JP7821696B2 - 保護シート - Google Patents

保護シート

Info

Publication number
JP7821696B2
JP7821696B2 JP2022111735A JP2022111735A JP7821696B2 JP 7821696 B2 JP7821696 B2 JP 7821696B2 JP 2022111735 A JP2022111735 A JP 2022111735A JP 2022111735 A JP2022111735 A JP 2022111735A JP 7821696 B2 JP7821696 B2 JP 7821696B2
Authority
JP
Japan
Prior art keywords
protective layer
group
liquid
protected
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022111735A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024010412A5 (https=
JP2024010412A (ja
Inventor
慧 佐藤
雄一郎 宍戸
尚英 高本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP2022111735A priority Critical patent/JP7821696B2/ja
Priority to TW112125426A priority patent/TW202408808A/zh
Priority to PCT/JP2023/025257 priority patent/WO2024014406A1/ja
Priority to CN202380046622.5A priority patent/CN119547182A/zh
Priority to KR1020247038393A priority patent/KR20250034280A/ko
Publication of JP2024010412A publication Critical patent/JP2024010412A/ja
Publication of JP2024010412A5 publication Critical patent/JP2024010412A5/ja
Application granted granted Critical
Publication of JP7821696B2 publication Critical patent/JP7821696B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • C08L101/14—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity the macromolecular compounds being water soluble or water swellable, e.g. aqueous gels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/019—Manufacture or treatment of bond pads
    • H10W72/01951—Changing the shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/077—Connecting of TAB connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Dicing (AREA)
  • Laminated Bodies (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
JP2022111735A 2022-07-12 2022-07-12 保護シート Active JP7821696B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2022111735A JP7821696B2 (ja) 2022-07-12 2022-07-12 保護シート
TW112125426A TW202408808A (zh) 2022-07-12 2023-07-07 保護片材
PCT/JP2023/025257 WO2024014406A1 (ja) 2022-07-12 2023-07-07 保護シート
CN202380046622.5A CN119547182A (zh) 2022-07-12 2023-07-07 保护片
KR1020247038393A KR20250034280A (ko) 2022-07-12 2023-07-07 보호 시트

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022111735A JP7821696B2 (ja) 2022-07-12 2022-07-12 保護シート

Publications (3)

Publication Number Publication Date
JP2024010412A JP2024010412A (ja) 2024-01-24
JP2024010412A5 JP2024010412A5 (https=) 2025-10-09
JP7821696B2 true JP7821696B2 (ja) 2026-02-27

Family

ID=89536693

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022111735A Active JP7821696B2 (ja) 2022-07-12 2022-07-12 保護シート

Country Status (5)

Country Link
JP (1) JP7821696B2 (https=)
KR (1) KR20250034280A (https=)
CN (1) CN119547182A (https=)
TW (1) TW202408808A (https=)
WO (1) WO2024014406A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7814476B2 (ja) * 2024-06-13 2026-02-16 日東電工株式会社 保護シート
WO2025258413A1 (ja) * 2024-06-13 2025-12-18 日東電工株式会社 保護シート

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010165963A (ja) 2009-01-19 2010-07-29 Furukawa Electric Co Ltd:The 半導体ウェハの処理方法
JP2013131694A (ja) 2011-12-22 2013-07-04 Lintec Corp チップ用樹脂膜形成用シートおよび半導体チップの製造方法
JP2014526143A (ja) 2011-07-01 2014-10-02 ヘンケル ユーエス アイピー エルエルシー 半導体組み立てにおける加工領域を保護するためのリペレント材料の使用
JP2016139690A (ja) 2015-01-27 2016-08-04 碁達科技股▲ふん▼有限公司 レーザーダイシング用保護膜組成物及びその応用
JP2017082228A (ja) 2012-07-31 2017-05-18 日東電工株式会社 放射線硬化型粘着剤、放射線硬化型粘着剤層、放射線硬化型粘着シートおよび積層体
WO2018062183A1 (ja) 2016-09-30 2018-04-05 日東電工株式会社 有機ｅｌ表示装置
WO2019111760A1 (ja) 2017-12-07 2019-06-13 リンテック株式会社 ワーク加工用シートおよび加工済みワークの製造方法
JP2020188153A (ja) 2019-05-15 2020-11-19 パナソニックＩｐマネジメント株式会社 樹脂組成物、樹脂被覆基板および素子チップの製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021161735A (ja) 2020-03-31 2021-10-11 ナガセケムテックス株式会社 仮固定シート、加工方法、被膜形成方法及び電子部品の製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010165963A (ja) 2009-01-19 2010-07-29 Furukawa Electric Co Ltd:The 半導体ウェハの処理方法
JP2014526143A (ja) 2011-07-01 2014-10-02 ヘンケル ユーエス アイピー エルエルシー 半導体組み立てにおける加工領域を保護するためのリペレント材料の使用
JP2013131694A (ja) 2011-12-22 2013-07-04 Lintec Corp チップ用樹脂膜形成用シートおよび半導体チップの製造方法
JP2017082228A (ja) 2012-07-31 2017-05-18 日東電工株式会社 放射線硬化型粘着剤、放射線硬化型粘着剤層、放射線硬化型粘着シートおよび積層体
JP2016139690A (ja) 2015-01-27 2016-08-04 碁達科技股▲ふん▼有限公司 レーザーダイシング用保護膜組成物及びその応用
WO2018062183A1 (ja) 2016-09-30 2018-04-05 日東電工株式会社 有機ｅｌ表示装置
WO2019111760A1 (ja) 2017-12-07 2019-06-13 リンテック株式会社 ワーク加工用シートおよび加工済みワークの製造方法
JP2020188153A (ja) 2019-05-15 2020-11-19 パナソニックＩｐマネジメント株式会社 樹脂組成物、樹脂被覆基板および素子チップの製造方法

Also Published As

Publication number Publication date
JP2024010412A (ja) 2024-01-24
KR20250034280A (ko) 2025-03-11
TW202408808A (zh) 2024-03-01
WO2024014406A1 (ja) 2024-01-18
CN119547182A (zh) 2025-02-28

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