CN218100144U - Computer with a memory card - Google Patents

Abstract

The utility model provides a computer, include: the air guide device comprises a main case, a first radiating fin, an air guide shell and a radiating fan; the first heat sink includes: a first substrate and a first fin; the mainframe box defines a mounting cavity, the first substrate is covered on an opening of the mounting cavity and is hermetically connected with the mainframe box, and the first fins are arranged on one side, away from the mainframe box, of the first substrate; one end cover of the air guide shell is arranged on one side, deviating from the first substrate, of the first fin, and the other end of the air guide shell is connected with the mainframe box in a sealing mode; the other end of the air guide shell is provided with a heat dissipation opening, and the heat dissipation opening is communicated with the first fin through a gap between the air guide shell and the first fin; the heat radiation fan is fixedly connected with at least one of the air guide shell, the mainframe box and the first fins and is used for radiating heat of the first fins through the heat radiation port. The utility model discloses can improve the radiating efficiency to the device under the circumstances of guaranteeing that the device is in the confined mainframe box.

Description

Computer with a memory card

Technical Field

The utility model relates to an electronic equipment technical field especially relates to a computer.

Background

With the rapid development of technology, the functions of electronic devices are also more and more powerful, but the heat dissipation problem becomes a problem to be solved urgently for manufacturers.

In particular, to solve the problem of heat dissipation of a computer, it is common to provide a ventilation hole on a surface of a chassis of the computer and provide a heat dissipation fan to dissipate heat from devices inside the chassis. The method can effectively solve the problem of computer heat dissipation. However, for some special computers working in a harsh environment, it is necessary to solve the problem of heat dissipation and ensure the sealing performance of the case to prevent the devices inside the case from being damaged by the working environment. Therefore, the mode of forming the heat dissipation holes in the surface of the case obviously cannot meet the working requirements of special computers.

SUMMERY OF THE UTILITY MODEL

In order to solve the above problem, the utility model provides a computer, on locating first fin through the one end cover with air guide shell, utilize the radiator fan to carry out ventilation cooling to first fin under air guide shell's direction, under the circumstances that the assurance device is in the confined mainframe box, improved the radiating efficiency to the device in the mainframe box.

The utility model provides a computer, include: the air guide device comprises a main case, a first radiating fin, an air guide shell and a radiating fan;

the first heat sink includes: a first substrate and a first fin;

the mainframe box defines a mounting cavity, the first substrate is covered on an opening of the mounting cavity and is hermetically connected with the mainframe box, and the first fins are arranged on one side, away from the mainframe box, of the first substrate;

one end of the air guide shell is covered on one side of the first fins, which is far away from the first substrate, and the other end of the air guide shell is hermetically connected with the mainframe box;

the other end of the air guide shell is provided with a heat dissipation opening which is communicated with the first fin through a gap between the air guide shell and the first fin;

the heat radiation fan is fixedly connected with at least one of the air guide shell, the mainframe box and the first fins and is used for radiating heat of the first fins through the heat radiation port.

Optionally, the first fins are arranged on the first substrate along a first direction, the other end of the air guide casing is located on one side of the main cabinet facing a second direction, and the second direction is perpendicular to the first direction relative to a plane where the first substrate is located.

Optionally, when the cooling fan is fixedly connected to the air guide housing, the cooling fan is located at a side of the other end of the air guide housing, which is away from the mainframe box, and the ventilation opening of the cooling fan faces the heat dissipation opening.

Optionally, one end of the first fin facing away from the air guide housing extends out of the air guide housing.

Optionally, the other end of the air guide shell, the main case, the first substrate and the first fin form an air guide cavity;

the computer further includes: an air guide wedge block;

the air guide wedge block is positioned in the air guide cavity and positioned on one side of the first fin facing the mainframe box;

the air guide wedge block comprises: an air guide inclined plane;

the air guide inclined plane faces the heat dissipation opening, one end of the air guide inclined plane, which faces the mainframe box, faces the first fin, and the other end of the air guide inclined plane, which faces away from the mainframe box, faces away from the first fin.

Optionally, a heat source device is arranged in the installation cavity;

the heat source device is connected to the main chassis or the first substrate.

Optionally, the heat source device comprises: a circuit board, a bridge chip and a processor;

the bridge chip and the processor are both positioned on one side of the circuit board facing the first substrate and are both fixedly connected with the circuit board;

the circuit board is fixedly connected with the first substrate, and the bridge chip and the processor are both contacted with the first substrate.

Optionally, the heat source device further comprises: a functional module;

the outside of mainframe box is connected with the second fin, and functional module and mainframe box fixed connection, the lateral wall that functional module and mainframe box are connected with the second fin contacts.

Optionally, the second heat sink includes: and the second fins are arranged along the horizontal direction.

Optionally, the computer further comprises: a protective shell and a sealed external interface;

the protective shell is positioned at the other end of the main case, which is far away from the air guide shell, and is connected with the main case;

the protective shell is fixedly connected with the sealed external interface, and the sealed external interface is in signal connection with the heat source device.

The embodiment of the utility model provides a computer, on locating first radiator through the one end cover with air guide shell, clearance between so first fin is under air guide shell's restriction, has formed independent wind channel to can improve the ventilation efficiency of radiator fan between first fin, and then can improve the radiating efficiency to the device in the mainframe box under the circumstances that guarantees that the device is in the confined mainframe box, reduced the risk that the device damaged because of operating temperature is too high.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments or the conventional technologies of the present application, the drawings used in the descriptions of the embodiments or the conventional technologies will be briefly introduced below, it is obvious that the drawings in the following descriptions are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a cross-sectional view of a special ruggedized computer of an embodiment of the present application;

FIG. 2 is a block diagram of a special ruggedized computer of an embodiment of the present application;

FIG. 3 is a block diagram of a special ruggedized computer of an embodiment of the present application;

FIG. 4 is a block diagram of a main chassis according to an embodiment of the present application;

FIG. 5 is a block diagram of a circuit board according to an embodiment of the present application;

FIG. 6 is a block diagram of a main chassis according to an embodiment of the present application;

fig. 7 is a structural view of an air guide casing according to an embodiment of the present application.

Reference numerals

1. A main chassis; 11. a mounting cavity; 2. an air guide shell; 21. a wind guide cavity; 22. a heat dissipation port; 3. a protective housing; 4. a first heat sink; 41. a first substrate; 42. a first fin; 5. a second heat sink; 51. a second fin; 6. a heat source device; 61. a functional module; 62. a circuit board; 63. a bridge chip; 64. a processor; 71. a heat radiation fan; 72. a sealed external interface; 73. and the air guide wedge block.

Detailed Description

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Embodiments of the present application are set forth in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

It will be understood that, as used herein, the terms "first," "second," and the like may be used herein to describe various elements, but these elements should not be limited by these terms. These terms are only used to distinguish one element from another.

Spatially relative terms, such as "under," "below," "beneath," "under," "above," "over," and the like, may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary terms "under" and "under" can encompass both an orientation of above and below. In addition, the device may also include additional orientations (e.g., rotated 90 degrees or other orientations) and the spatial descriptors used herein interpreted accordingly.

It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or be connected to the other element through intervening elements. Further, "connection" in the following embodiments is understood to mean "electrical connection", "communication connection", or the like, if there is a transfer of electrical signals or data between the connected objects.

As used herein, the singular forms "a", "an" and "the" may include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises/comprising," "includes" or "including," etc., specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof. Also, as used in this specification, the term "and/or" includes any and all combinations of the associated listed items.

The present embodiment provides a computer, which in this embodiment, see FIG. 1, is a special ruggedized computer. The special ruggedized computer includes: the air conditioner comprises a main case 1, a first heat sink 4, a heat source device 6, an air guide casing 2 and a heat radiation fan 71.

Wherein, the main cabinet 1 is a partially closed hexahedral structure. The main cabinet 1 defines a mounting cavity 11; the mounting cavity 11 is opened toward the right side of the main cabinet 1. The rear side wall, the left side wall, the upper side wall and the lower side wall of the mainframe box 1 are all closed panels, namely, no hole is formed on the panels; the front side wall of the main case 1 is a functional output panel, on which a sealed external interface 72 can be arranged to enable the heat source device 6 to communicate with external equipment through a sealed plug, or a perforation can be arranged on the front side wall, the heat source device 6 communicates with external equipment through a cable penetrating through the perforation, and sealant is coated on the perforation for sealing.

In the present embodiment, the front side wall of the main cabinet 1 is perforated. The aviation socket interface is fixedly and hermetically connected with the main case 1 through a through hole. The heat source device 6 is in communication connection with the aviation socket interface on the main case 1 through a cable, and the aviation socket interface on the main case 1 is in communication connection with the sealed external interface 72 through a cable.

Specifically, with reference to fig. 2 and 3, the special ruggedized computer further includes: a protective housing 3 and a sealed outer interface 72. The protective shell 3 is positioned at the front end of the mainframe box 1 and is sleeved with the front end of the mainframe box 1; the right side wall of the protective shell 3 is attached to the right end of the first fin 42. The sealed external interface 72 is fixedly arranged on the protective shell 3, and a cable penetrating through the through hole is connected with the sealed external interface 72, so that the heat source device 6 can be in signal connection with external equipment. In this embodiment, the sealed external interface 72 is an aircraft socket interface.

The protective housing 3 is also of an incompletely closed hexahedral configuration. The opening of the cavity in the shielding shell 3 is directed backwards. Specifically, the protective housing 3 is composed of a left side wall, a right side wall, an upper side wall, a lower side wall, and a front side wall. Wherein, the lengths of the left and right side walls, the upper side wall and the lower side wall of the protective housing 3 along the front-rear direction are the same. The rear ends of the left side wall, the upper side wall and the lower side wall of the protective shell 3 are connected with the corresponding positions of the mainframe box 1 and the first fins 42 in a sealing mode through sealing glue. The right side wall of the protective housing 3 abuts against the right ends of the first fins 42. Through setting up protective housing 3 not only can realize that heat source device 6 communicates with external equipment in mainframe box 1, can also satisfy mainframe box 1 simultaneously to blast proof demand.

Referring to fig. 2 and 4, the first heat sink 4 includes: a first substrate 41 and first fins 42. The first substrate 41 covers the opening of the installation cavity 11, is fixedly connected with the main cabinet 1 through screws, and is hermetically connected with the main cabinet 1 through sealant. The first fins 42 are arranged on the right side of the first substrate 41. The first fins 42 may be arranged along any direction relative to the plane of the first substrate 41, in this embodiment, the first fins 42 are arranged along the up-down direction; the material of the main chassis 1 is an aluminum alloy material, but is not limited thereto.

Referring to fig. 4 and 5, the heat source device 6 is located in the mounting cavity 11. In the present example, the heat source device 6 includes: a functional module 61, a circuit board 62, a bridge chip 63 and a processor 64, but is not limited thereto. The bridge chip 63 and the processor 64 are both located on the right side of the circuit board 62, and are both fixedly connected and electrically connected to the circuit board 62. Eight studs are fixedly arranged on the left side surface of the first substrate 41, the circuit board 62 is fixedly connected with the first substrate 41 through the matching of screws and studs, and the bridge chip 63 and the processor 64 are both in contact with the first substrate 41. In this way, the heat generated by the bridge chip 63 and the processor 64 can be transferred to the first fins 42 through the first substrate 41, so that the heat dissipation area of the bridge chip 63 and the processor 64 is increased.

Referring to fig. 3 and 6, the functional module 61 is fixedly connected to the main cabinet 1 by screws. The outer surface of the main cabinet 1 is also connected with a second heat sink 5. The second heat sink 5 includes: and a second fin 51. The function module 61 is connected to the main chassis 1, and the function module 61 is in contact with a side wall of the main chassis 1 to which the second heat sink 5 is connected. Therefore, the heat of the functional module 61 can be transferred to the second fins 51 for heat dissipation, so that the heat dissipation area of the functional module 61 is increased, and the heat dissipation efficiency of the functional module 61 is improved.

In this example, the second fin 51 is integrally connected to the left sidewall of the main cabinet 1, and the second fins 51 are arranged in a horizontal direction. By defining the arrangement direction of the second fins 51, the longitudinal direction of the gap between the second fins 51 can be made to coincide with the direction of gravity. The heat generated by the functional module 61 is continuously transmitted to the second fins 51, the air around the second fins 51 is heated and changed into hot air, the density of the hot air is gradually reduced, after the density of the hot air is lower than that of the cold air around the second fins, the hot air rises under the action of gravity, the cold air around the main cabinet 1 falls, and natural convection type air circulation is formed, so that heat exchange is realized, and the heat dissipation efficiency of the functional module 61 can be further improved.

In an alternative embodiment, the second heat sink 5 further comprises: a second substrate. The second fin 51 is disposed on the left side of the second substrate, and the second substrate is connected to the left sidewall of the main chassis 1 through a heat conductive agent and is fixedly connected to the main chassis 1 through a screw.

In the present embodiment, the air guide casing 2 is also a hexahedral structure that is not completely closed. The opening of the cavity in the air guide casing 2 faces forward and toward the front end on the left side. Specifically, the air guide casing 2 is composed of a left side wall, a right side wall, an upper side wall, a lower side wall, and a rear side wall. The lengths of the right side wall, the upper side wall, and the lower side wall of the air guide casing 2 in the front-rear direction are the same, the length of the left side wall of the air guide casing 2 in the front-rear direction is shorter than the length of the right side wall of the air guide casing 2 in the front-rear direction, and the rear end of the left side wall of the air guide casing 2 is connected to the rear side wall of the air guide casing 2. The front end of the left side wall of the air guide casing 2 is connected with the left side wall of the main cabinet 1 in a sealing manner through sealant, and is spaced from the second fins 51.

The front end cover of the air guide shell 2 is arranged on the right side of the first fins 42, and the rear end cover of the air guide shell 2 is arranged on the rear end face of the mainframe box 1 and is connected with the mainframe box 1 in a sealing mode through sealing glue. Referring to fig. 7, two heat dissipation openings 22 are formed in the rear end surface of the rear end of the air guide casing 2. The rear end of the air guide casing 2 forms an air guide cavity 21 with the main cabinet 1, the first substrate 41 and the first fins 42. The gaps between the first fins 42 are defined by the guide housing and communicate with the heat dissipation opening 22 through the air guiding cavity 21. Thus, the gap between the first fins 42 and the air guiding cavity 21 can form a heat dissipating air duct, and the front end of the gap between the first fins 42 and the heat dissipating opening 22 can be the ventilation opening of the heat dissipating air duct.

The heat dissipation fan 71 may be disposed at the front end of the main chassis 1 or at the rear end of the air guide casing 2, and ventilates and dissipates heat of the first fin 42 by blowing air or drawing air into the heat dissipation air duct. In this embodiment, the number of the heat dissipation fans 71 is two, and the two heat dissipation fans 71 can be fixed at the rear end of the air guiding device, each heat dissipation fan 71 corresponds to one heat dissipation opening 22, and each heat dissipation fan 71 discharges hot air in the heat dissipation air duct in an air draft manner, so that the first fins 42 can be efficiently cooled.

Further, the computer further includes: the air guide wedge 73. The air guide wedge 73 includes: wind-guiding inclined plane. The air guide wedge 73 is fixed in the air guide cavity 21 and located on the left side of the first fin 42, while the air guide inclined plane faces the right rear and the heat dissipation opening 22, and the front end of the air guide inclined plane is located on the right side of the rear end. In this way, the heat between the first fins 42 can be quickly discharged out of the air guiding cavity 21 through the heat dissipating port 22 under the guidance of the air guiding inclined surface, thereby further improving the heat dissipation efficiency of the first fins 42.

It should be noted that the front end of the first fin 42 extends out of the air guiding casing 2, so that not only the front side of the front end of the gap between the first fins 42 can enter air, but also the upper side of the front end of the gap between the first fins 42 can enter air, thereby ensuring the air intake of the heat dissipating channel.

The special reinforced computer is simple in structure, not only can meet the sealing requirement of the heat source device 6 on the mainframe box 1, but also can efficiently dissipate heat of the heat source device 6 in the mainframe box 1, and reduces the risk of damage of the device due to overhigh working temperature.

In the description herein, references to "some embodiments," "other embodiments," "desired embodiments," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, a schematic description of the above terminology may not necessarily refer to the same embodiment or example.

The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the utility model. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, and these are all within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. A computer, comprising: the air guide device comprises a main case, a first radiating fin, an air guide shell and a radiating fan;

the first heat sink includes: the first substrate and the first fins;

the main case defines a mounting cavity, the first substrate is covered on an opening of the mounting cavity and is in sealed connection with the main case, and the first fins are arranged on one side, away from the main case, of the first substrate;

one end of the air guide shell is covered on one side, deviating from the first substrate, of the first fin, and the other end of the air guide shell is connected with the mainframe box in a sealing mode;

the other end of the air guide shell is provided with a heat dissipation opening, and the heat dissipation opening is communicated with the first fin through a gap between the air guide shell and the first fin;

the heat dissipation fan is fixedly connected with at least one of the air guide shell, the mainframe box and the first fins, and is used for dissipating heat of the first fins through the heat dissipation port.

2. The computer of claim 1, wherein the first fins are arranged on the first substrate along a first direction, and the other end of the air guide housing is located on a side of the main chassis facing a second direction, and the second direction is perpendicular to the first direction relative to a plane on which the first substrate is located.

3. The computer as claimed in claim 1, wherein when the heat dissipation fan is fixedly connected to the air guide housing, the heat dissipation fan is located at a side of the other end of the air guide housing, which is away from the main chassis, and a ventilation opening of the heat dissipation fan faces the heat dissipation opening.

4. The computer as claimed in claim 1, wherein an end of the first fin facing away from the air guide housing extends out of the air guide housing.

5. The computer as claimed in claim 1, wherein the other end of the air guide housing forms an air guide cavity with the main chassis, the first substrate and the first fin;

the computer further comprises: an air guide wedge block;

the air guide wedge block is positioned in the air guide cavity and positioned on one side, facing the main case, of the first fin;

the wind guide wedge block comprises: an air guide inclined plane;

the air guide inclined plane faces the heat radiating opening, one end of the air guide inclined plane, which faces the mainframe box, faces the first fins, and the other end of the air guide inclined plane, which deviates from the mainframe box, deviates from the first fins.

6. The computer of any one of claims 1 to 5, wherein a heat source device is disposed in the mounting cavity;

the heat source device is connected with the main chassis or the first substrate.

7. The computer of claim 6, wherein the heat source device comprises: a circuit board, a bridge chip and a processor;

the bridge chip and the processor are both positioned on one side of the circuit board, which faces the first substrate, and are both fixedly connected with the circuit board;

the circuit board is fixedly connected with the first substrate, and the bridge chip and the processor are both in contact with the first substrate.

8. The computer of claim 6, wherein the heat source device further comprises: a functional module;

the outside of mainframe box is connected with the second fin, functional module with mainframe box fixed connection, functional module with be connected with in the mainframe box the lateral wall of second fin contacts.

9. The computer of claim 8, wherein the second heat sink comprises: second fins arranged in a horizontal direction.

10. The computer of claim 6, wherein the computer further comprises: a protective shell and a sealed external interface;

the protective shell is positioned at the other end of the main case, which is far away from the air guide shell, and is connected with the main case;

the protective shell is fixedly connected with the sealed external interface, and the sealed external interface is in signal connection with the heat source device.

Images