CN116600527A

CN116600527A - Electronic device

Info

Publication number: CN116600527A
Application number: CN202211474353.6A
Authority: CN
Inventors: 徐万琳; 张瑞祺; 郑宏展
Original assignee: Getac Technology Corp
Current assignee: Getac Technology Corp
Priority date: 2022-02-11
Filing date: 2022-11-22
Publication date: 2023-08-15
Also published as: CN116600521A; CN116600520A

Abstract

An electronic device comprises a shell, a first heat source, a second heat source and a heat dissipation module, wherein the first heat source, the second heat source and the heat dissipation module are arranged in the shell. The shell comprises a first shell and a second shell. The first shell comprises an upper surface, a lower surface, a through hole and a side wall which are opposite. The second shell is arranged at one end of the side wall. The heat dissipation module comprises a first fan, a second fan, a first heat conduction piece and a second heat conduction piece. The first fan is arranged on one side of the first shell. The second fan is arranged on the other side of the first shell and is adjacent to the second heat source, and the first air outlet of the first fan and the second air outlet of the second fan are positioned on the opposite sides of the side wall. One end of the first heat conducting piece is assembled on the first fan, and the other end of the first heat conducting piece is positioned at a position corresponding to the first heat source on the upper surface side. One end of the second heat conduction piece is assembled on the second fan, and the other end of the second heat conduction piece is positioned on the lower surface side and is abutted against the second heat source.

Description

Electronic device

Technical Field

The present disclosure relates to electronic devices.

Background

With the popularization of electronic devices, users have a higher performance requirement for the electronic devices, and the number of electronic components in the electronic devices has increased, so that the heat dissipation requirement in the electronic devices is also more and more important to avoid the failure of normal operation of various electronic components due to overheating.

Disclosure of Invention

The application provides an electronic device, which comprises a shell, a first heat source, a second heat source and a heat dissipation module. The shell comprises a first shell and a second shell. The first shell comprises an upper surface, a lower surface, a through hole and a side wall, wherein the upper surface and the lower surface are opposite, the through hole penetrates through the upper surface and the lower surface, and the side wall extends along the contour of the lower surface in a direction away from the upper surface. The second shell is arranged at one end of the side wall, which is far away from the upper surface. The first heat source is arranged in the shell and corresponds to the through opening. The second heat source is arranged in the shell. The heat dissipation module comprises a first fan, a second fan, a first heat conduction piece and a second heat conduction piece. The first fan comprises a first air outlet, and the first fan is arranged on one side of the first shell. The second fan comprises a second air outlet, the second fan is arranged on the other side of the first shell and is adjacent to the second heat source, and the first air outlet and the second air outlet are arranged on the opposite sides of the side wall. One end of the first heat conducting piece is assembled on the first fan, and the other end of the first heat conducting piece is positioned at a position corresponding to the first heat source on the upper surface side. One end of the second heat conduction piece is assembled on the second fan, and the other end of the second heat conduction piece is positioned on the lower surface side and is abutted against the second heat source.

In some embodiments, the first housing further includes two partition walls disposed on the lower surface and defining two non-waterproof areas and waterproof areas with the side walls, respectively, wherein the first heat source and the second heat source are both located in the waterproof areas.

In some embodiments, the first fan and the second fan are respectively located in two non-waterproof areas.

In some embodiments, the first housing further includes a through hole and a groove, the through hole penetrates through the upper surface and the lower surface, the groove is disposed on the upper surface and is communicated with the through hole and the through hole, the first heat conducting member is disposed in the groove, and one end of the first heat conducting member corresponds to the through hole, and the other end of the first heat conducting member is located at the through hole.

In some embodiments, the electronic device further includes two heat dissipation fin sets, wherein one heat dissipation fin set is disposed at the through hole and located at the first air outlet of the first fan, and the other heat dissipation fin set is disposed at the second air outlet of the second fan.

In some embodiments, the first heat conducting member is disposed at one end of the first fan and abuts against one of the heat dissipating fin groups, and the second heat conducting member is disposed at one end of the second fan and abuts against the other heat dissipating fin group.

In some embodiments, the second housing includes a main frame and a plate, the main frame is connected to the side wall, and the plate is detachably disposed on the main frame.

In some embodiments, the position of the plate corresponds to the position of the first fan.

In some embodiments, the position of the plate corresponds to the position of the second heat source and the second fan.

In some embodiments, the plate has a plurality of heat dissipation holes.

In some embodiments, the electronic device further includes an input device disposed on the upper surface and covering the first heat source and the first heat conductive member.

In some embodiments, the electronic device further includes a circuit board, and the first heat source and the second heat source are respectively located at two opposite sides of the circuit board.

In some embodiments, the heat dissipation module further includes a heat conductive plate, the heat conductive plate includes a first surface and a second surface that are oppositely configured, the heat conductive plate is disposed at the through hole, the first heat conductive member is abutted against the first surface, and the first heat source is abutted against the second surface.

In some embodiments, the electronic device further includes a bonding unit, and the circuit board is bonded to the heat conductive plate through the bonding unit.

In some embodiments, the coupling unit includes a coupling member and a locking member, the coupling member includes a fixing section and a cantilever section that are connected to each other, the fixing section is fixed on the second surface, and the locking member is locked on the cantilever section through the circuit board.

In some embodiments, the coupling unit further includes a nut disposed at an end of the cantilever section away from the fixing section, and the locking member is locked to the nut through the circuit board.

In some embodiments, the connecting member has a strip structure, and the connecting member includes two cantilever sections respectively connected to two ends of the fixing section.

In some embodiments, the number of the bonding elements is two, and the two bonding elements are disposed in parallel on the heat conducting plate.

The application provides another electronic device, which comprises a shell, a circuit board, a first heat source, a heat dissipation module and a combination unit. The circuit board is arranged in the shell. The first heat source is arranged on the circuit board. The heat dissipation module comprises a first fan, a heat conduction plate and a first heat conduction piece. The first fan is arranged in the shell. The heat conducting plate comprises a first surface and a second surface which are oppositely arranged, and the second surface is abutted against the first heat source. One end of the first heat conducting piece is assembled on the first fan, and the other end of the first heat conducting piece is abutted against the first surface of the heat conducting plate. The combining unit comprises a combining piece and a locking piece. The combining piece comprises a fixed section and a cantilever section which are connected, the fixed section is fixed on the second surface of the heat conducting plate, and the locking piece is locked on the cantilever section through the circuit board.

Drawings

FIG. 1 is a schematic perspective view of an embodiment of an electronic device;

FIG. 2 is a partially exploded view of an embodiment of an electronic device;

FIG. 3 is a partial perspective schematic cross-sectional view taken along section line 3-3 of FIG. 1;

FIG. 4 is a schematic plan view of a partial structure of an embodiment of an electronic device;

FIG. 5 is a schematic plan view of a partial structure of an embodiment of an electronic device;

FIG. 6 is a schematic perspective view of a partial structure of the electronic device;

FIG. 7 is an exploded view of FIG. 6;

FIG. 8 is a partial cross-sectional view taken along section line 8-8 in FIG. 1;

fig. 9 is a schematic perspective view of another perspective view of an embodiment of the electronic device.

[ symbolic description ]

10 casing

11 first shell

111 upper surface

112 lower surface

113 through hole

114 side wall

115 partition wall

116 flow channel

117 wearing mouth

118 groove

12 second shell

121 main frame

1211 assembling port

122 plate member

1221 heat sink

20 first heat source

30 second heat source

40 heat dissipation module

41 first fan

411 first air outlet

412 first air inlet

42 second fan

421 second air outlet

422 second air inlet

43 first heat conductive member

44 second heat conductive member

45 heat conducting plate

451 first side

452 second side

4521 positioning groove

4522 convex portions

50 circuit board

60 combined unit

61-joining piece

611 fixed section

612 cantilever section

62 fixing piece

63 locking piece

64 screw cap

641 sleeve part

642 head part

70 radiating fin group

Anon-waterproof area

Waterproof area B

I: input device

Detailed Description

Referring to fig. 1 to 5, fig. 1 is a schematic perspective view of an embodiment of an electronic device; FIG. 2 is a partially exploded view of an embodiment of an electronic device; FIG. 3 is a partial perspective schematic cross-sectional view taken along section line 3-3 of FIG. 1; FIG. 4 is a schematic plan view of a partial structure of an embodiment of an electronic device; fig. 5 is a schematic plan view of a partial structure of an embodiment of the electronic device.

The electronic device comprises a housing 10, a first heat source 20, a second heat source 30 and a heat dissipation module 40, wherein the first heat source 20, the second heat source 30 and the heat dissipation module 40 are arranged in the housing 10. The housing 10 includes a first housing 11 and a second housing 12. The first housing 11 includes an upper surface 111 and a lower surface 112 opposite to each other, a through hole 113 and a side wall 114, wherein the through hole 113 penetrates the upper surface 111 and the lower surface 112, and the side wall 114 extends along the contour of the lower surface 112 in a direction away from the upper surface 111. The second housing 12 is disposed at an end of the side wall 114 remote from the lower surface 112 of the first housing 11. The first heat source 20 is disposed at a position corresponding to the through hole 113. The heat dissipation module 40 includes a first fan 41, a second fan 42, a first heat conducting member 43, and a second heat conducting member 44. The first fan 41 includes a first air outlet 411, and the first fan 41 is disposed at one side of the first housing 11. The second fan 42 includes a second air outlet 421, the second fan 42 is disposed on the other side of the first housing 11 and adjacent to the second heat source 30, and the first air outlet 411 and the second air outlet 421 are located on opposite sides of the side wall 114. One end of the first heat conducting member 43 is assembled to the first fan 41, and the other end is located at a position corresponding to the first heat source 20 on the upper surface 111 side. One end of the second heat conducting member 44 is assembled to the second fan 42, and the other end is located on the lower surface 112 side and abuts against the second heat source 30.

Therefore, the heat dissipation module 40 can sufficiently provide heat dissipation for the first heat source 20 and the second heat source 30 located at different positions in the housing 10 in a limited space, so as to improve the degree of freedom of the location of the first heat source 20 and the second heat source 30 in the housing 10, and in addition, since the first air outlet 411 of the first fan 41 and the second air outlet 421 of the second fan 42 are located at opposite sides of the side wall 114, when the first heat conducting member 43 and the second heat conducting member 44 are assembled on the first fan 41 and the second fan 42, the first heat source 20 and the second heat source 30 can be configured at different positions in the housing 10 according to the locations of the first heat conducting member 43 and the second heat conducting member 44, thereby not only effectively improving the heat dissipation efficiency, but also improving the space utilization rate in the housing 10.

Referring to fig. 1 to 3, the electronic device is a device with electronic components therein that generate heat due to operation. In some embodiments, the electronic device is a notebook computer, but the disclosure is not limited thereto. In these embodiments, the housing 10 is a main housing of a notebook computer, the first housing 11 is a C-piece for mounting the input device I, and the second housing 12 is a D-piece supported on a use surface. Here, the input device I is disposed on the upper surface 111 of the first housing 11 and covers the through opening 113. The space between the second housing 12 and the lower surface 112 and the side wall 114 of the first housing 11 is configured for accommodating the first heat source 20, the second heat source 30 and the heat dissipation module 40.

Referring to fig. 3 to 5, fig. 4 is a schematic diagram of an embodiment of the electronic device, in which the second housing 12 is omitted and the electronic device is drawn from a view perpendicular to the lower surface 112 of the first housing 11; fig. 5 is a schematic diagram of fig. 4, in which the second heat source 30, the second heat conducting member 44 and the circuit board 50 are omitted.

In some embodiments, the first housing 11 includes two partition walls 115 and a plurality of air flow channels 116, and the air flow channels 116 are disposed through the side walls 114. In such embodiments, each of the spacers 115 is disposed on the lower surface 112 and extends from the lower surface 112 in a direction away from the upper surface 111. Here, two ends of each partition wall 115 are connected to the side walls 114, and each air flow channel 116 is located in a range of two ends of the partition wall 115, so that two non-waterproof areas a are defined between each partition wall 115, a portion of the side walls 114 with the air flow channels 116, and the second housing 12, and a waterproof area B is defined between the two partition walls 115, the rest of the side walls 114, and the second housing 112.

In these embodiments, the first fan 41 and the second fan 42 are respectively located in each non-waterproof area a and exhaust the air through each air flow channel 116, and the first heat source 20 and the second heat source 30 can be disposed in the waterproof area B, so as to ensure smooth heat dissipation airflow of the first fan 41 and the second fan 42, ensure heat dissipation effect, and ensure waterproof performance of the first heat source 20 and the second heat source 30 located in the housing 10 to avoid affecting operation of the first heat source 20 and the second heat source 30.

Referring to fig. 3 to 5, in the present embodiment, the first housing 11 further includes a through hole 117 and a groove 118, the through hole 117 penetrates through the upper surface 111 and the lower surface 112 and is communicated with the non-waterproof area a provided with the first fan 41, and the groove 118 is disposed on the upper surface 111 and is communicated with the through hole 117 and the through hole 113. It should be noted that, the outline drawn by the dashed line in fig. 4 and 5 is the outline of the groove 118 recessed from the upper surface 111 of the first housing 11, and a portion of the groove 118 corresponds to the shape of the first heat conducting member 43, and the other portion is connected to the through hole 113 and corresponds to the shape of the heat conducting plate 45. Therefore, the first heat conducting member 43 is disposed in the groove 118, and one end of the first heat conducting member 43 corresponds to the through hole 113 to absorb the heat energy generated by the first heat source 20, and the other end of the first heat conducting member 43 is disposed at the through hole 117 to correspond to the first fan 41, so that the heat energy on the first heat conducting member 43 is rapidly conducted out by the air flow generated by the first fan 41.

The input device I covers the heat conducting plate 45, the through hole 117, the first heat conducting member 43 and the groove 118, so that the first heat conducting member 43 and the heat conducting plate 45 are located between the input device I and the upper surface 111 of the first housing 11, and a user of the electronic device does not directly contact the first heat conducting member 43 and the heat conducting plate 45 when using the electronic device, thereby improving safety and comfort in use.

Referring to fig. 3 to 7, fig. 6 is a schematic perspective view of a partial structure of the electronic device; fig. 7 is an exploded view of fig. 6. In the present embodiment, the heat dissipation module 40 further includes a heat conducting plate 45, the heat conducting plate 45 is disposed between the first heat source 20 and the first heat conducting member 43, and the large-area heat conducting plate 45 contacts between the first heat conducting member 43 and the first heat source 20, so that the heat of the first heat source 20 can be quickly conducted to the first heat conducting member 43, and the heat conducting effect of the first heat conducting member 43 is improved. In such embodiments, the heat-conducting plate 45 is a plate-like body having an area greater than the area of the first heat source 20. In some embodiments, the heat conducting plate 45 is a copper sheet with high heat conductivity coefficient, but the present disclosure is not limited thereto.

Referring to fig. 2 to 7, in some embodiments in which the heat dissipation module 40 includes the heat conduction plate 45, the area of the heat conduction plate 45 is larger than the area of the through hole 113, and the heat conduction plate 45 completely shields the through hole 113 as shown in fig. 2. The heat conducting plate 45 includes a first surface 451 and a second surface 452 that are oppositely disposed, the heat conducting plate 45 is disposed on the upper surface 111 of the first housing 11, the second surface 452 covers the through hole 113 and abuts against the upper surface 111 around the through hole 113, the first heat conducting member 43 abuts against the first surface 451 of the heat conducting plate 45, and the first heat source 20 is disposed in the housing 10 at a position corresponding to the through hole 113 and abuts against the second surface 452.

Thereby, the heat conductive plate 45 is stably supported against the upper surface 111 of the first housing 11 and can simultaneously contact the first heat source 20. In such embodiments, the second surface 452 of the heat conducting plate 45 further includes a protrusion 4522, the shape and size of the protrusion 4522 is smaller than the shape and size of the through hole 113, when the second surface 452 of the heat conducting plate 45 is abutted against the upper surface 111 of the first housing 11, the protrusion 4522 of the heat conducting plate 45 penetrates into the through hole 113 to be in contact with the first heat source 20 in the first housing 11.

In these embodiments, the shape of the groove 118 communicating between the through hole 113 and the through hole 117 at the position corresponding to the through hole 113 corresponds to the shape of the heat conducting plate 45, so that the heat conducting plate 45 can be more conveniently assembled and can be stably accommodated in the groove 118 to correspond to the through hole 113 and the first heat source 20, and the heat conducting plate 45 can be more conveniently fixed on the upper surface 111 of the first housing 11 by various fixing means, and is fixed on the first housing 11 around the heat conducting plate 45 by screw locking members as shown in fig. 5.

Referring to fig. 3 to 5, in some embodiments, the electronic device further includes a circuit board 50, the circuit board 50 is disposed in the housing 10 in a direction parallel to the lower surface 112, the first heat source 20 and the second heat source 30 are respectively located at two opposite sides of the circuit board 50, and the first heat source 20 and the second heat source 30 are respectively disposed at different height positions in the housing 10. In such embodiments, the first heat source 20 is disposed on a side of the circuit board 50 near the lower surface 112, and the second heat source 30 is disposed on a side of the circuit board 50 far from the lower surface 112. Therefore, the first heat source 20 and the second heat source 30 can be located at different height positions in the housing 10, the first heat source 20, the first fan 41 for dissipating heat from the first heat source 20, and the first heat conducting member 43 can be as close to the upper surface 111 of the first housing 11 as possible, and the second heat conducting member 44 for dissipating heat from the second heat source 30 can be disposed at a position close to the second housing 12, so that the heat dissipation module 40 can fully dissipate heat from the first heat source 20 and the second heat source 30 at different height positions, and the space utilization in the housing 10 can be improved. In some embodiments, the first heat source 20 and the second heat source 30 may be, for example, a cpu or a display card, but the disclosure is not limited thereto. In some embodiments, the first heat conducting member 43 and the second heat conducting member 44 are, for example, heat pipes (heat pipes) or flat copper pipes with high heat conductivity, but the present application is not limited thereto.

Referring to fig. 5-8, fig. 8 is a partial cross-sectional view taken along the line 8-8 in fig. 1. In the present embodiment, the electronic device further includes a bonding unit 60 for bonding the heat-conducting plate 45 and the circuit board 50, so as to ensure that the heat-conducting plate 45 can be in contact with the first heat source 20 on the circuit board 50 under a predetermined pressure. In such embodiments, the circuit board 50 is not directly bonded to the heat conductive plate 45, but bonded to the heat conductive plate 45 through the bonding unit 60, where the relative position of the circuit board 50 with respect to the heat conductive plate 45 is held by the bonding unit 60 fixed to the heat conductive plate 45.

Referring to fig. 5 to 8, in the present embodiment, the combining unit 60 includes a combining element 61, a fixing element 62 and a locking element 63, the combining element 61 includes a fixing section 611 and a cantilever section 612 that are connected, the fixing element 62 fixes the combining element 61 on the second surface 452 of the heat-conducting plate 45 and defines a fixing section 611, two ends of the fixing section 611 define cantilever sections 612 respectively, and the locking element 63 is locked on the cantilever sections 612 through the circuit board 50. Here, since one end of the cantilever section 612 is connected to the fixed section 611 and the other end is a free end, when the locking member 63 is locked to the circuit board 50 by the cantilever section 612, the end of the cantilever section 612 connected to the fixed section 611 limits the locking depth of the cantilever section 612 and the locking member 63 locked on the cantilever section 612, and the cantilever section 612 is limited by the fixed section 611 to stretch the locking member 63 to avoid damage to the circuit board 50 due to excessive locking force of the locking member 63.

Referring to fig. 5-8, in some embodiments, the securing member 62 of the coupling unit 60 may be, but is not limited to, a rivet or a screw lock. In these embodiments, the number of the fixing members 62 is two, the two fixing members 62 are disposed at the middle position of the combining member 61 and fixed to the heat conducting plate 45, the range between the two fixing members 62 defines the fixing section 611, and the range between each fixing member 62 and the two free ends of the combining member 61 is defined as the cantilever section 612.

Referring to fig. 4 to 7, in the present embodiment, the number of the bonding elements 61 of the bonding unit 60 is two, and the bonding elements 61 are in a strip structure, and the two bonding elements 61 are disposed on the second surface 452 of the heat-conducting plate 45, where the two bonding elements 61 are parallel to each other and located on opposite sides of the through hole 113. In these embodiments, the number of cantilever segments 612 of each connector 61 is two, and each cantilever segment 612 is respectively connected to two ends of the fixed segment 611. Therefore, the circuit board 50 can be locked to the connecting piece 61 fixed on the heat conducting plate 45 by the connecting unit 60 through the four locking pieces 63, and each locking piece 63 can be configured at four corner positions corresponding to the through hole 113, so that locking stability between the connecting unit 60 and the circuit board 50 is improved.

Referring to fig. 5 to 8, in some embodiments, the coupling unit 60 further includes a nut 64 disposed at an end of the cantilever portion 612 away from the fixing portion 611, and the locking member 63 is locked to the nut 64 through the circuit board 50, thereby facilitating locking of the locking member 63. In some embodiments where the coupling unit 60 includes a nut 64, the nut 64 includes a sleeve 641 and a head 642, the sleeve 641 includes an inner thread groove, the head 642 is a flat plate having an outer contour larger than the sleeve 641, and the nut 64 is movably disposed through the end of the cantilever portion 612 away from the fixed portion 611 with the sleeve 641. After the locking member 63 is locked to the sleeve portion 641 of the nut 64 through the circuit board 50, the nut 64 abuts against the heat conducting plate 45 and the coupling member 61 with the head portion 642. In these embodiments, the second surface 452 of the heat-conducting plate 45 includes a plurality of positioning slots 4521, the position of each positioning slot 4521 corresponds to the locking position of the locking member 63, and the shape of each positioning slot 4521 corresponds to the shape of the head 642 of the nut 64, so that each positioning slot 4521 can provide a preliminary positioning on the heat-conducting plate 45 when the nut 64 is assembled, and the cantilever 612 can limit the falling of the nut 64 after the connecting member 61 is fixed on the heat-conducting plate 45 by the fixing section 611, so that the floating property of the locking member 63 locked on the nut 64 can be improved by the displaceable configuration of the nut 64, and the manufacturing process and the production cost of the connecting member 61 can be simplified.

In some embodiments, the nut 64 is not limited to being movably disposed through the cantilever section 612, but the nut 64 may also be the cantilever section 612 that includes only the sleeve portion 641 and is directly integrally formed with the coupling member 61.

It should be noted that, since the locking pressures that the circuit board 50 can bear are different, in order to adjust the locking pressure between the combining unit 60 and the circuit board 50, the material, the thickness of the combining member 61 or the length of the cantilever section 612 can be changed correspondingly to change the floating stroke of the cantilever section 612, so as to relatively control the locking pressure of the locking member 63, thereby ensuring that the circuit board 50 is not damaged due to the excessive locking pressure of the locking member 63.

Referring to fig. 3 and 4, in some embodiments, the electronic device further includes two heat dissipation fin sets 70, wherein one heat dissipation fin set 70 is disposed at the through hole 117 and located at the first air outlet 411 of the first fan 41, and the other heat dissipation fin set 70 is disposed at the second air outlet 421 of the second fan 42. In these embodiments, the first heat conducting member 43 is disposed at one end of the first fan 41 and abuts against the heat dissipating fin set 70 at the first air outlet 411, and the second heat conducting member 44 is disposed at one end of the second fan 42 and abuts against the heat dissipating fin set 70 at the second air outlet 421. Thereby, the heat dissipation efficiency is improved by the arrangement of the heat dissipation fin group 70.

Referring to fig. 9, in the present embodiment, the second housing 12 includes a main frame 121 and a plate 122, the main frame 121 is assembled to the side wall 114, and the plate 122 is detachably disposed on the main frame 121, so that a user can replace or repair the electronic components in the housing 10 after removing the plate 122 through the detachable plate 122. In these embodiments, the main frame 121 is a plate-shaped structure with an outer contour corresponding to the contour of the side wall 114 for assembling on the side wall 114, the main frame 121 has a plurality of assembling ports 1211, and the position and shape of each assembling port 1211 are corresponding to various electronic components in the housing 10, and the plate 122 is detachably assembled at each assembling port 1211, so that a user can conveniently disassemble the plate 122 for replacing or maintaining various components in the housing 10.

Referring to fig. 9, in some embodiments in which the second housing 12 includes the detachable plate 122, the number of the plates 122 may be plural, and the positions of the plates 122 may be the positions corresponding to the first fan 41, the second fan 42, or the second heat source 30, respectively, so as to facilitate maintenance or replacement of the first fan 41, the second fan 42, or the second heat source 30.

Referring to fig. 3 and 9, in some embodiments of the plate 122 corresponding to the first fan 41 or the second fan 42, each plate 122 further includes a plurality of heat dissipation holes 1221, and the heat dissipation holes 1221 of each plate 122 can ensure that the first fan 41 or the second fan 42 can smoothly draw in the external air for dissipating heat in addition to the flow path of the air flow entering the housing 10. In these embodiments, the first fan 41 and the second fan 42 are centrifugal fans, the first fan 41 includes a first air inlet 412, the opening directions of the first air inlet 412 and the first air outlet 411 are perpendicular to each other, the second fan 42 includes a second air inlet 422, the opening directions of the second air inlet 422 and the second air outlet 421 are perpendicular to each other, thereby, the first air inlet 412 of the first fan 41 and the second air inlet 422 of the second fan 42 can correspond to the position of the heat dissipation hole 1221 of the plate 122 of the second housing 12, and the first air outlet 411 and the second air outlet 421 can correspond to the position of the air flow channel 116 of the side wall 114 of the first housing 11, thereby ensuring smooth air flow into and out of the first fan 41 and the second fan 42 and ensuring heat dissipation effect.

Although the present disclosure has been described with reference to certain embodiments, it is not intended to limit the disclosure to the particular embodiments disclosed, but on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the disclosure. The scope of the present disclosure is therefore intended to be defined only by the appended claims.

Claims

1. An electronic device, comprising:

a housing, comprising:

the first shell comprises an upper surface, a lower surface, a through hole and a side wall, wherein the upper surface and the lower surface are opposite to each other, the through hole penetrates through the upper surface and the lower surface, and the side wall extends along the outline of the lower surface in a direction away from the upper surface; and

the second shell is arranged at one end of the side wall, which is far away from the upper surface;

the first heat source is arranged in the shell and corresponds to the through hole;

a second heat source disposed in the housing; and

a heat dissipating module, comprising:

the first fan comprises a first air outlet, and is arranged at one side of the first shell;

the second fan comprises a second air outlet, the second fan is arranged on the other side of the first shell and is adjacent to the second heat source, and the first air outlet and the second air outlet are positioned on the opposite sides of the side wall;

one end of the first heat conducting piece is assembled on the first fan, and the other end of the first heat conducting piece is positioned at the position of the upper surface side corresponding to the first heat source; and

one end of the second heat conducting piece is assembled on the second fan, and the other end of the second heat conducting piece is positioned on the lower surface side and is abutted against the second heat source.

2. The electronic device of claim 1, wherein the first housing further comprises two partition walls disposed on the lower surface and defining two non-waterproof areas and a waterproof area with the side wall, respectively, the first heat source and the second heat source being both located in the waterproof area.

3. The electronic device of claim 2, wherein the first fan and the second fan are respectively located in two non-waterproof areas.

4. The electronic device of claim 1, wherein the first housing further comprises a through hole and a groove, the through hole penetrates through the upper surface and the lower surface, the groove is disposed on the upper surface and communicates with the through hole and the through hole, the first heat conducting member is disposed in the groove, and one end of the first heat conducting member corresponds to the through hole, and the other end of the first heat conducting member is disposed at the through hole.

5. The electronic device of claim 4, further comprising two heat sink fin sets, wherein one of the heat sink fin sets is disposed at the through hole and located at the first air outlet of the first fan, and the other heat sink fin set is disposed at the second air outlet of the second fan.

6. The electronic device of claim 5, wherein the first heat conducting member is disposed at the end of the first fan and abuts against one of the heat dissipating fin groups, and the second heat conducting member is disposed at the end of the second fan and abuts against the other of the heat dissipating fin groups.

7. The electronic device of claim 1, wherein the second housing comprises a main frame and a plate, the main frame is assembled to the side wall, and the plate is detachably disposed to the main frame.

8. The electronic device of claim 7, wherein the plate is positioned to correspond to the position of the first fan.

9. The electronic device of claim 7, wherein the plate is positioned to correspond to the position of the second heat source and the second fan.

10. The electronic device of claim 7, wherein the plate has a plurality of heat dissipation holes.

11. The electronic device of claim 1, further comprising an input device disposed on the upper surface and covering the first heat source and the first heat conductive member.

12. The electronic device of claim 1, further comprising a circuit board, wherein the first heat source and the second heat source are located on opposite sides of the circuit board, respectively.

13. The electronic device of claim 12, wherein the heat dissipating module further comprises a heat conducting plate, the heat conducting plate comprises a first surface and a second surface which are oppositely arranged, the heat conducting plate is arranged at the through hole, the first heat conducting piece is abutted against the first surface, and the first heat source is abutted against the second surface.

14. The electronic device of claim 13, further comprising a bonding unit, wherein the circuit board is bonded to the heat conductive plate through the bonding unit.

15. The electronic device of claim 14, wherein the coupling unit comprises a coupling member and a locking member, the coupling member comprises a fixing section and a cantilever section connected with each other, the fixing section is fixed on the second surface, and the locking member is locked on the cantilever section through the circuit board.

16. The electronic device of claim 15, wherein the coupling unit further comprises a nut disposed at an end of the cantilever section away from the fixed section, and the locking member is locked to the nut through the circuit board.

17. The electronic device of claim 15, wherein the connecting member has a strip structure, and the connecting member comprises two cantilever sections respectively connected to two ends of the fixing section.

18. The electronic device of claim 17, wherein the number of the bonding members is two, and two of the bonding members are disposed in parallel on the heat conductive plate.

19. An electronic device, comprising:

a housing;

a circuit board arranged in the shell;

the first heat source is arranged on the circuit board;

a heat dissipating module, comprising:

a first fan arranged in the shell;

a heat-conducting plate, which comprises a first surface and a second surface which are oppositely arranged, wherein the second surface is abutted against the first heat source; and

one end of the first heat conducting piece is assembled on the first fan, and the other end of the first heat conducting piece is abutted against the first surface of the heat conducting plate; and

a binding unit comprising:

the connecting piece comprises a fixed section and a cantilever section which are connected, and the fixed section is fixed on the second surface of the heat conducting plate; and

the locking piece penetrates through the circuit board and is locked on the cantilever section.

20. The electronic device of claim 19, wherein the coupling unit further comprises a nut disposed at an end of the cantilever section away from the fixed section, and the locking member is locked to the nut through the circuit board.