JPWO2024019173A1 - - Google Patents
Info
- Publication number
- JPWO2024019173A1 JPWO2024019173A1 JP2024535166A JP2024535166A JPWO2024019173A1 JP WO2024019173 A1 JPWO2024019173 A1 JP WO2024019173A1 JP 2024535166 A JP2024535166 A JP 2024535166A JP 2024535166 A JP2024535166 A JP 2024535166A JP WO2024019173 A1 JPWO2024019173 A1 JP WO2024019173A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/251—Organics
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/258—Metallic materials
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/028527 WO2024018635A1 (ja) | 2022-07-22 | 2022-07-22 | 熱伝導シート、放熱装置及び熱伝導シートの製造方法 |
| PCT/JP2023/026892 WO2024019173A1 (ja) | 2022-07-22 | 2023-07-21 | 熱伝導シート、放熱装置及び熱伝導シートの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024019173A1 true JPWO2024019173A1 (https=) | 2024-01-25 |
| JPWO2024019173A5 JPWO2024019173A5 (https=) | 2025-04-16 |
Family
ID=89617409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024535166A Pending JPWO2024019173A1 (https=) | 2022-07-22 | 2023-07-21 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US20250285933A1 (https=) |
| JP (1) | JPWO2024019173A1 (https=) |
| KR (1) | KR20250038663A (https=) |
| CN (1) | CN119137735A (https=) |
| TW (1) | TW202411399A (https=) |
| WO (2) | WO2024018635A1 (https=) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07207160A (ja) * | 1994-01-11 | 1995-08-08 | Toshiba Silicone Co Ltd | シリコーン組成物およびその製造方法 |
| JPH11135691A (ja) * | 1997-10-31 | 1999-05-21 | Hitachi Ltd | 電子回路装置 |
| JP3288029B2 (ja) | 2000-03-08 | 2002-06-04 | 北川工業株式会社 | 成形体、並びに、熱伝導材及びその製造方法 |
| JP2002026202A (ja) | 2000-06-29 | 2002-01-25 | Three M Innovative Properties Co | 熱伝導性シート及びその製造方法 |
| JP2008078380A (ja) * | 2006-09-21 | 2008-04-03 | Kaneka Corp | 放熱シート |
| JP5866830B2 (ja) * | 2011-07-04 | 2016-02-24 | 日立化成株式会社 | 熱伝導シート、放熱装置、及び熱伝導シートの製造方法 |
| EP3419399B1 (en) * | 2016-04-11 | 2020-08-26 | Sekisui Polymatech Co., Ltd. | Heat conductive sheet |
| US20200340757A1 (en) * | 2019-04-29 | 2020-10-29 | Nanotek Instruments, Inc. | Expanded graphite-enhanced vapor-based heat transfer device and production process |
| JP6892725B1 (ja) * | 2019-11-01 | 2021-06-23 | 積水ポリマテック株式会社 | 熱伝導性シート及びその製造方法 |
-
2022
- 2022-07-22 WO PCT/JP2022/028527 patent/WO2024018635A1/ja not_active Ceased
-
2023
- 2023-07-21 JP JP2024535166A patent/JPWO2024019173A1/ja active Pending
- 2023-07-21 US US18/861,878 patent/US20250285933A1/en active Pending
- 2023-07-21 CN CN202380037697.7A patent/CN119137735A/zh active Pending
- 2023-07-21 TW TW112127414A patent/TW202411399A/zh unknown
- 2023-07-21 WO PCT/JP2023/026892 patent/WO2024019173A1/ja not_active Ceased
- 2023-07-21 KR KR1020257003697A patent/KR20250038663A/ko active Pending
-
2025
- 2025-10-31 US US19/376,193 patent/US20260060078A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN119137735A (zh) | 2024-12-13 |
| KR20250038663A (ko) | 2025-03-19 |
| US20250285933A1 (en) | 2025-09-11 |
| WO2024018635A1 (ja) | 2024-01-25 |
| US20260060078A1 (en) | 2026-02-26 |
| WO2024019173A1 (ja) | 2024-01-25 |
| TW202411399A (zh) | 2024-03-16 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250121 |