TW202408808A - 保護片材 - Google Patents

保護片材 Download PDF

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Publication number
TW202408808A
TW202408808A TW112125426A TW112125426A TW202408808A TW 202408808 A TW202408808 A TW 202408808A TW 112125426 A TW112125426 A TW 112125426A TW 112125426 A TW112125426 A TW 112125426A TW 202408808 A TW202408808 A TW 202408808A
Authority
TW
Taiwan
Prior art keywords
protective layer
semiconductor wafer
liquid
wafer
semiconductor
Prior art date
Application number
TW112125426A
Other languages
English (en)
Chinese (zh)
Inventor
佐藤慧
宍戸雄一郎
高本尚英
Original Assignee
日商日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW202408808A publication Critical patent/TW202408808A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • C08L101/14—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity the macromolecular compounds being water soluble or water swellable, e.g. aqueous gels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/019—Manufacture or treatment of bond pads
    • H10W72/01951—Changing the shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/077—Connecting of TAB connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Dicing (AREA)
  • Laminated Bodies (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
TW112125426A 2022-07-12 2023-07-07 保護片材 TW202408808A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-111735 2022-07-12
JP2022111735A JP7821696B2 (ja) 2022-07-12 2022-07-12 保護シート

Publications (1)

Publication Number Publication Date
TW202408808A true TW202408808A (zh) 2024-03-01

Family

ID=89536693

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112125426A TW202408808A (zh) 2022-07-12 2023-07-07 保護片材

Country Status (5)

Country Link
JP (1) JP7821696B2 (https=)
KR (1) KR20250034280A (https=)
CN (1) CN119547182A (https=)
TW (1) TW202408808A (https=)
WO (1) WO2024014406A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7814476B2 (ja) * 2024-06-13 2026-02-16 日東電工株式会社 保護シート
WO2025258413A1 (ja) * 2024-06-13 2025-12-18 日東電工株式会社 保護シート

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010165963A (ja) 2009-01-19 2010-07-29 Furukawa Electric Co Ltd:The 半導体ウェハの処理方法
TWI540644B (zh) 2011-07-01 2016-07-01 漢高智慧財產控股公司 斥性材料於半導體總成中保護製造區域之用途
JP2013131694A (ja) 2011-12-22 2013-07-04 Lintec Corp チップ用樹脂膜形成用シートおよび半導体チップの製造方法
JP6306679B2 (ja) 2012-07-31 2018-04-04 日東電工株式会社 放射線硬化型粘着剤、放射線硬化型粘着剤層、放射線硬化型粘着シートおよび積層体
JP6055494B2 (ja) 2015-01-27 2016-12-27 碁達科技股▲ふん▼有限公司 レーザーダイシング方法
JP6857477B2 (ja) 2016-09-30 2021-04-14 日東電工株式会社 有機ｅｌ表示装置
KR102515877B1 (ko) 2017-12-07 2023-03-30 린텍 가부시키가이샤 워크 가공용 시트 및 가공된 워크의 제조방법
JP7316638B2 (ja) 2019-05-15 2023-07-28 パナソニックＩｐマネジメント株式会社 樹脂組成物、樹脂被覆基板および素子チップの製造方法
JP2021161735A (ja) 2020-03-31 2021-10-11 ナガセケムテックス株式会社 仮固定シート、加工方法、被膜形成方法及び電子部品の製造方法

Also Published As

Publication number Publication date
JP7821696B2 (ja) 2026-02-27
JP2024010412A (ja) 2024-01-24
KR20250034280A (ko) 2025-03-11
WO2024014406A1 (ja) 2024-01-18
CN119547182A (zh) 2025-02-28

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