TW202411399A - 導熱片、散熱裝置以及導熱片的製造方法 - Google Patents

導熱片、散熱裝置以及導熱片的製造方法 Download PDF

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Publication number
TW202411399A
TW202411399A TW112127414A TW112127414A TW202411399A TW 202411399 A TW202411399 A TW 202411399A TW 112127414 A TW112127414 A TW 112127414A TW 112127414 A TW112127414 A TW 112127414A TW 202411399 A TW202411399 A TW 202411399A
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TW
Taiwan
Prior art keywords
thermally conductive
conductive sheet
heat
particles
sheet
Prior art date
Application number
TW112127414A
Other languages
English (en)
Chinese (zh)
Inventor
小舩美香
里卡多 米佐古奇 戈歌爾
Original Assignee
日商力森諾科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商力森諾科股份有限公司 filed Critical 日商力森諾科股份有限公司
Publication of TW202411399A publication Critical patent/TW202411399A/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW112127414A 2022-07-22 2023-07-21 導熱片、散熱裝置以及導熱片的製造方法 TW202411399A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
WOPCT/JP2022/028527 2022-07-22
PCT/JP2022/028527 WO2024018635A1 (ja) 2022-07-22 2022-07-22 熱伝導シート、放熱装置及び熱伝導シートの製造方法

Publications (1)

Publication Number Publication Date
TW202411399A true TW202411399A (zh) 2024-03-16

Family

ID=89617409

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112127414A TW202411399A (zh) 2022-07-22 2023-07-21 導熱片、散熱裝置以及導熱片的製造方法

Country Status (6)

Country Link
US (2) US20250285933A1 (https=)
JP (1) JPWO2024019173A1 (https=)
KR (1) KR20250038663A (https=)
CN (1) CN119137735A (https=)
TW (1) TW202411399A (https=)
WO (2) WO2024018635A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07207160A (ja) * 1994-01-11 1995-08-08 Toshiba Silicone Co Ltd シリコーン組成物およびその製造方法
JPH11135691A (ja) * 1997-10-31 1999-05-21 Hitachi Ltd 電子回路装置
JP3288029B2 (ja) 2000-03-08 2002-06-04 北川工業株式会社 成形体、並びに、熱伝導材及びその製造方法
JP2002026202A (ja) 2000-06-29 2002-01-25 Three M Innovative Properties Co 熱伝導性シート及びその製造方法
JP2008078380A (ja) * 2006-09-21 2008-04-03 Kaneka Corp 放熱シート
JP5866830B2 (ja) * 2011-07-04 2016-02-24 日立化成株式会社 熱伝導シート、放熱装置、及び熱伝導シートの製造方法
EP3419399B1 (en) * 2016-04-11 2020-08-26 Sekisui Polymatech Co., Ltd. Heat conductive sheet
US20200340757A1 (en) * 2019-04-29 2020-10-29 Nanotek Instruments, Inc. Expanded graphite-enhanced vapor-based heat transfer device and production process
JP6892725B1 (ja) * 2019-11-01 2021-06-23 積水ポリマテック株式会社 熱伝導性シート及びその製造方法

Also Published As

Publication number Publication date
JPWO2024019173A1 (https=) 2024-01-25
CN119137735A (zh) 2024-12-13
KR20250038663A (ko) 2025-03-19
US20250285933A1 (en) 2025-09-11
WO2024018635A1 (ja) 2024-01-25
US20260060078A1 (en) 2026-02-26
WO2024019173A1 (ja) 2024-01-25

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