TW202346064A - 控制裝置、層疊成形品製造系統以及層疊成形品的製造方法 - Google Patents
控制裝置、層疊成形品製造系統以及層疊成形品的製造方法 Download PDFInfo
- Publication number
- TW202346064A TW202346064A TW112107693A TW112107693A TW202346064A TW 202346064 A TW202346064 A TW 202346064A TW 112107693 A TW112107693 A TW 112107693A TW 112107693 A TW112107693 A TW 112107693A TW 202346064 A TW202346064 A TW 202346064A
- Authority
- TW
- Taiwan
- Prior art keywords
- data
- aforementioned
- molded product
- laminated molded
- control device
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 123
- 238000000034 method Methods 0.000 title claims description 284
- 238000003475 lamination Methods 0.000 claims abstract description 157
- 239000000463 material Substances 0.000 claims abstract description 30
- 238000003860 storage Methods 0.000 claims abstract description 25
- 238000010030 laminating Methods 0.000 claims abstract description 20
- 238000012545 processing Methods 0.000 claims description 236
- 238000007689 inspection Methods 0.000 claims description 61
- 238000007747 plating Methods 0.000 claims description 15
- 230000037303 wrinkles Effects 0.000 claims description 12
- 238000005530 etching Methods 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 5
- 238000004364 calculation method Methods 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000005259 measurement Methods 0.000 claims description 3
- 238000013500 data storage Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 22
- 239000000758 substrate Substances 0.000 description 17
- 230000032258 transport Effects 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 230000002950 deficient Effects 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 238000000611 regression analysis Methods 0.000 description 4
- 238000012549 training Methods 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 2
- 238000013473 artificial intelligence Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 229920006015 heat resistant resin Polymers 0.000 description 2
- 238000010801 machine learning Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000013528 artificial neural network Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000005001 laminate film Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229910019655 synthetic inorganic crystalline material Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022-052847 | 2022-03-29 | ||
| JP2022052847A JP7282945B1 (ja) | 2022-03-29 | 2022-03-29 | 制御装置、積層成形品製造システムおよび積層成形品の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202346064A true TW202346064A (zh) | 2023-12-01 |
Family
ID=86538281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112107693A TW202346064A (zh) | 2022-03-29 | 2023-03-03 | 控制裝置、層疊成形品製造系統以及層疊成形品的製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (3) | JP7282945B1 (ja) |
| TW (1) | TW202346064A (ja) |
| WO (1) | WO2023188705A1 (ja) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3701221B2 (ja) | 2001-08-27 | 2005-09-28 | 株式会社 日立インダストリイズ | フィルムラミネート方法とその装置 |
| JP4776197B2 (ja) | 2004-09-21 | 2011-09-21 | 日本特殊陶業株式会社 | 配線基板の検査装置 |
| JP2019133962A (ja) | 2016-06-01 | 2019-08-08 | 三菱電機株式会社 | ラミネート装置、ラミネート方法および太陽電池モジュールの製造方法 |
| JP6805640B2 (ja) | 2016-08-29 | 2020-12-23 | 株式会社ニコン | 積層装置、薄化装置、露光装置制御装置、プログラム及び積層体の製造方法 |
| JP7249907B2 (ja) | 2019-08-08 | 2023-03-31 | 新光電気工業株式会社 | 配線基板の製造方法及び積層構造 |
| JP7071956B2 (ja) | 2019-12-03 | 2022-05-19 | 株式会社日本製鋼所 | 真空積層システム、真空積層システムの成形不良検出方法および真空積層システムの成形条件修正方法 |
| JP7547797B2 (ja) | 2020-06-05 | 2024-09-10 | 株式会社ジェイテクト | 成形条件決定支援装置 |
-
2022
- 2022-03-29 JP JP2022052847A patent/JP7282945B1/ja active Active
-
2023
- 2023-01-17 WO PCT/JP2023/001192 patent/WO2023188705A1/ja unknown
- 2023-03-03 TW TW112107693A patent/TW202346064A/zh unknown
- 2023-05-17 JP JP2023081286A patent/JP7532596B2/ja active Active
-
2024
- 2024-07-31 JP JP2024124596A patent/JP2024138195A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023188705A1 (ja) | 2023-10-05 |
| JP2024138195A (ja) | 2024-10-07 |
| JP2023147289A (ja) | 2023-10-12 |
| JP2023145929A (ja) | 2023-10-12 |
| JP7282945B1 (ja) | 2023-05-29 |
| JP7532596B2 (ja) | 2024-08-13 |
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