141 of the fourth side 314, the second lower plate 332 is disposed on the third segment 3143 of the fourth side 314, and the contact portion 61 of the heat conducting plate 60 abuts against the first lower plate 331. Therefore, since the second lower plate 332 is disposed on the third section 3143 closer to the third side 313 than the first section 3141, a gap is formed between the second lower plate 332 and the adjacent outer surface 11 of the machine body 10, so as to facilitate the avoiding space of the fixing member (e.g. screw locking member) locked on the outer surface 11, and improve the space utilization.
Referring to fig. 13, in another embodiment of the heat conducting plate 60 with a planar structure, a portion of the heat dissipating fins 31 (e.g., the first segment 3141 of the fourth side 314) of the heat dissipating fin set 30 passes through the through hole 13 to abut against the heat conducting plate 60 to conduct heat, and ensure water and dust resistance at the through hole 13.
Referring to fig. 14, in yet another embodiment, a portion of the heat fins 31a of the heat fin set 30a (e.g., the first segment 3141 of the fourth side 314) abuts against the second heat pipe 70a through the through hole 13 to conduct heat. The waterproof ring 63a surrounds the through hole 13 and a part of the heat dissipation fins 31a, and the waterproof ring 63a is sandwiched between the inner surface 12 of the body 10 and the second heat pipe 70a, so as to ensure waterproof and dustproof properties at the through hole 13.
Referring to fig. 15, in some embodiments in which the electronic device is an expansion board, the body 10 of the electronic device may include a first body 10A and a second body 10B. In these embodiments, the first body 10A further includes an expansion port 16, and the expansion port 16 is disposed on the outer surface 11 for overlapping and expanding the second body 10B, so as to improve the diversity of use.
In addition, the first heat source 50 and the second heat source 80 are electronic components in the electronic device that generate heat due to operation. Such as, but not limited to, a communication module (e.g., a 4G/5G communication module), a Memory, a Graphics Card, a processor (CPU), a Graphics Processor (GPU), a battery, or a Hard disk (Hard Device).
Of course, the present invention is capable of other various embodiments and its several details are capable of modification and variation in light of the present invention, as will be apparent to those skilled in the art, without departing from the spirit and scope of the invention as defined in the appended claims.

Claims (20)

1. An electronic device, comprising:
a machine body comprising a through hole, an opposite outer surface and an inner surface, wherein the through hole penetrates through the outer surface and the inner surface;
the fan is arranged on the outer surface of the machine body and is provided with an air outlet;
the radiating fin group is arranged at the air outlet and corresponds to the through hole;
one end of the first heat pipe is arranged on the radiating fin group and positioned on the outer surface side;
the first heat source is arranged at the position corresponding to the other end of the first heat pipe;
the heat conducting plate is arranged in the machine body and corresponds to the through hole, and one side of the heat conducting plate is abutted against the heat radiating fin group and the inner surface;
one end of the second heat pipe is connected to the other side of the heat conducting plate; and
and the second heat source is arranged at the position corresponding to the other end of the second heat pipe.
2. The electronic device of claim 1, wherein the first heat source and the second heat source are disposed within the body and are not coplanar.
3. The electronic device of claim 1, wherein the housing further comprises a sidewall, and the outer surface of the housing comprises a first portion, a second portion and a third portion, the second portion is angularly engaged with the first portion and the third portion, the first portion is non-coplanar with the third portion, the sidewall engages the first portion, the second portion and the third portion, a groove is defined between the second portion, the third portion and the sidewall, and the fan is disposed in the groove.
4. The electronic device of claim 3, wherein the first heat source, the second heat source, and the second heat pipe are located between the sidewall and the inner surface.
5. The electronic device of claim 3, wherein the sidewall includes a plurality of through holes, each through hole communicating with the recess.
6. The electronic device of claim 1, wherein the heat conducting plate comprises a contact portion and an abutting portion, the contact portion passes through the through hole to abut against the heat dissipating fin set, and the abutting portion abuts against the inner surface.
7. The electronic device of claim 6, further comprising a waterproof ring disposed on the inner surface and surrounding the through hole, wherein the contact portion passes through the waterproof ring to abut against the heat sink fin set, and the side of the abutting portion abuts against the waterproof ring.
8. The electronic device of claim 7, wherein the waterproof ring protrudes from the inner surface.
9. The electronic device of claim 8, wherein the heat dissipation fin set comprises a plurality of heat dissipation fins, each of the plurality of heat dissipation fins has a first side, a second side, a third side and a fourth side, the first side is parallel to and opposite to the second side, the third side is parallel to and opposite to the fourth side, the third side and the fourth side are respectively connected between the first side and the second side, the first side is adjacent to the fan, the first heat pipe set is arranged on the third side, and the heat conducting plate set is arranged on the fourth side.
10. The electronic device of claim 9, wherein the heat dissipating fin set further comprises an upper plate and a lower plate, the upper plate is perpendicular to each heat dissipating fin and disposed on the third side, the lower plate is perpendicular to each heat dissipating fin and disposed on the fourth side, the first heat pipe is connected to the upper plate, and the heat conducting plate is connected to the lower plate.
11. The electronic device of claim 9, wherein the fourth side comprises a first section, a second section and a third section, the first section is vertically connected to the first side, the third section is vertically connected to the second side, the second section is vertically connected to the first section and the third section, and the position of the first section corresponds to the position of the through hole.
12. The electronic device of claim 10, wherein the lower plate comprises a first lower plate and a second lower plate, the first lower plate is disposed on the first section, the second lower plate is disposed on the third section, and the heat conducting plate is abutted against the first lower plate.
13. The electronic device of claim 1, wherein the housing further comprises an expansion port disposed on the outer surface for expanding the connection with another housing.
14. An electronic device, comprising:
a machine body;
the fan is arranged on the machine body and is provided with an air outlet;
a heat radiation fin group arranged at the air outlet;
one end of the first heat pipe is arranged at one side of the radiating fin group;
the first heat source is arranged in the machine body and corresponds to the position of the other end of the first heat pipe;
one end of the second heat pipe is connected with the other side of the radiating fin group; and
the second heat source is arranged in the machine body at a position corresponding to the other end of the second heat pipe, and the second heat source and the first heat source are not coplanar.
15. The electronic device of claim 14, wherein the housing has a recess, and the fan and the set of cooling fins are disposed in the recess.
16. The electronic device of claim 15, wherein the body has a through hole penetrating through the recess and corresponding to the heat sink fin set.
17. The electronic device of claim 16, wherein the first heat pipe is located on an outer surface of the body and the second heat pipe is located on an inner surface of the body.
18. The electronic device of claim 17, further comprising a waterproof ring surrounding the through hole, the waterproof ring being sandwiched between the inner surface of the body and the second heat pipe.
19. The electronic device of claim 18, wherein a portion of the set of heat fins passes through the waterproof ring to abut against the second heat pipe.
20. The electronic device of claim 15, wherein the body further comprises a plurality of through holes, each through hole communicating with the recess.
CN202211138206.1A 2022-02-11 2022-09-19 Electronic device Pending CN116634725A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US17/981,342 US20230262923A1 (en) 2022-02-11 2022-11-04 Electronic device
EP22209288.4A EP4227764A1 (en) 2022-02-11 2022-11-24 Electronic device
AU2022279481A AU2022279481A1 (en) 2022-02-11 2022-11-30 Electronic Device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202263309463P 2022-02-11 2022-02-11
US63/309,463 2022-02-11

Publications (1)

Publication Number Publication Date
CN116634725A true CN116634725A (en) 2023-08-22

Family

ID=87596059

Family Applications (3)

Application Number Title Priority Date Filing Date
CN202210994665.3A Pending CN116627210A (en) 2022-02-11 2022-08-18 Electronic device
CN202211129329.9A Pending CN116627211A (en) 2022-02-11 2022-09-16 Disassembling and replacing device and electronic device
CN202211138206.1A Pending CN116634725A (en) 2022-02-11 2022-09-19 Electronic device

Family Applications Before (2)

Application Number Title Priority Date Filing Date
CN202210994665.3A Pending CN116627210A (en) 2022-02-11 2022-08-18 Electronic device
CN202211129329.9A Pending CN116627211A (en) 2022-02-11 2022-09-16 Disassembling and replacing device and electronic device

Country Status (1)

Country Link
CN (3) CN116627210A (en)

Also Published As

Publication number Publication date
CN116627210A (en) 2023-08-22
CN116627211A (en) 2023-08-22

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