TW202347545A - 接合體之製造方法 - Google Patents

接合體之製造方法 Download PDF

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Publication number
TW202347545A
TW202347545A TW112111946A TW112111946A TW202347545A TW 202347545 A TW202347545 A TW 202347545A TW 112111946 A TW112111946 A TW 112111946A TW 112111946 A TW112111946 A TW 112111946A TW 202347545 A TW202347545 A TW 202347545A
Authority
TW
Taiwan
Prior art keywords
pressure
temperature
joined
coating film
mpa
Prior art date
Application number
TW112111946A
Other languages
English (en)
Chinese (zh)
Inventor
山内真一
服部隆志
穴井圭
Original Assignee
日商三井金屬鑛業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三井金屬鑛業股份有限公司 filed Critical 日商三井金屬鑛業股份有限公司
Publication of TW202347545A publication Critical patent/TW202347545A/zh

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/08Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Powder Metallurgy (AREA)
TW112111946A 2022-03-30 2023-03-29 接合體之製造方法 TW202347545A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022056551 2022-03-30
JP2022-056551 2022-03-30

Publications (1)

Publication Number Publication Date
TW202347545A true TW202347545A (zh) 2023-12-01

Family

ID=88202534

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112111946A TW202347545A (zh) 2022-03-30 2023-03-29 接合體之製造方法

Country Status (3)

Country Link
JP (1) JPWO2023190451A1 (https=)
TW (1) TW202347545A (https=)
WO (1) WO2023190451A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020032161A1 (ja) * 2018-08-08 2020-02-13 三井金属鉱業株式会社 接合用組成物、並びに導電体の接合構造及びその製造方法
JP7170968B2 (ja) * 2019-02-22 2022-11-15 株式会社大阪ソーダ 導電性接着剤を用いる接合方法
DE112019007175B9 (de) * 2019-04-09 2024-12-24 Mitsubishi Electric Corporation Leistungshalbleitermodul und leistungswandlergerät
JP2021182543A (ja) * 2020-05-18 2021-11-25 田中貴金属工業株式会社 導電性組成物、および導電性組成物が用いられている焼結部を備えている部材

Also Published As

Publication number Publication date
JPWO2023190451A1 (https=) 2023-10-05
WO2023190451A1 (ja) 2023-10-05

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