CN219893693U

CN219893693U - Handheld device and heat dissipation module thereof

Info

Publication number: CN219893693U
Application number: CN202320549329.8U
Authority: CN
Inventors: 萧百佑; 秦汇伦; 李哲纬; 叶靖宪; 詹智伟
Original assignee: Delta Electronics Inc
Current assignee: Delta Electronics Inc
Priority date: 2023-03-21
Filing date: 2023-03-21
Publication date: 2023-10-24
Anticipated expiration: 2033-03-21

Abstract

The utility model provides a handheld device and a heat radiation module thereof. The shell is internally provided with a containing space, one side of the shell is provided with a through hole, and the other side of the shell is provided with an air outlet which is communicated with the containing space. The temperature equalizing plate covers the through hole and is provided with an air inlet which is communicated with the accommodating space. The impeller is pivoted on the shell and accommodated in the accommodating space, the impeller is provided with an air inlet side and an air outlet side, the air inlet side is configured corresponding to the air inlet, and the air outlet side is configured corresponding to the air outlet.

Description

Handheld device and heat dissipation module thereof

Technical Field

The present utility model relates to a handheld device and a heat dissipation module thereof, and more particularly, to a handheld device with a temperature equalization plate integrated in a housing and a heat dissipation module thereof.

Background

Existing hand-held devices are limited by the limited space within them, and the heat dissipation module also requires compression. Generally, one of the heat dissipation modules is a passive heat dissipation module such as a temperature equalizing plate or a heat pipe, which transfers a heat source to the device housing for dissipating heat. The heat dissipation efficiency is still limited by the heat dissipation capability of the device housing, and heat is transferred to the device housing, which easily causes the surface temperature of the handheld device to be too high. The other type of heat dissipation module is an active heat dissipation module with a fan, the fan is matched with a runner in the handheld device, and the fan drives air flow to dissipate heat through the runner. The heat dissipation efficiency is limited by the size of the fan and the internal space of the handheld device. If the power output of the fan wheel is increased to improve the heat dissipation efficiency, noise and vibration are easily generated. Although the passive heat dissipation module is used for transferring heat energy to the active heat dissipation module, the passive heat dissipation module is not limited by space because of no arrangement, but the passive heat dissipation module has larger volume and is not easy to be led into the handheld device.

In view of the above, the present inventors have made intensive studies and have made an effort to solve the above-described problems in combination with the application of the theory, which is an object of improvement by the present inventors.

Disclosure of Invention

The utility model provides a handheld device with a temperature equalizing plate integrated in a shell and a heat dissipation module thereof.

The utility model provides a heat radiation module which comprises a shell, a temperature equalizing plate and an impeller. The shell is provided with a bottom plate and three side plates which are vertically connected with the bottom plate. The temperature equalizing plate is arranged on the opposite side of the bottom plate, the temperature equalizing plate is connected with each side plate to form a containing space and an air outlet communicated with the containing space, and the temperature equalizing plate is provided with an air inlet communicated with the containing space. The impeller is pivoted on the shell and accommodated in the accommodating space, the impeller is provided with an air inlet side and an air outlet side, the air inlet side is configured corresponding to the air inlet, and the air outlet side is configured corresponding to the air outlet.

In an embodiment of the utility model, the impeller is provided with a rotating shaft rod, the axial direction of the rotating shaft rod passes through the air inlet, and the air outlet is configured at one side corresponding to the periphery of the impeller. The temperature equalizing plate is provided with a pressing strip which stretches across the air inlet and is stopped at one end of the rotating shaft rod.

In an embodiment of the utility model, the through port is connected with the air outlet. A fin group is attached to the temperature equalizing plate and is configured corresponding to the air outlet.

In an embodiment of the utility model, at least a portion of the temperature equalization plate extends beyond the shell, the temperature equalization plate is provided with a fold line, the fold line is positioned on the portion of the temperature equalization plate beyond the shell, a cavity is arranged in the temperature equalization plate, the cavity is provided with a supporting rib, and the supporting rib spans across the fold line.

The utility model further provides a handheld device, which comprises a shell, a heat dissipation module and a main circuit board. The heat dissipation module is accommodated in the shell, the heat dissipation module comprises a shell, a temperature equalization plate and an impeller, an accommodating space is formed in the shell, a through hole is formed in one side of the shell, an air outlet is formed in the other side of the shell, the air outlet is communicated with the accommodating space, the temperature equalization plate covers the through hole and is provided with an air inlet, the air inlet is communicated with the accommodating space, the impeller is pivoted to the shell and accommodated in the accommodating space, the impeller is provided with an air inlet side and an air outlet side, the air inlet side corresponds to the air inlet configuration, and the air outlet side corresponds to the air outlet configuration. The main circuit board is accommodated in the shell, and a heat source element is arranged on the main circuit board and contacts with the temperature equalizing plate.

In an embodiment of the utility model, the impeller is provided with a rotary shaft rod, the axial direction of the rotary shaft rod passes through the air inlet, and the air outlet is configured at one side corresponding to the periphery of the impeller. In one embodiment of the utility model, a pressing strip is arranged on the temperature equalizing plate, the pressing strip stretches across the air inlet, and the pressing strip is stopped at one end of the rotating shaft rod.

In an embodiment of the utility model, the temperature equalizing plate is provided with a fold line in cooperation with the shape bending of the shell, a cavity is arranged in the temperature equalizing plate, the cavity is provided with a supporting rib, and the supporting rib spans across the fold line.

In one embodiment of the present utility model, the housing is provided with an air outlet, and the air outlet is aligned with the air outlet.

The utility model also provides a handheld device which comprises a shell, a heat dissipation module and a plurality of electronic elements. The heat dissipation module is accommodated in the shell, the heat dissipation module comprises a shell, a temperature equalization plate and an impeller, an accommodating space is formed in the shell, a through hole is formed in one side of the shell, an air outlet is formed in the other side of the shell, the air outlet is communicated with the accommodating space, the temperature equalization plate covers the through hole and is provided with an air inlet, the air inlet is communicated with the accommodating space, the impeller is pivoted to the shell and is accommodated in the accommodating space, the impeller is provided with an air inlet side and an air outlet side, the air inlet side corresponds to the air inlet configuration, the air outlet side corresponds to the air outlet configuration, and the temperature equalization plate divides the space inside the shell into a runner area and an element area. The electronic components are accommodated in the component area, and at least one of the electronic components contacts the temperature equalizing plate.

The handheld device and the heat dissipation module thereof are provided with the temperature equalizing plate integrated in the shell, so that the temperature equalizing plate can contact the heat source element and spread the heat generated by the heat source element to the whole temperature equalizing plate and can be transmitted into the heat dissipation module. The temperature equalizing plate can extend to the whole handheld device along the inner wall surface of the shell so as to radiate heat energy at any position inside the handheld device. And a gap is formed between the temperature equalizing plate and the shell to serve as a flow passage area, so that heat dissipation air flow is isolated from the electronic element, and air flow is prevented from entering the electronic system, and the system can meet the preset waterproof and dustproof requirements.

Drawings

FIG. 1 is a schematic perspective view of a heat dissipating module of the present utility model;

FIG. 2 is a cross-sectional view and a partial enlarged view of a heat dissipating module of the present utility model;

FIG. 3 is a schematic perspective view of a hand-held device of the present utility model;

FIG. 4 is a side view of the handheld device of the present utility model;

FIG. 5 is a cross-sectional view of a hand-held device of the present utility model;

fig. 6 is another cross-sectional view of the handheld device of the present utility model and an enlarged view of a portion thereof.

[ symbolic description ]

10 casing

11 flow field

12 element region

13 exhaust port

14 air inlet

20,20a Heat dissipating Module

100 casing body

101 accommodating space

102 through port

103 air outlet

110 floor board

120a,120b,120c side panels

200:temperature equalizing plate

200a flow channel side

200b component side

201 air inlet

202 cavity(s)

210 fold line

220 supporting rib

230 press bar

240 fin group

300 impeller

301 air intake side

302, air outlet side

310 rotating shaft lever

400 electronic component

410 main circuit board

420 heat source element

Detailed Description

Referring to fig. 1 and 2, an embodiment of the utility model provides a heat dissipation module 20, which includes a housing 100, a temperature equalization plate 200 and an impeller 300, wherein the housing 100 corresponds to the impeller 300. As shown in fig. 1 and 2, the heat dissipation module 20 may share the same temperature equalizing plate 200 with another heat dissipation module 20 a.

In this embodiment, the housing 100 is a flat rectangular plastic housing, the housing 100 has a bottom plate 110 and three side plates 120 vertically connected to the bottom plate 110, and a receiving space 101 is formed in the housing 100. The casing 100 has a through hole 102 on the opposite side of the bottom plate 110, and an air outlet 103 is disposed on the other side of the casing 100. Specifically, the through hole 102 is disposed on one side surface of the casing 100, and the air outlet 103 is provided on the peripheral surface of the casing 100. The through hole 102 and the air outlet 103 are respectively communicated with the accommodating space 101, and the periphery of the through hole 102 is connected with the periphery of the air outlet 103.

The temperature equalizing plate 200 is disposed on the housing 100 and located on an opposite side of the bottom plate 110, the temperature equalizing plate 200 covers the through hole 102 of the housing 100, and at least a portion of the temperature equalizing plate 200 extends beyond the housing 100 for receiving the heat source. Specifically, the temperature equalizing plate 200 is connected to the three side plates 120 to form a housing space 101 and an air outlet 103 communicating with the housing space 101.

The temperature equalizing plate 200 is provided with an air inlet 201, the range of the air inlet 201 is located within the range of the through hole 102, and the air inlet 201 is communicated with the accommodating space 101. In this embodiment, the temperature uniformity plate 200 may be optionally provided with a fold line 210, and the temperature uniformity plate 200 may be folded along the fold line 210 according to the configuration requirement. The temperature equalization plate 200 has a cavity 202 therein, the cavity 202 is provided with at least one supporting rib 220, and the supporting rib 220 is disposed across the fold line 210. When the temperature-equalizing plate 200 is bent, the supporting ribs 220 are supported at the fold line 210 to prevent the cavity 202 from collapsing at the fold line 210. The support ribs 220 may be added according to the use requirement, and the present utility model is not limited to the number of the support ribs 220.

The impeller 300 is pivotally disposed on the housing 100 and is accommodated in the accommodating space 101, the impeller 300 has a rotating shaft 310, an air inlet side 301 and an air outlet side 302, the air inlet side 301 is located on the side of one end of the rotating shaft 310, and the air outlet side 302 is located on one side of the periphery of the impeller 300. The air inlet 201 is disposed corresponding to the air inlet 301, so that the axial direction of the rotating shaft 310 passes through the air inlet 201, and the air outlet 103 is disposed corresponding to one side of the periphery of the impeller 300, so that the air outlet 302 is disposed corresponding to the air outlet 103.

In the present embodiment, a fin set 240 is attached to the temperature equalizing plate 200, and the fin set 240 is disposed corresponding to the air outlet 103. Specifically, the flow direction of the fin group 240 is arranged along the opening direction of the air outlet 103.

In the present embodiment, a bead 230 is attached to the temperature equalization plate 200, the bead 230 is disposed across the air inlet 201, and the bead 230 stops against the air inlet 301 of the impeller 300, thereby preventing the impeller 300 from floating when rotating. Specifically, the compression bar 230 is stopped at one end of the rotating shaft 310 corresponding to the air inlet side 301 of the impeller 300. The bead 230 crossing the air inlet 201 is used as a stop structure of the impeller 300, so that the increase of the thickness of the heat dissipation module 20 caused by the addition of the stop structure can be avoided.

Referring to fig. 3 and 4, another embodiment of the present utility model provides a handheld device, which includes a housing 10, a heat dissipation module 20 as in the previous embodiment, and a plurality of electronic components 400.

The housing 10 is provided with an air outlet 13 and an air inlet 14, and the heat dissipation module 20 and the electronic component 400 are accommodated in the housing 10.

Referring to fig. 3 and 4, the heat dissipation module 20, like the previous embodiments, includes a housing 100, a temperature equalization plate 200 and an impeller 300. The housing 100 has a receiving space 101 therein, one side of the housing 100 has a through hole 102, and the other side of the housing 100 has an air outlet 103, wherein the air outlet 103 is communicated with the receiving space 101. The temperature equalizing plate 200 covers the through hole 102 and is provided with an air inlet 201, and the air inlet 201 is communicated with the accommodating space 101. The heat dissipation module 20 may share the same temperature equalizing plate 200 with another heat dissipation module 20 a.

Referring to fig. 5 and 6, in the present embodiment, the space inside the housing 10 is divided into a flow channel region 11 and an element region 12 by the temperature equalizing plate 200, two opposite surfaces of the temperature equalizing plate 200 are configured as a flow channel side 200a and an element side 200b, the flow channel side 200a is configured corresponding to the flow channel region 11, and the element side 200b is configured corresponding to the element region 12. At least a portion of the temperature equalization plate 200 extends beyond the housing 100, and an edge of the temperature equalization plate 200 may extend to contact an inner wall of the housing 10 to isolate the flow channel region 11 from the element region 12. In the present embodiment, the temperature equalization plate 200 is bent in accordance with the shape of the housing 10 to form a fold line 210, a cavity 202 is formed in the temperature equalization plate 200, the cavity 202 is provided with a supporting rib 220, and the supporting rib 220 is disposed across the fold line 210. The impeller 300 is pivotally disposed on the housing 100 and is accommodated in the accommodating space 101, the impeller 300 has an air inlet side 301 and an air outlet side 302, the air inlet side 301 is disposed corresponding to the air inlet 201, and the air outlet side 302 is disposed corresponding to the air outlet 103.

Referring to fig. 3 and 6, in the present embodiment, the number and positions of the air outlets 13 of the housing 10 are matched with the number and positions of the air outlets 103 of the corresponding heat dissipation module 20, and each air outlet 13 is aligned with the corresponding air outlet 103. The air inlets 14 are arranged corresponding to the flow channel regions 11 to communicate with the external environment and the flow channel regions 11, and the present utility model is not limited to the positions and the number of the air inlets 14, and may be configured to provide the air inlets 14 (as shown in fig. 6) corresponding to the respective heat dissipation modules 20, or may be configured such that the plurality of heat dissipation modules 20 share the same air inlet 14 via the flow channel regions 11.

In the present embodiment, a fin set 240 is attached to the temperature equalizing plate 200, and the fin set 240 is disposed corresponding to the air outlet 103. Specifically, the fin group 240 is disposed between the air outlet 103 of the heat dissipating module 20 and the air outlet 13 of the housing 10, and the flow direction of the fin group 240 is along the opening direction of the air outlet 103.

Referring to fig. 3 to 5, the electronic components 400 are accommodated in the component area 12, and at least one of the electronic components 400 contacts the temperature uniformity plate 200. In the present embodiment, the electronic components 400 at least include a main circuit board 410 and a heat source component 420, the heat source component 420 is disposed on the main circuit board 410, and the heat source component 420 contacts the component side 200b of the temperature uniformity plate 200. Generally, the heat source element 420 is a Central Processing Unit (CPU) chip.

Referring to fig. 6, in the present embodiment, when the impeller 300 rotates along the rotating shaft 310, air can be sucked into the accommodating space 101 through the air inlet 201, and air flow is output through the air outlet 103. The air in the housing 10 passes through the flow passage area 11, the flow passage side 200a of the temperature equalizing plate 200, the air enters the accommodating space 101 through the air inlet 201, and then passes through the fin group 240 through the air outlet 103 and then passes through the air outlet 13.

The handheld device and the heat dissipation module 20 thereof of the present utility model, wherein the heat dissipation module 20 has the temperature equalization plate 200 integrated in the housing 100, so that the temperature equalization plate 200 can contact the heat source element 420 and spread the heat generated by the heat source element 420 to the whole temperature equalization plate 200 and can be transferred into the heat dissipation module 20, instead of just blowing air to the temperature equalization plate 200 outside thereof by a fan for heat dissipation. The temperature equalizing plate 200 can be bent in accordance with the shape of the housing 10 of the handheld device, and can cover the inner wall surface of the housing 10, and extend to the entire handheld device along the inner wall surface of the housing 10 to dissipate heat energy at any position inside the handheld device. Furthermore, a gap is formed between the temperature equalizing plate 200 and the housing 10 as a flow path region 11, and the flow path region 11 is directly connected to the exhaust port 13 via the casing 100, thereby isolating the heat dissipation air flow from the electronic component 400 to prevent the air flow from entering the electronic system so that the system can meet the predetermined waterproof and dustproof requirements.

The foregoing description of the preferred embodiments of the present utility model is not intended to limit the scope of the utility model, but rather to limit the scope of the utility model to the equivalents of the claims to which the utility model pertains.

Claims

1. A heat dissipating module, comprising:

the shell is provided with a bottom plate and three side plates which are vertically connected with the bottom plate;

the temperature equalizing plate is arranged on the opposite side of the bottom plate, the temperature equalizing plate is connected with each side plate to form a containing space and an air outlet communicated with the containing space, the temperature equalizing plate is provided with an air inlet, and the air inlet is communicated with the containing space; a kind of electronic device with high-pressure air-conditioning system

The impeller is pivoted on the shell and accommodated in the accommodating space, and is provided with an air inlet side and an air outlet side, wherein the air inlet side is configured corresponding to the air inlet, and the air outlet side is configured corresponding to the air outlet.

2. The heat dissipating module of claim 1, wherein the impeller has a rotating shaft passing axially through the air inlet, and the air outlet is disposed corresponding to one side of the periphery of the impeller.

3. The heat dissipating module of claim 2, wherein a bead is disposed on the temperature equalizing plate, the bead spans the air inlet and the bead stops at one end of the rotating shaft.

4. The heat dissipating module of claim 1, wherein one side of the housing has a through opening, and the through opening is connected to the air outlet.

5. The heat dissipating module of claim 1, wherein a fin set is attached to the temperature equalizing plate and the fin set is disposed corresponding to the air outlet.

6. The heat dissipating module of claim 1, wherein at least a portion of the temperature equalization plate extends beyond the housing, the temperature equalization plate has a fold line located on a portion of the temperature equalization plate beyond the housing, the temperature equalization plate has a cavity therein, the cavity has a support rib, and the support rib is disposed across the fold line.

7. A hand-held device, comprising:

a housing;

the heat dissipation module is accommodated in the shell and comprises a shell, a temperature equalization plate and an impeller, wherein an accommodating space is formed in the shell, one side of the shell is provided with a through hole, the other side of the shell is provided with an air outlet, the air outlet is communicated with the accommodating space, the temperature equalization plate covers the through hole and is provided with an air inlet, the air inlet is communicated with the accommodating space, the impeller is pivoted on the shell and accommodated in the accommodating space, the impeller is provided with an air inlet side and an air outlet side, the air inlet side is configured corresponding to the air inlet, and the air outlet side is configured corresponding to the air outlet; a kind of electronic device with high-pressure air-conditioning system

The main circuit board is accommodated in the shell, and is provided with a heat source element which contacts the temperature equalizing plate.

8. The hand-held device according to claim 7, wherein the impeller has a rotating shaft, the axial direction of the rotating shaft passes through the air inlet, and the air outlet is disposed corresponding to one side of the periphery of the impeller.

9. The hand-held device according to claim 8, wherein a bead is provided on the temperature equalization plate, the bead straddles the air inlet and the bead is stopped at one end of the rotating shaft.

10. The hand-held device of claim 7, wherein the port is connected to the air outlet.

11. The hand-held device according to claim 7, wherein a fin set is attached to the temperature equalizing plate and the fin set is disposed corresponding to the air outlet.

12. The hand-held device according to claim 7, wherein the temperature equalization plate has a fold line in cooperation with the shape of the housing, the temperature equalization plate has a cavity therein, the cavity has a support rib, and the support rib is disposed across the fold line.

13. The hand-held device of claim 7, wherein the housing is provided with an air outlet, and the air outlet is aligned with the air outlet.

14. A hand-held device, comprising:

a housing;

the heat dissipation module is accommodated in the shell and comprises a shell, a temperature equalizing plate and an impeller, wherein an accommodating space is formed in the shell, one side of the shell is provided with a through hole, the other side of the shell is provided with an air outlet, the air outlet is communicated with the accommodating space, the temperature equalizing plate covers the through hole and is provided with an air inlet, the air inlet is communicated with the accommodating space, the impeller is pivoted in the shell and accommodated in the accommodating space, the impeller is provided with an air inlet side and an air outlet side, the air inlet side is configured corresponding to the air inlet, the air outlet side is configured corresponding to the air outlet, and the temperature equalizing plate divides the space inside the shell into a flow passage area and an element area; a kind of electronic device with high-pressure air-conditioning system

The electronic components are accommodated in the component area, and at least one of the electronic components contacts the temperature equalizing plate.

15. The hand-held device according to claim 14, wherein the impeller has a rotating shaft, the axial direction of the rotating shaft passes through the air inlet, and the air outlet is disposed corresponding to one side of the periphery of the impeller.

16. The hand-held device according to claim 15, wherein a bead is provided on the temperature equalization plate, the bead straddling the air inlet and the bead being stopped at one end of the rotating shaft.

17. The hand-held device of claim 14, wherein the port is connected to the air outlet.

18. The device of claim 14, wherein a fin set is attached to the temperature equalizing plate and the fin set is disposed corresponding to the air outlet.

19. The hand-held device according to claim 14, wherein the temperature equalization plate has a fold line in cooperation with the shape of the housing, the temperature equalization plate has a cavity therein, the cavity has a support rib, and the support rib is disposed across the fold line.

20. The hand-held device of claim 14, wherein the housing is provided with an air outlet, and the air outlet is aligned with the air outlet.