KR20250038663A - 열전도 시트, 방열 장치 및 열전도 시트의 제조 방법 - Google Patents

열전도 시트, 방열 장치 및 열전도 시트의 제조 방법 Download PDF

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Publication number
KR20250038663A
KR20250038663A KR1020257003697A KR20257003697A KR20250038663A KR 20250038663 A KR20250038663 A KR 20250038663A KR 1020257003697 A KR1020257003697 A KR 1020257003697A KR 20257003697 A KR20257003697 A KR 20257003697A KR 20250038663 A KR20250038663 A KR 20250038663A
Authority
KR
South Korea
Prior art keywords
thermally conductive
conductive sheet
heat
metal component
shaped particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257003697A
Other languages
English (en)
Korean (ko)
Inventor
미카 코부네
리카르도 미조구치 고르골
Original Assignee
가부시끼가이샤 레조낙
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 레조낙 filed Critical 가부시끼가이샤 레조낙
Publication of KR20250038663A publication Critical patent/KR20250038663A/ko
Pending legal-status Critical Current

Links

Classifications

    • H01L23/3736—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H01L23/3733—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
KR1020257003697A 2022-07-22 2023-07-21 열전도 시트, 방열 장치 및 열전도 시트의 제조 방법 Pending KR20250038663A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PCT/JP2022/028527 WO2024018635A1 (ja) 2022-07-22 2022-07-22 熱伝導シート、放熱装置及び熱伝導シートの製造方法
JPPCT/JP2022/028527 2022-07-22
PCT/JP2023/026892 WO2024019173A1 (ja) 2022-07-22 2023-07-21 熱伝導シート、放熱装置及び熱伝導シートの製造方法

Publications (1)

Publication Number Publication Date
KR20250038663A true KR20250038663A (ko) 2025-03-19

Family

ID=89617409

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257003697A Pending KR20250038663A (ko) 2022-07-22 2023-07-21 열전도 시트, 방열 장치 및 열전도 시트의 제조 방법

Country Status (6)

Country Link
US (2) US20250285933A1 (https=)
JP (1) JPWO2024019173A1 (https=)
KR (1) KR20250038663A (https=)
CN (1) CN119137735A (https=)
TW (1) TW202411399A (https=)
WO (2) WO2024018635A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001250894A (ja) 2000-03-08 2001-09-14 Kitagawa Ind Co Ltd 熱伝導材及びその製造方法
JP2002026202A (ja) 2000-06-29 2002-01-25 Three M Innovative Properties Co 熱伝導性シート及びその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07207160A (ja) * 1994-01-11 1995-08-08 Toshiba Silicone Co Ltd シリコーン組成物およびその製造方法
JPH11135691A (ja) * 1997-10-31 1999-05-21 Hitachi Ltd 電子回路装置
JP2008078380A (ja) * 2006-09-21 2008-04-03 Kaneka Corp 放熱シート
JP5866830B2 (ja) * 2011-07-04 2016-02-24 日立化成株式会社 熱伝導シート、放熱装置、及び熱伝導シートの製造方法
EP3419399B1 (en) * 2016-04-11 2020-08-26 Sekisui Polymatech Co., Ltd. Heat conductive sheet
US20200340757A1 (en) * 2019-04-29 2020-10-29 Nanotek Instruments, Inc. Expanded graphite-enhanced vapor-based heat transfer device and production process
JP6892725B1 (ja) * 2019-11-01 2021-06-23 積水ポリマテック株式会社 熱伝導性シート及びその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001250894A (ja) 2000-03-08 2001-09-14 Kitagawa Ind Co Ltd 熱伝導材及びその製造方法
JP2002026202A (ja) 2000-06-29 2002-01-25 Three M Innovative Properties Co 熱伝導性シート及びその製造方法

Also Published As

Publication number Publication date
JPWO2024019173A1 (https=) 2024-01-25
CN119137735A (zh) 2024-12-13
US20250285933A1 (en) 2025-09-11
WO2024018635A1 (ja) 2024-01-25
US20260060078A1 (en) 2026-02-26
WO2024019173A1 (ja) 2024-01-25
TW202411399A (zh) 2024-03-16

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Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000