TW202348662A - 正型感光性樹脂組成物、硬化膜、及半導體裝置 - Google Patents

正型感光性樹脂組成物、硬化膜、及半導體裝置 Download PDF

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Publication number
TW202348662A
TW202348662A TW112110433A TW112110433A TW202348662A TW 202348662 A TW202348662 A TW 202348662A TW 112110433 A TW112110433 A TW 112110433A TW 112110433 A TW112110433 A TW 112110433A TW 202348662 A TW202348662 A TW 202348662A
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TW
Taiwan
Prior art keywords
resin composition
photosensitive resin
positive photosensitive
mass
film
Prior art date
Application number
TW112110433A
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English (en)
Chinese (zh)
Inventor
高橋豊誠
鈴木咲子
高田渉
Original Assignee
日商住友電木股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商住友電木股份有限公司 filed Critical 日商住友電木股份有限公司
Publication of TW202348662A publication Critical patent/TW202348662A/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0395—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/45—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their insulating parts
    • H10W20/48—Insulating materials thereof

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
TW112110433A 2022-03-24 2023-03-21 正型感光性樹脂組成物、硬化膜、及半導體裝置 TW202348662A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022048073 2022-03-24
JP2022-048073 2022-03-24

Publications (1)

Publication Number Publication Date
TW202348662A true TW202348662A (zh) 2023-12-16

Family

ID=88100841

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112110433A TW202348662A (zh) 2022-03-24 2023-03-21 正型感光性樹脂組成物、硬化膜、及半導體裝置

Country Status (5)

Country Link
JP (1) JPWO2023182136A1 (https=)
KR (1) KR20240165403A (https=)
CN (1) CN118922781A (https=)
TW (1) TW202348662A (https=)
WO (1) WO2023182136A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI892796B (zh) * 2024-08-13 2025-08-01 新應材股份有限公司 微細圖案形成用材料、感光性樹脂組成物、圖案處理組成物以及微細圖案的形成方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6275620B2 (ja) 2014-10-17 2018-02-07 日本化薬株式会社 感光性樹脂組成物及びその硬化物
KR102004129B1 (ko) * 2016-11-11 2019-07-25 스미또모 베이크라이트 가부시키가이샤 감광성 수지 조성물, 수지막, 경화막, 반도체 장치의 제조 방법, 및 반도체 장치
JP7062899B2 (ja) * 2017-09-15 2022-05-09 住友ベークライト株式会社 感光性樹脂組成物、半導体装置および電子機器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI892796B (zh) * 2024-08-13 2025-08-01 新應材股份有限公司 微細圖案形成用材料、感光性樹脂組成物、圖案處理組成物以及微細圖案的形成方法

Also Published As

Publication number Publication date
JPWO2023182136A1 (https=) 2023-09-28
WO2023182136A1 (ja) 2023-09-28
KR20240165403A (ko) 2024-11-22
CN118922781A (zh) 2024-11-08

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