JPWO2023182136A1 - - Google Patents
Info
- Publication number
- JPWO2023182136A1 JPWO2023182136A1 JP2024510085A JP2024510085A JPWO2023182136A1 JP WO2023182136 A1 JPWO2023182136 A1 JP WO2023182136A1 JP 2024510085 A JP2024510085 A JP 2024510085A JP 2024510085 A JP2024510085 A JP 2024510085A JP WO2023182136 A1 JPWO2023182136 A1 JP WO2023182136A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0395—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
- H10W20/45—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their insulating parts
- H10W20/48—Insulating materials thereof
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Phenolic Resins Or Amino Resins (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022048073 | 2022-03-24 | ||
| PCT/JP2023/010281 WO2023182136A1 (ja) | 2022-03-24 | 2023-03-16 | ポジ型感光性樹脂組成物、硬化膜、および半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023182136A1 true JPWO2023182136A1 (https=) | 2023-09-28 |
| JPWO2023182136A5 JPWO2023182136A5 (https=) | 2024-12-02 |
Family
ID=88100841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024510085A Pending JPWO2023182136A1 (https=) | 2022-03-24 | 2023-03-16 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2023182136A1 (https=) |
| KR (1) | KR20240165403A (https=) |
| CN (1) | CN118922781A (https=) |
| TW (1) | TW202348662A (https=) |
| WO (1) | WO2023182136A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI892796B (zh) * | 2024-08-13 | 2025-08-01 | 新應材股份有限公司 | 微細圖案形成用材料、感光性樹脂組成物、圖案處理組成物以及微細圖案的形成方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6275620B2 (ja) | 2014-10-17 | 2018-02-07 | 日本化薬株式会社 | 感光性樹脂組成物及びその硬化物 |
| KR102004129B1 (ko) * | 2016-11-11 | 2019-07-25 | 스미또모 베이크라이트 가부시키가이샤 | 감광성 수지 조성물, 수지막, 경화막, 반도체 장치의 제조 방법, 및 반도체 장치 |
| JP7062899B2 (ja) * | 2017-09-15 | 2022-05-09 | 住友ベークライト株式会社 | 感光性樹脂組成物、半導体装置および電子機器 |
-
2023
- 2023-03-16 KR KR1020247034614A patent/KR20240165403A/ko active Pending
- 2023-03-16 WO PCT/JP2023/010281 patent/WO2023182136A1/ja not_active Ceased
- 2023-03-16 CN CN202380029949.1A patent/CN118922781A/zh active Pending
- 2023-03-16 JP JP2024510085A patent/JPWO2023182136A1/ja active Pending
- 2023-03-21 TW TW112110433A patent/TW202348662A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023182136A1 (ja) | 2023-09-28 |
| TW202348662A (zh) | 2023-12-16 |
| KR20240165403A (ko) | 2024-11-22 |
| CN118922781A (zh) | 2024-11-08 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240515 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20260209 |