CN119137735A - 导热片、散热装置以及导热片的制造方法 - Google Patents

导热片、散热装置以及导热片的制造方法 Download PDF

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Publication number
CN119137735A
CN119137735A CN202380037697.7A CN202380037697A CN119137735A CN 119137735 A CN119137735 A CN 119137735A CN 202380037697 A CN202380037697 A CN 202380037697A CN 119137735 A CN119137735 A CN 119137735A
Authority
CN
China
Prior art keywords
thermally conductive
conductive sheet
heat
conductive layer
heat conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380037697.7A
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English (en)
Chinese (zh)
Inventor
小舩美香
里卡多·米佐古奇·戈歌尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Resonac Corp filed Critical Resonac Corp
Publication of CN119137735A publication Critical patent/CN119137735A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN202380037697.7A 2022-07-22 2023-07-21 导热片、散热装置以及导热片的制造方法 Pending CN119137735A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PCT/JP2022/028527 WO2024018635A1 (ja) 2022-07-22 2022-07-22 熱伝導シート、放熱装置及び熱伝導シートの製造方法
JPPCT/JP2022/028527 2022-07-22
PCT/JP2023/026892 WO2024019173A1 (ja) 2022-07-22 2023-07-21 熱伝導シート、放熱装置及び熱伝導シートの製造方法

Publications (1)

Publication Number Publication Date
CN119137735A true CN119137735A (zh) 2024-12-13

Family

ID=89617409

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380037697.7A Pending CN119137735A (zh) 2022-07-22 2023-07-21 导热片、散热装置以及导热片的制造方法

Country Status (6)

Country Link
US (2) US20250285933A1 (https=)
JP (1) JPWO2024019173A1 (https=)
KR (1) KR20250038663A (https=)
CN (1) CN119137735A (https=)
TW (1) TW202411399A (https=)
WO (2) WO2024018635A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07207160A (ja) * 1994-01-11 1995-08-08 Toshiba Silicone Co Ltd シリコーン組成物およびその製造方法
JPH11135691A (ja) * 1997-10-31 1999-05-21 Hitachi Ltd 電子回路装置
JP3288029B2 (ja) 2000-03-08 2002-06-04 北川工業株式会社 成形体、並びに、熱伝導材及びその製造方法
JP2002026202A (ja) 2000-06-29 2002-01-25 Three M Innovative Properties Co 熱伝導性シート及びその製造方法
JP2008078380A (ja) * 2006-09-21 2008-04-03 Kaneka Corp 放熱シート
JP5866830B2 (ja) * 2011-07-04 2016-02-24 日立化成株式会社 熱伝導シート、放熱装置、及び熱伝導シートの製造方法
EP3419399B1 (en) * 2016-04-11 2020-08-26 Sekisui Polymatech Co., Ltd. Heat conductive sheet
US20200340757A1 (en) * 2019-04-29 2020-10-29 Nanotek Instruments, Inc. Expanded graphite-enhanced vapor-based heat transfer device and production process
JP6892725B1 (ja) * 2019-11-01 2021-06-23 積水ポリマテック株式会社 熱伝導性シート及びその製造方法

Also Published As

Publication number Publication date
JPWO2024019173A1 (https=) 2024-01-25
KR20250038663A (ko) 2025-03-19
US20250285933A1 (en) 2025-09-11
WO2024018635A1 (ja) 2024-01-25
US20260060078A1 (en) 2026-02-26
WO2024019173A1 (ja) 2024-01-25
TW202411399A (zh) 2024-03-16

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