TW202347545A - 接合體之製造方法 - Google Patents
接合體之製造方法 Download PDFInfo
- Publication number
- TW202347545A TW202347545A TW112111946A TW112111946A TW202347545A TW 202347545 A TW202347545 A TW 202347545A TW 112111946 A TW112111946 A TW 112111946A TW 112111946 A TW112111946 A TW 112111946A TW 202347545 A TW202347545 A TW 202347545A
- Authority
- TW
- Taiwan
- Prior art keywords
- pressure
- temperature
- joined
- coating film
- mpa
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Composite Materials (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Powder Metallurgy (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022056551 | 2022-03-30 | ||
| JP2022-056551 | 2022-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202347545A true TW202347545A (zh) | 2023-12-01 |
Family
ID=88202534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112111946A TW202347545A (zh) | 2022-03-30 | 2023-03-29 | 接合體之製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2023190451A1 (https=) |
| TW (1) | TW202347545A (https=) |
| WO (1) | WO2023190451A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020032161A1 (ja) * | 2018-08-08 | 2020-02-13 | 三井金属鉱業株式会社 | 接合用組成物、並びに導電体の接合構造及びその製造方法 |
| JP7170968B2 (ja) * | 2019-02-22 | 2022-11-15 | 株式会社大阪ソーダ | 導電性接着剤を用いる接合方法 |
| DE112019007175B9 (de) * | 2019-04-09 | 2024-12-24 | Mitsubishi Electric Corporation | Leistungshalbleitermodul und leistungswandlergerät |
| JP2021182543A (ja) * | 2020-05-18 | 2021-11-25 | 田中貴金属工業株式会社 | 導電性組成物、および導電性組成物が用いられている焼結部を備えている部材 |
-
2023
- 2023-03-28 JP JP2024512524A patent/JPWO2023190451A1/ja active Pending
- 2023-03-28 WO PCT/JP2023/012389 patent/WO2023190451A1/ja not_active Ceased
- 2023-03-29 TW TW112111946A patent/TW202347545A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2023190451A1 (https=) | 2023-10-05 |
| WO2023190451A1 (ja) | 2023-10-05 |
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