TW202344681A - 清洗劑組成物用原液及包含該清洗劑組成物用原液的清洗劑組成物 - Google Patents
清洗劑組成物用原液及包含該清洗劑組成物用原液的清洗劑組成物 Download PDFInfo
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- TW202344681A TW202344681A TW112115896A TW112115896A TW202344681A TW 202344681 A TW202344681 A TW 202344681A TW 112115896 A TW112115896 A TW 112115896A TW 112115896 A TW112115896 A TW 112115896A TW 202344681 A TW202344681 A TW 202344681A
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- water
- cleaning agent
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- 239000004210 ether based solvent Substances 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- ZUNGGJHBMLMRFJ-UHFFFAOYSA-O ethoxy-hydroxy-oxophosphanium Chemical compound CCO[P+](O)=O ZUNGGJHBMLMRFJ-UHFFFAOYSA-O 0.000 description 1
- 125000004494 ethyl ester group Chemical group 0.000 description 1
- ZJXZSIYSNXKHEA-UHFFFAOYSA-L ethyl phosphate(2-) Chemical compound CCOP([O-])([O-])=O ZJXZSIYSNXKHEA-UHFFFAOYSA-L 0.000 description 1
- GATNOFPXSDHULC-UHFFFAOYSA-N ethylphosphonic acid Chemical compound CCP(O)(O)=O GATNOFPXSDHULC-UHFFFAOYSA-N 0.000 description 1
- 229960004585 etidronic acid Drugs 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- 239000000174 gluconic acid Substances 0.000 description 1
- 235000012208 gluconic acid Nutrition 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- JEGUKCSWCFPDGT-UHFFFAOYSA-N h2o hydrate Chemical compound O.O JEGUKCSWCFPDGT-UHFFFAOYSA-N 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 231100001261 hazardous Toxicity 0.000 description 1
- DMEGYFMYUHOHGS-UHFFFAOYSA-N heptamethylene Natural products C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 1
- PHNWGDTYCJFUGZ-UHFFFAOYSA-N hexyl dihydrogen phosphate Chemical compound CCCCCCOP(O)(O)=O PHNWGDTYCJFUGZ-UHFFFAOYSA-N 0.000 description 1
- QXLBKTGZGPVJOO-UHFFFAOYSA-N hexyl dihydrogen phosphite Chemical compound CCCCCCOP(O)O QXLBKTGZGPVJOO-UHFFFAOYSA-N 0.000 description 1
- GJWAEWLHSDGBGG-UHFFFAOYSA-N hexylphosphonic acid Chemical compound CCCCCCP(O)(O)=O GJWAEWLHSDGBGG-UHFFFAOYSA-N 0.000 description 1
- XAKRTGZVYPZHCO-UHFFFAOYSA-O hydroxy-methoxy-oxophosphanium Chemical compound CO[P+](O)=O XAKRTGZVYPZHCO-UHFFFAOYSA-O 0.000 description 1
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- 229910052738 indium Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229920003049 isoprene rubber Polymers 0.000 description 1
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 1
- 229940102253 isopropanolamine Drugs 0.000 description 1
- 229940011051 isopropyl acetate Drugs 0.000 description 1
- GWYFCOCPABKNJV-UHFFFAOYSA-N isovaleric acid Chemical compound CC(C)CC(O)=O GWYFCOCPABKNJV-UHFFFAOYSA-N 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 239000010687 lubricating oil Substances 0.000 description 1
- 235000018977 lysine Nutrition 0.000 description 1
- 239000010721 machine oil Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000006224 matting agent Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 description 1
- CAAULPUQFIIOTL-UHFFFAOYSA-N methyl dihydrogen phosphate Chemical compound COP(O)(O)=O CAAULPUQFIIOTL-UHFFFAOYSA-N 0.000 description 1
- LDZSZDPWGXKEIR-UHFFFAOYSA-N methylazanium bromate Chemical compound CN.O[Br](=O)=O LDZSZDPWGXKEIR-UHFFFAOYSA-N 0.000 description 1
- YACKEPLHDIMKIO-UHFFFAOYSA-N methylphosphonic acid Chemical compound CP(O)(O)=O YACKEPLHDIMKIO-UHFFFAOYSA-N 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- SRTOAFZPEOCBGW-UHFFFAOYSA-N n,n,n',n'-tetraethylhexane-1,6-diamine Chemical compound CCN(CC)CCCCCCN(CC)CC SRTOAFZPEOCBGW-UHFFFAOYSA-N 0.000 description 1
- OQIRZNNBUNOXTQ-UHFFFAOYSA-N n,n,n',n'-tetraethylpentane-1,5-diamine Chemical compound CCN(CC)CCCCCN(CC)CC OQIRZNNBUNOXTQ-UHFFFAOYSA-N 0.000 description 1
- TXXWBTOATXBWDR-UHFFFAOYSA-N n,n,n',n'-tetramethylhexane-1,6-diamine Chemical compound CN(C)CCCCCCN(C)C TXXWBTOATXBWDR-UHFFFAOYSA-N 0.000 description 1
- DNOJGXHXKATOKI-UHFFFAOYSA-N n,n,n',n'-tetramethylpentane-1,5-diamine Chemical compound CN(C)CCCCCN(C)C DNOJGXHXKATOKI-UHFFFAOYSA-N 0.000 description 1
- YWFWDNVOPHGWMX-UHFFFAOYSA-N n,n-dimethyldodecan-1-amine Chemical compound CCCCCCCCCCCCN(C)C YWFWDNVOPHGWMX-UHFFFAOYSA-N 0.000 description 1
- PHDLNXKJCPLCRO-UHFFFAOYSA-N n-[2-(diethylamino)ethyl]-n',n'-diethyl-n-methylethane-1,2-diamine Chemical compound CCN(CC)CCN(C)CCN(CC)CC PHDLNXKJCPLCRO-UHFFFAOYSA-N 0.000 description 1
- UICCSKORMGVRCB-UHFFFAOYSA-N n-[2-(diethylamino)ethyl]-n',n'-diethylethane-1,2-diamine Chemical compound CCN(CC)CCNCCN(CC)CC UICCSKORMGVRCB-UHFFFAOYSA-N 0.000 description 1
- JPJMSWSYYHNPLD-UHFFFAOYSA-N n-[2-(dimethylamino)ethyl]-n',n'-dimethylethane-1,2-diamine Chemical compound CN(C)CCNCCN(C)C JPJMSWSYYHNPLD-UHFFFAOYSA-N 0.000 description 1
- FIDAJBOTMYEWMR-UHFFFAOYSA-N n-[2-(dipropylamino)ethyl]-n',n'-dipropylethane-1,2-diamine Chemical compound CCCN(CCC)CCNCCN(CCC)CCC FIDAJBOTMYEWMR-UHFFFAOYSA-N 0.000 description 1
- VMOWJORKYKVTSS-UHFFFAOYSA-N n-[2-[2-(dipropylamino)ethoxy]ethyl]-n-propylpropan-1-amine Chemical compound CCCN(CCC)CCOCCN(CCC)CCC VMOWJORKYKVTSS-UHFFFAOYSA-N 0.000 description 1
- DVVORTHDQVBZOO-UHFFFAOYSA-N n-[2-[di(propan-2-yl)amino]ethyl]-n',n'-di(propan-2-yl)ethane-1,2-diamine Chemical compound CC(C)N(C(C)C)CCNCCN(C(C)C)C(C)C DVVORTHDQVBZOO-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 1
- UHGIMQLJWRAPLT-UHFFFAOYSA-N octadecyl dihydrogen phosphate Chemical compound CCCCCCCCCCCCCCCCCCOP(O)(O)=O UHGIMQLJWRAPLT-UHFFFAOYSA-N 0.000 description 1
- CSWFWSPPZMEYAY-UHFFFAOYSA-N octadecyl dihydrogen phosphite Chemical compound CCCCCCCCCCCCCCCCCCOP(O)O CSWFWSPPZMEYAY-UHFFFAOYSA-N 0.000 description 1
- FTMKAMVLFVRZQX-UHFFFAOYSA-N octadecylphosphonic acid Chemical compound CCCCCCCCCCCCCCCCCCP(O)(O)=O FTMKAMVLFVRZQX-UHFFFAOYSA-N 0.000 description 1
- IOQPZZOEVPZRBK-UHFFFAOYSA-N octan-1-amine Chemical compound CCCCCCCCN IOQPZZOEVPZRBK-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- NJGCRMAPOWGWMW-UHFFFAOYSA-N octylphosphonic acid Chemical compound CCCCCCCCP(O)(O)=O NJGCRMAPOWGWMW-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000006259 organic additive Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- UKODFQOELJFMII-UHFFFAOYSA-N pentamethyldiethylenetriamine Chemical compound CN(C)CCN(C)CCN(C)C UKODFQOELJFMII-UHFFFAOYSA-N 0.000 description 1
- 239000008194 pharmaceutical composition Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- VCAFTIGPOYBOIC-UHFFFAOYSA-N phenyl dihydrogen phosphite Chemical compound OP(O)OC1=CC=CC=C1 VCAFTIGPOYBOIC-UHFFFAOYSA-N 0.000 description 1
- CMPQUABWPXYYSH-UHFFFAOYSA-N phenyl phosphate Chemical compound OP(O)(=O)OC1=CC=CC=C1 CMPQUABWPXYYSH-UHFFFAOYSA-N 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical group O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 1
- 150000003009 phosphonic acids Chemical class 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000010665 pine oil Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920006350 polyacrylonitrile resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920000137 polyphosphoric acid Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 159000000001 potassium salts Chemical class 0.000 description 1
- CBPYOHALYYGNOE-UHFFFAOYSA-M potassium;3,5-dinitrobenzoate Chemical compound [K+].[O-]C(=O)C1=CC([N+]([O-])=O)=CC([N+]([O-])=O)=C1 CBPYOHALYYGNOE-UHFFFAOYSA-M 0.000 description 1
- 150000003139 primary aliphatic amines Chemical class 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 125000006235 propyl amino ethyl group Chemical group [H]N(C([H])([H])C([H])([H])*)C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- PRAHMDIEZMWIRW-UHFFFAOYSA-N propyl dihydrogen phosphite Chemical compound CCCOP(O)O PRAHMDIEZMWIRW-UHFFFAOYSA-N 0.000 description 1
- NSETWVJZUWGCKE-UHFFFAOYSA-N propylphosphonic acid Chemical compound CCCP(O)(O)=O NSETWVJZUWGCKE-UHFFFAOYSA-N 0.000 description 1
- 239000008213 purified water Substances 0.000 description 1
- 229940005657 pyrophosphoric acid Drugs 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- 238000003900 soil pollution Methods 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229950011008 tetrachloroethylene Drugs 0.000 description 1
- 229940095068 tetradecene Drugs 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- ODBLHEXUDAPZAU-UHFFFAOYSA-N threo-D-isocitric acid Natural products OC(=O)C(O)C(C(O)=O)CC(O)=O ODBLHEXUDAPZAU-UHFFFAOYSA-N 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- XTTGYFREQJCEML-UHFFFAOYSA-N tributyl phosphite Chemical compound CCCCOP(OCCCC)OCCCC XTTGYFREQJCEML-UHFFFAOYSA-N 0.000 description 1
- GAJQCIFYLSXSEZ-UHFFFAOYSA-N tridecyl dihydrogen phosphate Chemical compound CCCCCCCCCCCCCOP(O)(O)=O GAJQCIFYLSXSEZ-UHFFFAOYSA-N 0.000 description 1
- BWPNIANVWARHPR-UHFFFAOYSA-N tridecyl dihydrogen phosphite Chemical compound CCCCCCCCCCCCCOP(O)O BWPNIANVWARHPR-UHFFFAOYSA-N 0.000 description 1
- KREGXBHGJXTOKZ-UHFFFAOYSA-N tridecylphosphonic acid Chemical compound CCCCCCCCCCCCCP(O)(O)=O KREGXBHGJXTOKZ-UHFFFAOYSA-N 0.000 description 1
- IVIIAEVMQHEPAY-UHFFFAOYSA-N tridodecyl phosphite Chemical compound CCCCCCCCCCCCOP(OCCCCCCCCCCCC)OCCCCCCCCCCCC IVIIAEVMQHEPAY-UHFFFAOYSA-N 0.000 description 1
- SFENPMLASUEABX-UHFFFAOYSA-N trihexyl phosphate Chemical compound CCCCCCOP(=O)(OCCCCCC)OCCCCCC SFENPMLASUEABX-UHFFFAOYSA-N 0.000 description 1
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 1
- CYTQBVOFDCPGCX-UHFFFAOYSA-N trimethyl phosphite Chemical compound COP(OC)OC CYTQBVOFDCPGCX-UHFFFAOYSA-N 0.000 description 1
- FDGZUBKNYGBWHI-UHFFFAOYSA-N trioctadecyl phosphate Chemical compound CCCCCCCCCCCCCCCCCCOP(=O)(OCCCCCCCCCCCCCCCCCC)OCCCCCCCCCCCCCCCCCC FDGZUBKNYGBWHI-UHFFFAOYSA-N 0.000 description 1
- CNUJLMSKURPSHE-UHFFFAOYSA-N trioctadecyl phosphite Chemical compound CCCCCCCCCCCCCCCCCCOP(OCCCCCCCCCCCCCCCCCC)OCCCCCCCCCCCCCCCCCC CNUJLMSKURPSHE-UHFFFAOYSA-N 0.000 description 1
- QOQNJVLFFRMJTQ-UHFFFAOYSA-N trioctyl phosphite Chemical compound CCCCCCCCOP(OCCCCCCCC)OCCCCCCCC QOQNJVLFFRMJTQ-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- UNXRWKVEANCORM-UHFFFAOYSA-N triphosphoric acid Chemical compound OP(O)(=O)OP(O)(=O)OP(O)(O)=O UNXRWKVEANCORM-UHFFFAOYSA-N 0.000 description 1
- 229940048102 triphosphoric acid Drugs 0.000 description 1
- QOPBTFMUVTXWFF-UHFFFAOYSA-N tripropyl phosphite Chemical compound CCCOP(OCCC)OCCC QOPBTFMUVTXWFF-UHFFFAOYSA-N 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- JZNDMMGBXUYFNQ-UHFFFAOYSA-N tris(dodecylsulfanyl)phosphane Chemical compound CCCCCCCCCCCCSP(SCCCCCCCCCCCC)SCCCCCCCCCCCC JZNDMMGBXUYFNQ-UHFFFAOYSA-N 0.000 description 1
- SVETUDAIEHYIKZ-IUPFWZBJSA-N tris[(z)-octadec-9-enyl] phosphate Chemical compound CCCCCCCC\C=C/CCCCCCCCOP(=O)(OCCCCCCCC\C=C/CCCCCCCC)OCCCCCCCC\C=C/CCCCCCCC SVETUDAIEHYIKZ-IUPFWZBJSA-N 0.000 description 1
- SUZOHRHSQCIJDK-UHFFFAOYSA-N triundecyl phosphate Chemical compound CCCCCCCCCCCOP(=O)(OCCCCCCCCCCC)OCCCCCCCCCCC SUZOHRHSQCIJDK-UHFFFAOYSA-N 0.000 description 1
- UKPASDNOVTUNJT-UHFFFAOYSA-N triundecyl phosphite Chemical compound CCCCCCCCCCCOP(OCCCCCCCCCCC)OCCCCCCCCCCC UKPASDNOVTUNJT-UHFFFAOYSA-N 0.000 description 1
- OUYCCCASQSFEME-UHFFFAOYSA-N tyrosine Natural products OC(=O)C(N)CC1=CC=C(O)C=C1 OUYCCCASQSFEME-UHFFFAOYSA-N 0.000 description 1
- 235000002374 tyrosine Nutrition 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- VAIOGRPEROWKJX-UHFFFAOYSA-N undecyl dihydrogen phosphate Chemical compound CCCCCCCCCCCOP(O)(O)=O VAIOGRPEROWKJX-UHFFFAOYSA-N 0.000 description 1
- MVLKOUSZNPHMIY-UHFFFAOYSA-N undecyl dihydrogen phosphite Chemical compound CCCCCCCCCCCOP(O)O MVLKOUSZNPHMIY-UHFFFAOYSA-N 0.000 description 1
- GKIQHTGBORJXKZ-UHFFFAOYSA-N undecylphosphonic acid Chemical compound CCCCCCCCCCCP(O)(O)=O GKIQHTGBORJXKZ-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5022—Organic solvents containing oxygen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/30—Amines; Substituted amines ; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/43—Solvents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3218—Alkanolamines or alkanolimines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Detergent Compositions (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
本發明的課題在於提供一種可獲得水稀釋型清洗劑且容易處理的清洗劑組成物用原液,所述水稀釋型清洗劑的清洗性優異,可去除銅氧化膜且可抑制銅表面的再氧化。一種清洗劑組成物用原液,包含作為20℃下於水中的溶解度為10質量%以下的二醇醚(A1)及/或苄醇(A2)的非鹵素系有機溶劑(A)、3-胺基-4-辛醇(B)及視需要的水(C),各成分的含有比率是(A)成分為50質量%~99.9質量%、(B)成分為0.1質量%~45質量%、(C)成分為0質量%~20質量%,且所述清洗劑組成物用原液的特徵在於,相對於該清洗劑組成物用原液100質量份混合100質量份~1500質量份的水而成的清洗劑組成物於1℃~90℃下成為白濁狀態。
Description
本發明是有關於一種清洗劑組成物用原液及包含該清洗劑組成物用原液的清洗劑組成物。
先前,於對各種電子零件或合金製零件單體進行清洗時,一直使用三氯乙烯、全氯乙烯、二氯甲烷、氟氯碳化物等鹵化烴系溶劑。然而,目前,該些溶劑因對人體的毒性、大氣污染或土壤污染等環境問題這一理由而限制使用其,因此提出了代替其的作為非鹵素系清洗劑的烴系清洗劑、二醇系清洗劑及苄醇系清洗劑等(參照專利文獻1、專利文獻2)。
近年來,為了進一步減低環境負荷,提出了利用水將二醇醚系化合物等有機成分稀釋而成的水稀釋型清洗劑(參照專利文獻1~專利文獻2)。水稀釋型清洗劑由於水的質量比率大,因此能夠低成本化、削減有機成分的使用量、抑制揮發性有機化合物(volatile organic compounds,VOC)排出,且可期待環境負荷的減輕。另外,於根據污垢的種類來使有機成分的比率變化而可調整清洗力的方面優異。
就進行水稀釋的時機的觀點而言,水稀釋型清洗劑可分類為稀釋品(參照專利文獻3)與原液品(參照專利文獻4)。稀釋品是將水稀釋後的清洗劑組成物運輸、保管並使用,另一方面,原液品是將清洗劑組成物用原液運輸、保管,於即將使用前利用水稀釋而使用。
[現有技術文獻]
[專利文獻]
[專利文獻1]日本專利特開平10-046198號公報
[專利文獻2]日本專利特開2009-190089號公報
[專利文獻3]日本專利特開2013-181060號公報
[專利文獻4]日本專利特開2015-218295號公報
[發明所欲解決之課題]
然而,本發明者等人進行了研究,結果存在如下情況:當使用如上所述般的包含二醇醚系化合物的水稀釋型清洗劑進行清洗時,清洗性並不充分。
另外,被分類為所述原液品的水稀釋型清洗劑與稀釋品相比較,於可將所述有機成分有效率地運輸、保管的方面優異,但於該原液品不均勻的情況下,於由其獲得的水稀釋型清洗劑中,有機成分的濃度不恆定,清洗劑的品質不穩定,因此於清洗劑的製造方面,處理性存在課題。
另外,於將電子零件焊接於電路基板的銅電極面時,若因熱而於銅表面形成氧化膜(銅氧化膜),則於焊接及清洗的後續步驟中會導致打線接合不良、密封樹脂的密接不良,因此需要去除銅氧化膜,但利用公知的清洗劑難以充分去除該銅氧化膜。另外,即便可暫時去除銅氧化膜,但若銅表面再氧化,則亦形成新的氧化膜,因此作為去除銅氧化膜的清洗劑,亦要求抑制銅的再氧化。
本發明的課題在於提供一種可獲得水稀釋型清洗劑且容易處理的清洗劑組成物用原液,所述水稀釋型清洗劑的清洗性優異,可去除銅氧化膜且可抑制銅表面的再氧化。
另外,本發明的課題在於提供一種清洗劑組成物,其清洗性優異、可去除銅氧化膜且可抑制銅表面的再氧化。
[解決課題之手段]
本發明者等人為了達成所述課題而反覆努力研究,結果發現,藉由以特定的質量比包含規定的非鹵素系有機溶劑、3-胺基-4-辛醇及視需要的水的清洗劑組成物用原液而可解決所述課題。即,本發明是有關於以下的清洗劑組成物用原液及包含其的清洗劑組成物。
1.一種清洗劑組成物用原液,包含:
作為20℃下於水中的溶解度為10質量%以下的二醇醚(A1)及/或苄醇(A2)的非鹵素系有機溶劑(A)、
3-胺基-4-辛醇(B)、及
視需要的水(C),
各成分的含有比率是(A)成分為50質量%~99.9質量%、(B)成分為0.1質量%~45質量%、(C)成分為0質量%~20質量%,且所述清洗劑組成物用原液的特徵在於,
相對於所述清洗劑組成物用原液100質量份混合100質量份~1500質量份的水而成的清洗劑組成物於1℃~90℃下成為白濁狀態。
2.如所述項1所記載的清洗劑組成物用原液,其中,(A1)成分為選自由二丙二醇單正丙基醚、丙二醇單正丁基醚、二丙二醇單正丁基醚、三丙二醇單正丁基醚、乙二醇單正己基醚、二乙二醇單正己基醚、乙二醇單2-乙基己基醚、二乙二醇單2-乙基己基醚、乙二醇單苯基醚、二乙二醇單苯基醚、丙二醇單苯基醚、乙二醇單苄基醚、二乙二醇丁基甲基醚及二乙二醇二正丁基醚所組成的群組中的至少一種。
3.一種清洗劑組成物,包含如所述項1或2所記載的清洗劑組成物用原液及水,
相對於如所述項1或2所記載的清洗劑組成物用原液100質量份,水為100質量份~1500質量份。
4.如所述項3所記載的清洗劑組成物,用於助焊劑殘渣去除用途。
[發明的效果]
本發明的清洗劑組成物用原液由於是所述有機成分被濃縮的均勻的溶液,因此可效率良好地運輸、保管,另外,可獲得品質穩定的水稀釋型清洗劑,因此容易處理。
利用水將本發明的清洗劑組成物用原液稀釋而成的清洗劑組成物由於主成分為水,因此可減低成本及環境負荷,進而,即便提高水的稀釋比率,亦可維持優異的清洗性。另外,所述清洗劑組成物可充分去除形成於電路基板的銅電極面等上的銅氧化膜,且可抑制銅表面的再氧化。
[清洗劑組成物用原液]
本發明的清洗劑組成物用原液(以下,亦稱為原液)為以特定的質量比包含規定的非鹵素系有機溶劑(A)(以下,設為(A)成分)及3-胺基-4-辛醇(B)(以下,設為(B)成分)的組成物。
<非鹵素系有機溶劑(A)>
(A)成分只要是20℃下於水中的溶解度為10質量%以下的二醇醚(A1)(以下,設為(A1)成分)及/或苄醇(A2)(以下,設為(A2)成分),則並無特別限定,可使用各種公知者。(A)成分可單獨使用一種或併用兩種以上。
(二醇醚(A1))
(A1)成分只要是20℃下於水中的溶解度為10質量%以下的二醇醚,則並無特別限定。(A1)成分可單獨使用一種或併用兩種以上。
於(A1)成分的20℃下於水中的溶解度(以下,亦簡稱為水溶解度)超過10質量%的情況下,清洗劑組成物的親水性變高,無法獲得充分的清洗性。就對清洗劑組成物賦予適度的疏水性並發揮優異的清洗性的方面而言,20℃下於水中的溶解度較佳為5質量%以下。另外,就與所述相同的方面而言,20℃下於水中的溶解度較佳為0.1質量%~10質量%的範圍,更佳為0.1質量%~5質量%的範圍。
(A1)成分例如可列舉所述水溶解度為10質量%以下的脂肪族二醇醚、所述水溶解度為10質量%以下的芳香族二醇醚等。
所述脂肪族二醇醚例如可列舉:乙二醇單烷基醚、二乙二醇單烷基醚、三乙二醇單烷基醚、丙二醇單烷基醚、二丙二醇單烷基醚、三丙二醇單烷基醚、乙二醇二烷基醚、二乙二醇二烷基醚、三乙二醇二烷基醚、丙二醇二烷基醚、二丙二醇二烷基醚、三丙二醇二烷基醚等。
所述乙二醇單烷基醚例如可列舉:乙二醇單正己基醚、乙二醇單正庚基醚、乙二醇單正辛基醚、乙二醇單2-乙基己基醚等。
所述二乙二醇單烷基醚例如可列舉:二乙二醇單正己基醚、二乙二醇單正庚基醚、二乙二醇單正辛基醚、二乙二醇單2-乙基己基醚等。
所述三乙二醇單烷基醚例如可列舉:三乙二醇單正己基醚、三乙二醇單正庚基醚、三乙二醇單正辛基醚、三乙二醇單2-乙基己基醚等。
所述丙二醇單烷基醚例如可列舉:丙二醇單正丁基醚、丙二醇單異丁基醚、丙二醇單第三丁基醚、丙二醇單正戊基醚、丙二醇單正己基醚、丙二醇單正庚基醚、丙二醇單正辛基醚、丙二醇單2-乙基己基醚等。
所述二丙二醇單烷基醚例如可列舉:二丙二醇單正丙基醚、二丙二醇單異丙基醚、二丙二醇單正丁基醚、二丙二醇單異丁基醚、二丙二醇單第三丁基醚、二丙二醇單正戊基醚、二丙二醇單正己基醚、二丙二醇單正庚基醚、二丙二醇單正辛基醚、二丙二醇單2-乙基己基醚等。
所述三丙二醇單烷基醚例如可列舉:三丙二醇單正丙基醚、三丙二醇單異丙基醚、三丙二醇單正丁基醚、三丙二醇單異丁基醚、三丙二醇單第三丁基醚、三丙二醇單正戊基醚、三丙二醇單正己基醚、三丙二醇單正庚基醚、三丙二醇單正辛基醚、三丙二醇單2-乙基己基醚等。
所述乙二醇二烷基醚例如可列舉:乙二醇二正丁基醚、乙二醇二異丁基醚、乙二醇二第三丁基醚、乙二醇丁基甲基醚、乙二醇異丁基甲基醚、乙二醇甲基第三丁基醚、乙二醇甲基正戊基醚、乙二醇甲基正己基醚等。
所述二乙二醇二烷基醚例如可列舉:二乙二醇二正丁基醚、二乙二醇二異丁基醚、二乙二醇二第三丁基醚、二乙二醇丁基甲基醚、二乙二醇異丁基甲基醚、二乙二醇甲基第三丁基醚等。
所述三乙二醇二烷基醚例如可列舉:三乙二醇二正丁基醚、三乙二醇二異丁基醚、三乙二醇二第三丁基醚等。
所述丙二醇二烷基醚例如可列舉:丙二醇二正丙基醚、丙二醇二異丙基醚、丙二醇二正丁基醚、丙二醇二異丁基醚、丙二醇二第三丁基醚、丙二醇丁基甲基醚、丙二醇異丁基甲基醚、丙二醇甲基第三丁基醚、丙二醇乙基丁基醚、丙二醇乙基異丁基醚、丙二醇乙基第三丁基醚等。
所述二丙二醇二烷基醚例如可列舉:二丙二醇二正丙基醚、二丙二醇二異丙基醚、二丙二醇二正丁基醚、二丙二醇二異丁基醚、二丙二醇二第三丁基醚、二丙二醇丁基甲基醚、二丙二醇異丁基甲基醚、二丙二醇甲基第三丁基醚、二丙二醇乙基正丙基醚、二丙二醇乙基異丙基醚、二丙二醇乙基丁基醚、二丙二醇乙基異丁基醚、二丙二醇乙基第三丁基醚等。
所述三丙二醇二烷基醚例如可列舉:三丙二醇二正丙基醚、三丙二醇二異丙基醚、三丙二醇二正丁基醚、三丙二醇二異丁基醚、三丙二醇二第三丁基醚、三丙二醇丁基甲基醚、三丙二醇異丁基甲基醚、三丙二醇甲基第三丁基醚、三丙二醇乙基丁基醚、三丙二醇乙基異丁基醚、三丙二醇乙基第三丁基醚等。
作為所述芳香族二醇醚,例如可列舉:乙二醇單苯基醚、丙二醇單苯基醚、乙二醇二苯基醚、二乙二醇單苯基醚、乙二醇單苄基醚、乙二醇二苄基醚等。
就清洗劑組成物的清洗性特別良好的方面而言,(A1)成分較佳為選自由二丙二醇單正丙基醚、丙二醇單正丁基醚、二丙二醇單正丁基醚、三丙二醇單正丁基醚、乙二醇單正己基醚、二乙二醇單正己基醚、乙二醇單2-乙基己基醚、二乙二醇單2-乙基己基醚、乙二醇單苯基醚、二乙二醇單苯基醚、丙二醇單苯基醚、乙二醇單苄基醚、二乙二醇丁基甲基醚及二乙二醇二正丁基醚所組成的群組中的至少一種,就相同的方面而言,更佳為選自由二丙二醇單正丙基醚、丙二醇單正丁基醚、二丙二醇單正丁基醚、三丙二醇單正丁基醚、丙二醇單苯基醚及二乙二醇二正丁基醚所組成的群組中的至少一種。
(苄醇(A2))
(A2)成分只要是苄醇,則並無特別限定,可使用各種公知者。
(A)成分的含量相對於原液100質量%而為50質量%~99.9質量%。於(A)成分的含量為50質量%~99.9質量%的情況下,清洗劑組成物發揮優異的清洗性。
若(A)成分的含量相對於原液100質量%而未滿50質量%,則有清洗劑組成物無法發揮充分的清洗性的傾向。就清洗劑組成物的清洗性優異的方面而言,(A)成分的含量相對於原液100質量%而較佳為60質量%~99質量%左右,更佳為70質量%~99質量%左右,特佳為80質量%~99質量%左右。
<3-胺基-4-辛醇(B)>
(B)成分只要是3-胺基-4-辛醇,則可無特別限制地使用各種公知者。先前公知的清洗劑難以充分去除形成於電路基板的銅電極面等上的銅氧化膜,但本發明者等人進行了努力研究,結果發現,藉由在水稀釋型清洗劑中使用3-胺基-4-辛醇,可在顯示出優異的清洗性的同時充分去除銅氧化膜,進而可抑制銅表面的再氧化。
(B)成分的含量相對於原液100質量%而為0.1質量%~45質量%。於(B)成分的含量為0.1質量%~45質量%的情況下,清洗劑組成物發揮優異的清洗性,可去除銅氧化膜,並抑制銅表面的再氧化。
若(B)成分的含量相對於原液100質量%而未滿0.1質量%,則有清洗劑組成物無法發揮充分的清洗性,無法充分去除銅氧化膜,亦無法抑制銅表面的再氧化的傾向。另外,若(B)成分的含量相對於原液100質量%而超過45質量%,則有清洗劑組成物無法發揮充分的清洗性的傾向。就清洗劑組成物的清洗性及銅氧化膜的去除性優異且抑制銅表面的再氧化的方面而言,(B)成分的含量相對於原液100質量%而較佳為1質量%~15質量%左右,更佳為1質量%~10質量%左右。
(水(C))
所述清洗劑組成物用原液亦可包含水(C)(以下,設為(C)成分)作為任意成分。所述清洗劑組成物用原液藉由包含(C)成分,不具有閃點而被分類為消防法的非危險物,因此更容易處理。
(C)成分只要是水,則並無特別限定,例如可列舉:超純水、純水、離子交換水、精製水等。
(C)成分的含量並無特別限定,就原液的運輸效率、保管性及處理性優異的方面而言,相對於原液100質量%,較佳為0質量%~20質量%,更佳為1質量%~10質量%左右。若(C)成分的含量相對於原液100質量%而超過20質量%,則有原液變得不均勻且處理性差的傾向,而且有清洗劑組成物無法發揮充分的清洗性的傾向。
(二醇醚(D))
所述清洗劑組成物用原液只要可獲得本發明的效果,則更可包含20℃下於水中的溶解度超過10質量%的二醇醚(D)(以下,設為(D)成分)。(D)成分只要是20℃下於水中的溶解度超過10質量%的二醇醚,則並無特別限定。(D)成分可單獨使用一種或併用兩種以上。
(D)成分例如可列舉所述水溶解度超過10質量%的脂肪族二醇醚等。該脂肪族二醇醚例如可列舉:乙二醇單正丁基醚、乙二醇單異丁基醚、乙二醇單第三丁基醚、二乙二醇單正丁基醚、二乙二醇單異丁基醚、二乙二醇單第三丁基醚、二丙二醇單甲基醚、三丙二醇單甲基醚等。
(D)成分的含量並無特別限定,就清洗劑組成物的清洗性優異的方面而言,相對於原液100質量%,較佳為0質量%~30質量%,就相同的方面而言,相對於原液100質量%,更佳為0質量%~10質量%左右。
(各成分的比率)
於所述清洗劑組成物用原液中,(A)成分與(B)成分的質量比並無特別限定,就清洗劑組成物的清洗性及銅氧化膜的去除性優異且抑制銅表面的再氧化的方面而言,較佳為85~99:1~15左右。
於所述清洗劑組成物用原液中,(A)成分及(B)成分的合計與(C)成分的質量比並無特別限定,就原液不具有閃點而被分類為消防法的非危險物,清洗劑組成物發揮優異的清洗性,可去除銅氧化膜且可抑制銅表面的再氧化的方面而言,較佳為90~99:1~10左右。
於所述清洗劑組成物用原液中,(A)成分、(B)成分及(C)成分的質量比並無特別限定,就原液不具有閃點而被分類為消防法的非危險物,清洗劑組成物發揮優異的清洗性,可去除銅氧化膜且可抑制銅表面的再氧化的方面而言,較佳為75~98:1~15:1~10左右。
(其他成分)
所述清洗劑組成物用原液只要可獲得本發明的效果,則可包含除(A)成分~(D)成分以外的成分(以下,稱為其他成分)。其他成分例如可列舉除(A)成分、(B)成分及(D)成分以外的有機溶劑、添加劑等。
作為所述有機溶劑的具體例,可列舉:己烷、庚烷、辛烷等烴系溶劑;甲醇、乙醇、丙醇、3-甲氧基二甲基-3-甲基-1-丁醇等醇系溶劑;丙酮、甲基乙基酮等酮系溶劑;二乙基醚、四氫呋喃等醚系溶劑;乙酸乙酯、乙酸甲酯等酯系溶劑;1,3-二甲基-2-咪唑啶酮、1,3-二乙基-2-咪唑啶酮、1,3-二丙基-2-咪唑啶酮、N-甲基-2-吡咯啶酮等含氮化合物系溶劑等。所述有機溶劑可為單獨一種或組合兩種以上。
作為所述添加劑的具體例,可列舉:防鏽劑、界面活性劑、消泡劑、抗氧化劑、螯合劑、有機酸、胺系化合物、有機磷系化合物等。所述添加劑可為單獨一種或組合兩種以上。
所述界面活性劑並無特別限定,可使用各種公知者。作為所述界面活性劑,例如可列舉:非離子性界面活性劑、陰離子性界面活性劑、陽離子性界面活性劑、兩性界面活性劑等。所述界面活性劑可為單獨一種或組合兩種以上。
所述非離子性界面活性劑例如可列舉通式(3):R4-O-(CH
2-CH
2-O)
e-H(式中,R4表示碳數8~20的烷基,e表示0~20的整數)所表示的化合物或脂肪酸醯胺的環氧乙烷加成物、山梨糖醇酐脂肪酸酯、蔗糖脂肪酸酯、脂肪酸烷醇醯胺、該些所對應的聚氧丙烯系界面活性劑、聚氧伸烷基胺系界面活性劑等。
所述陰離子性界面活性劑例如可列舉:硫酸酯系陰離子性界面活性劑(高級醇的硫酸酯鹽、烷基硫酸酯鹽、聚氧乙烯烷基硫酸酯鹽等)、磺酸鹽系陰離子性界面活性劑(烷基磺酸鹽、烷基苯磺酸鹽等)、聚氧伸烷基磷酸酯系界面活性劑等。
所述陽離子性界面活性劑例如可列舉烷基化銨鹽、四級銨鹽等。
所述兩性界面活性劑例如可列舉胺基酸型、甜菜鹼型兩性界面活性劑等。
所述界面活性劑的含量並無特別限定,就清洗劑組成物發揮優異的清洗性,可去除銅氧化膜且抑制銅表面的再氧化的方面而言,相對於原液100質量%,較佳為0質量%~15質量%。
作為所述螯合劑,只要是具有配位於金屬離子的能力的金屬螯合劑,則並無特別限定,可使用各種公知者。所述螯合劑例如可列舉:羧酸系螯合劑、胺基酸系螯合劑、膦酸系螯合劑、磷酸系螯合劑、胺基羧酸系螯合劑、羥基羧酸系螯合劑等。該些螯合劑可為鈉鹽、鉀鹽、銨鹽等鹽,亦可為能夠水解的酯衍生物。所述螯合劑可為單獨一種或組合兩種以上。
所述羧酸系螯合劑例如可列舉:草酸、丙二酸、琥珀酸、戊二酸、己二酸、衣康酸、乙醯水楊酸、鄰苯二甲酸、偏苯三甲酸、環戊烷四羧酸等。
所述胺基酸系螯合劑例如可列舉:甘胺酸、丙胺酸、離胺酸、精胺酸、天冬醯胺酸、酪胺酸等。
所述膦酸系螯合劑例如可列舉:羥基乙烷二膦酸、氮基三亞甲基膦酸、N,N,N',N'-四(膦醯基甲基)乙二胺等。
所述磷酸系螯合劑例如可列舉:正磷酸、焦磷酸、三磷酸、聚磷酸等。
所述胺基羧酸系螯合劑例如可列舉:乙二胺四乙酸(Ethylene Diamine Tetraacetic Acid,EDTA)、環己烷二胺四乙酸(Cyclohexane Diamine Tetraacetic Acid,CDTA)、氮基三乙酸(Nitrilotriacetic Acid,NTA)、二乙三胺五乙酸(Diethylene Triamine Pentaacetic Acid,DTPA)、亞胺基二乙酸(Imino Diacetic Acid,IDA)、N-(2-羥基乙基)亞胺基二乙酸(N-(2-Hydroxyethyl)imino diacetic Acid,HIMDA)、羥基乙基乙二胺三乙酸(Hydroxyethyl Ethylenediamine Triacetic Acid,HEDTA)等。
所述羥基羧酸系螯合劑例如可列舉:蘋果酸、檸檬酸、異檸檬酸、乙醇酸、葡萄糖酸、水楊酸、酒石酸、乳酸等。
作為所述胺系化合物,並無特別限定,可使用各種公知者。所述胺系化合物例如可列舉脂肪族胺、烷醇胺等。該些胺系化合物可為鹽。所述胺系化合物可為單獨一種或組合兩種以上。再者,所述胺系化合物不包含(B)成分。
所述脂肪族胺例如可列舉:辛基胺、癸基胺、十二烷基胺、十四烷基胺、十六烷基胺、2-乙基己基胺等一級脂肪族胺;N,N,N',N'-四甲基五亞甲基二胺、N,N,N',N'-四乙基五亞甲基二胺、N,N,N',N'-四異丙基五亞甲基二胺、N,N,N',N'-四正丙基五亞甲基二胺、N,N,N',N'-四甲基六亞甲基二胺、N,N,N',N'-四乙基六亞甲基二胺、N,N,N',N'-四異丙基六亞甲基二胺、N,N,N',N'-四正丙基六亞甲基二胺等三級二胺;雙(2-二甲基胺基乙基)醚、雙(2-二乙基胺基乙基)醚、雙(2-二異丙基胺基乙基)醚、雙(2-二正丙基胺基乙基)醚等二胺基烷基醚;1,1,7,7-四甲基二乙三胺、1,1,7,7-四乙基二乙三胺、1,1,7,7-四異丙基二乙三胺、1,1,7,7-四正丙基二乙三胺、N,N,N',N'',N''-五甲基二乙三胺、4-甲基-1,1,7,7-四乙基二乙三胺、4-甲基-1,1,7,7-四異丙基二乙三胺、4-甲基-1,1,7,7-四正丙基二乙三胺等三胺等。
所述烷醇胺例如可列舉:N-甲基甲醇胺、N-乙基甲醇胺、N-正丙基甲醇胺、N-正丁基甲醇胺、N-甲基乙醇胺、N-乙基乙醇胺、N-正丙基乙醇胺、N-異丙基乙醇胺、N-正丁基乙醇胺、N-甲基丙醇胺、N-乙基丙醇胺、N-正丙基丙醇胺、N-異丙基丙醇胺、N-正丁基丙醇胺、N-甲基丁醇胺、N-乙基丁醇胺、N-正丙基丁醇胺、N-異丙基丁醇胺、N-正丁基丁醇胺、N,N-二甲基乙醇胺、N,N-二乙基乙醇胺、N,N-二正丙基乙醇胺、N,N-二正丁基乙醇胺、N,N-二甲基丙醇胺、N,N-二甲基異丙醇胺、N,N-二甲基丁醇胺、二乙醇胺、N-甲基二乙醇胺、N-乙基二乙醇胺、N-正丁基二乙醇胺、N-第三丁基二乙醇胺、N-環己基二乙醇胺、三乙醇胺、二異丙醇胺、三異丙醇胺、N-(β-胺基乙基)乙醇胺、N-(β-胺基乙基)異丙醇胺、N,N-二丁基丙醇胺等。
作為所述有機磷系化合物,並無特別限定,可使用各種公知者。所述有機磷系化合物例如可列舉:磷酸酯、亞磷酸酯、膦酸等。該些有機磷系化合物可為鹽。所述有機磷系化合物可為單獨一種或組合兩種以上。
所述磷酸酯例如可列舉:磷酸單甲酯、磷酸二甲酯、磷酸三甲酯、磷酸單乙酯、磷酸二乙酯、磷酸三乙酯、磷酸單丙酯、磷酸二丙酯、磷酸三丙酯、磷酸單丁酯、磷酸二丁酯、磷酸三丁酯、磷酸單己酯、磷酸二己酯、磷酸三己酯、磷酸單辛酯、磷酸二辛酯、磷酸三辛酯、磷酸單癸酯、磷酸二癸酯、磷酸三癸酯、磷酸單十一烷基酯、磷酸二-十一烷基酯、磷酸三-十一烷基酯、磷酸單十二烷基酯、磷酸二-十二烷基酯、磷酸三-十二烷基酯、磷酸單十三烷基酯、磷酸二-十三烷基酯、磷酸三-十三烷基酯、磷酸單硬脂酯、磷酸二硬脂酯、磷酸三硬脂酯、磷酸單油烯酯、磷酸二油烯酯、磷酸三油烯酯、磷酸單苯酯、磷酸二苯酯、磷酸三苯酯等。
所述亞磷酸酯例如可列舉:亞磷酸單甲酯、亞磷酸二甲酯、亞磷酸三甲酯、亞磷酸單乙酯、亞磷酸二乙酯、亞磷酸三乙酯、亞磷酸單丙酯、亞磷酸二丙酯、亞磷酸三丙酯、亞磷酸單丁酯、亞磷酸二丁酯、亞磷酸三丁酯、亞磷酸單己酯、亞磷酸二己酯、亞磷酸三己酯、亞磷酸單辛酯、亞磷酸二辛酯、亞磷酸三辛酯、亞磷酸單癸酯、亞磷酸二癸酯、亞磷酸三癸酯、亞磷酸單十一烷基酯、亞磷酸二-十一烷基酯、亞磷酸三-十一烷基酯、亞磷酸單十二烷基酯、亞磷酸二-十二烷基酯、亞磷酸三-十二烷基酯、亞磷酸單十三烷基酯、亞磷酸二-十三烷基酯、亞磷酸三-十三烷基酯、亞磷酸單硬脂酯、亞磷酸二硬脂酯、亞磷酸三硬脂酯、亞磷酸單油烯酯、亞磷酸二油烯酯、亞磷酸三油烯酯、亞磷酸單苯酯、亞磷酸二苯酯、亞磷酸三苯酯等。
所述膦酸例如可列舉:甲基膦酸、乙基膦酸、丙基膦酸、丁基膦酸、己基膦酸、辛基膦酸、癸基膦酸、十一烷基膦酸、十二烷基膦酸、十三烷基膦酸、硬脂基膦酸、油烯基膦酸、苯基膦酸等。
於所述清洗劑組成物用原液中,(A)成分~(D)成分及其他成分的調配方法並無特別限定,可使用通常的液體混合方法。作為具體的調配方法,可列舉攪拌法。
[清洗劑組成物]
本發明的清洗劑組成物可藉由相對於包含(A)成分~(B)成分及視需要的(C)成分的清洗劑組成物用原液100質量份混合100質量份~1500質量份左右的水而獲得。若水的調配量未滿100質量份,則清洗劑組成物的成本及環境負荷變高,無法有效利用水稀釋型清洗劑的特長,就此方面而言欠佳。若水的調配量超過1500質量份,則無法獲得充分的清洗性,因此有時引起清洗不良。
就可減低清洗劑組成物的成本及環境負荷並獲得充分的清洗性的方面而言,所述清洗劑組成物中的水的調配量相對於清洗劑組成物用原液100質量份而較佳為200質量份~1200質量份左右,更佳為400質量份~900質量份左右。
藉由將清洗劑組成物用原液與水以所述質量比混合,所述清洗劑組成物的外觀於1℃~90℃下成為油滴分散於水中的白濁狀態(以下,亦稱為完全白濁系)。
就水稀釋後的清洗劑組成物的懸浮狀態的觀點而言,水稀釋型清洗劑被分類為均勻系、加溫白濁系及本發明的完全白濁系三種。均勻系是於1℃~90℃下外觀透明的清洗劑,加溫白濁系是於低於濁點的溫度下外觀透明且於濁點以上的溫度下成為白濁狀態的清洗劑。而且,於水稀釋型清洗劑中,完全白濁系的水稀釋型清洗劑與均勻系及加溫白濁系者相比,通常去除油溶性及水溶性的污垢的能力高且具有充分的清洗性。即,本發明的清洗劑組成物是完全白濁系,因此與所述均勻系及加溫白濁系的水稀釋型清洗劑相比,發揮優異的清洗性。
於所述清洗劑組成物中,所述清洗劑組成物用原液及水的混合方法並無特別限定,可使用通常的液體混合方法。作為具體的混合方法,可列舉攪拌法。
所述清洗劑組成物若按清洗對象進行分類,則例如可列舉:助焊劑殘渣用清洗劑、焊接用助焊劑用清洗劑、焊膏用清洗劑、工業油用清洗劑等。另外,若按被清洗物進行分類,則例如可列舉電子材料用清洗劑等。
所述電子材料可例示:光罩、光學透鏡、真空放電管、觸控面板、顯示設備用玻璃等玻璃加工品;金屬遮罩、托板(Pallet)、印刷電路基板、可撓性配線基板、陶瓷配線基板、半導體元件、半導體封裝、磁性媒體、功率模組、相機模組、引線框架、磁盤、散熱器等金屬加工品;玻璃環氧基板、聚醯亞胺基板、酚醛紙基板、塑膠模製零件等樹脂加工品;矽(Si)、藍寶石(Al
2O
3)、碳化矽(SiC)、金剛石(C)、氮化鎵(GaN)、磷化鎵(GaP)、砷化鎵(GaAs)、磷化銦(InP)等晶圓及將它們切斷(切片、切塊等)、磨削(背面研磨、噴砂等)、倒角(斜切(beveling)、滾筒(barrel)等)、研磨(精磨(lapping)、拋光(polishing)、磨光(buff)等)的加工品;以及對該些物品進行加工、安裝、熔接、清洗、搬送時使用的夾具、載體、暗匣(magazine)等。
[清洗對象]
本發明的清洗劑組成物的清洗對象並無特別限定,例如可列舉:焊接用助焊劑、焊膏、助焊劑殘渣、工業油及切屑等。該些中,作為所述清洗劑組成物的清洗對象,適合的是選自由焊接用助焊劑、焊膏及助焊劑殘渣所組成的群組中的一種。
於本說明書中,「焊接用助焊劑」為用於去除焊料及母材(金屬電極等)表面的氧化皮膜,使兩者容易接合的組成物。通常而言,可包含基質樹脂、活性劑及有機溶劑,視需要亦可包含觸變劑、抗氧化劑、其他添加劑。另外,焊接用助焊劑根據其組成而被分類為焊膏用助焊劑以及焊絲用助焊劑、後焊劑及預焊劑等非焊膏用助焊劑。
所述基質樹脂例如可列舉松香系基質樹脂及非松香系基質樹脂等。該松香系基質樹脂例如可列舉:天然松香、松香衍生物及該些的精製物等。天然松香例如可列舉:脂松香、松油松香及木松香等。松香衍生物例如可列舉:天然松香的氫化物及歧化物;聚合松香、不飽和酸改質松香、松香酯、氫化不飽和酸改質松香等。所述聚合松香、所述不飽和酸改質松香及所述松香酯可使用所述天然松香或者所述天然松香的氫化物或歧化物等來製造。構成所述松香酯的多元醇可例示甘油、季戊四醇等。構成所述不飽和酸改質松香的不飽和酸可例示:丙烯酸、富馬酸、馬來酸等。非松香系基質樹脂例如可列舉:環氧樹脂、丙烯酸樹脂、聚醯亞胺樹脂、尼龍樹脂、聚丙烯腈樹脂、氯乙烯樹脂、乙酸乙烯樹脂、聚烯烴樹脂、氟系樹脂、丙烯腈丁二烯苯乙烯(Acrylonitrile Butadiene Styrene,ABS)樹脂、異戊二烯橡膠、苯乙烯丁二烯橡膠(styrene butadiene rubber,SBR)、丁二烯橡膠(butadiene rubber,BR)、氯丁二烯橡膠、尼龍橡膠、尼龍系彈性體、聚酯系彈性體等。
所述活性劑例如可列舉:琥珀酸、己二酸、壬二酸、戊二酸、癸二酸、十二烷二酸、二聚物酸(Dimer acid)、富馬酸、馬來酸、衣康酸、反式(trans)-2,3-二溴-1,4-丁烯二醇、順式(cis)-2,3-二溴-1,4-丁烯二醇、3-溴丙酸、2-溴戊酸、5-溴正戊酸、2-溴異戊酸、乙基胺溴酸鹽、二乙基胺溴酸鹽、二乙基胺鹽酸鹽、甲基胺溴酸等。
所述有機溶劑例如可列舉:乙醇、正丙醇、異丙醇、異丁醇、丁基卡必醇、己基二乙二醇(Hexyl diglycol)、己基卡必醇、乙酸異丙酯、丙酸乙酯、苯甲酸丁酯、己二酸二乙酯、正己烷、十二烷、十四碳烯等。
所述觸變劑例如可列舉:蓖麻油、硬化蓖麻油、蜂蠟、巴西棕櫚蠟、硬脂酸醯胺、12-羥基硬脂酸乙烯雙醯胺等。
所述抗氧化劑例如可列舉:季戊四醇-四[3-(3,5-二第三丁基-4-羥基苯基)丙酸酯]、十八烷基-3-(3,5-二第三丁基-4-羥基苯基)丙酸酯、N,N'-六亞甲基雙(3,5-二第三丁基-4-羥基-氫桂皮醯胺)、1,3,5-三甲基-2,4,6-三(3,5-二第三丁基-4-羥基苄基)苯、2,6-二第三丁基-對甲酚、三苯基亞磷酸鹽、三乙基亞磷酸鹽、三月桂基三硫代亞磷酸鹽、三(十三烷基)亞磷酸鹽等。
所述其他添加劑例如可列舉:防黴劑、消光劑、增稠防止劑、界面活性劑等。
於本說明書中,「焊膏」是焊接用助焊劑及焊料粉末的混合物。焊料粉末例如可列舉:Sn-Ag系、Sn-Cu系、Sn-Sb系、Sn-Zn系的無鉛焊料粉末;以及以鉛為結構成分的含鉛焊料粉末。另外,該些焊料金屬可為摻雜有Ag、Al、Au、Bi、Co、Cu、Fe、Ga、Ge、In、Ni、P、Pt、Sb、Zn的一種或兩種以上的元素者。焊膏藉由絲網印刷並介隔金屬遮罩而供給至電極上,於其上載置電子零件後,於加熱下進行焊接。
附著有所述焊接用助焊劑或焊膏的物品可例示:絲網印刷用的金屬遮罩、刮板、分配方式用的噴嘴、注射器及基板固定用的夾具等。
所述助焊劑殘渣為使用焊膏、焊絲、焊接用助焊劑、預焊劑、後焊劑等將電子零件等與電極接合後所產生的殘渣。助焊劑殘渣會腐蝕焊料金屬及母材,或使基板的絕緣電阻降低,因此需要藉由清洗來去除。
附著有所述助焊劑殘渣的物品例如可列舉:印刷電路基板、陶瓷配線基板、半導體元件搭載基板、晶圓、帶式自動接合(Tape Automated Bonding,TAB)帶、引線框架、功率模組及相機模組等。另外,關於相對應者,可焊接積體電路(Integrated Circuit,IC)、電容器、電阻器、二極體、電晶體、線圈及晶片尺寸封裝(Chip Size Package,CSP)等電子零件,或可形成球柵陣列(Ball Grid Array,BGA)、針柵陣列(Pin Grid Array,PGA)及地柵陣列(Land Grid Array,LGA)等,或可實施焊料調平等預處理。
所述工業油例如可列舉:加工油、切削油、礦物油、機械油潤滑脂、潤滑油、防鏽油、蠟、瀝青、石蠟、油脂、潤滑脂等。該些於機械加工、金屬加工等領域中用於減低材料與工具間的摩擦來防止留痕,或減低加工所需的力而容易地形成,或防止製品生鏽或腐蝕。
附著有所述工業油的物品例如可列舉:螺栓、螺母、箍及墊圈等成型零件;以及引擎活塞等汽車零件;齒輪、桿軸、鏈輪及鏈條等產業機械零件;硬式磁碟機(Hard Disk Drive,HDD)用部件及引線框架等電子零件等。
其他清洗對象例如可列舉於對印刷電路基板、陶瓷配線基板、半導體元件搭載基板、蓋玻璃及晶圓等進行切塊加工時所產生的切屑等。
[清洗方法]
使用所述清洗劑組成物來清洗附著有所述清洗對象的被清洗物的方法並無特別限定,可應用各種公知的方法。具體而言,例如可列舉包括清洗步驟、水漂洗步驟以及乾燥步驟的清洗方法。
所述清洗步驟為使被清洗物與所述清洗劑組成物接觸來去除清洗對象的步驟。所述水漂洗步驟為使被清洗物與漂洗水接觸來去除附著於被清洗物的清洗劑組成物的步驟。所述乾燥步驟為去除附著於被清洗物的漂洗水的步驟。
使所述清洗劑組成物及漂洗水與被清洗物接觸的手段並無特別限定,例如可列舉:浸漬攪拌法、液中噴淋法、氣中噴淋法、超音波清洗法等。
所述清洗劑組成物藉由混合而製成白濁狀態來發揮優異的清洗性,因此就混合清洗劑組成物的力強且清洗性、生產性優異的方面而言,作為清洗方法,較佳為氣中噴淋法。
[實施例]
以下,列舉實施例來更詳細地說明本發明,但本發明並不僅限定於該些實施例。另外,實施例中,只要無特別說明,則「%」及「份」是指「質量%」、「質量份」。
[清洗劑組成物用原液及清洗劑組成物的製備]
實施例1
將二丙二醇單正丙基醚90份((A)成分)、3-胺基-4-辛醇5份((B)成分)及水5份((C)成分)混合來製備清洗劑組成物用原液。然後,相對於所述清洗劑組成物用原液100份添加水400份來製備清洗劑組成物X(清洗劑組成物用原液的濃度為20質量%)。另外,相對於所述清洗劑組成物用原液100份添加水900份來製備清洗劑組成物Y(清洗劑組成物用原液的濃度為10質量%)。
實施例2~實施例26及比較例1~比較例18
於實施例1中,將清洗劑組成物用原液的各成分變更為表1、表2所示者,除此以外,與實施例1同樣地製備。再者,表1、表2中的值的單位為質量份。另外,於實施例1~實施例26的清洗劑組成物X、清洗劑組成物Y中,當將該些清洗劑組成物加溫至1℃~90℃時,於任一溫度下,其外觀均成為白濁狀態。
[表1]
清洗劑組成物用原液 | ||||||||
(A) | (B) | (C) | (D) | |||||
質量份 | 質量份 | 質量份 | 質量份 | |||||
實施例1 | PFDG | 90 | 3A4O | 5 | 水 | 5 | - | - |
實施例2 | BFG | 90 | 3A4O | 5 | 水 | 5 | - | - |
實施例3 | BFDG | 90 | 3A4O | 5 | 水 | 5 | - | - |
實施例4 | BFTG | 90 | 3A4O | 5 | 水 | 5 | - | - |
實施例5 | HeG | 90 | 3A4O | 5 | 水 | 5 | - | - |
實施例6 | HeDG | 90 | 3A4O | 5 | 水 | 5 | - | - |
實施例7 | EHG | 90 | 3A4O | 5 | 水 | 5 | - | - |
實施例8 | EHDG | 90 | 3A4O | 5 | 水 | 5 | - | - |
實施例9 | PhG | 90 | 3A4O | 5 | 水 | 5 | - | - |
實施例10 | PhDG | 90 | 3A4O | 5 | 水 | 5 | - | - |
實施例11 | PhFG | 90 | 3A4O | 5 | 水 | 5 | - | - |
實施例12 | BzOH | 90 | 3A4O | 5 | 水 | 5 | - | - |
實施例13 | BzG | 90 | 3A4O | 5 | 水 | 5 | - | - |
實施例14 | BDM | 90 | 3A4O | 5 | 水 | 5 | - | - |
實施例15 | DBDG | 90 | 3A4O | 5 | 水 | 5 | - | - |
實施例16 | BFDG EHG | 65 25 | 3A4O | 5 | 水 | 5 | - | - |
實施例17 | BFDG DBDG | 65 25 | 3A4O | 5 | 水 | 5 | - | - |
實施例18 | BFDG PhFG | 65 25 | 3A4O | 5 | 水 | 5 | - | - |
實施例19 | BFDG BzOH | 65 25 | 3A4O | 5 | 水 | 5 | - | - |
實施例20 | BFDG | 94.5 | 3A4O | 0.1 | 水 | 5 | - | - |
實施例21 | BFDG | 55 | 3A4O | 45 | - | - | - | - |
實施例22 | BFDG | 65 | 3A4O | 30 | 水 | 5 | - | - |
實施例23 | BFDG | 80 | 3A4O | 15 | 水 | 5 | - | - |
實施例24 | BFDG | 90 | 3A4O | 5 | 水 | 10 | - | - |
實施例25 | BFDG | 50 | 3A4O | 5 | 水 | 20 | BDG | 25 |
實施例26 | BFDG | 95 | 3A4O | 5 | - | - | - | - |
[表2]
清洗劑組成物用原液 | ||||||||
(A) | (B)、(B)' | (C) | (D) | |||||
質量份 | 質量份 | 質量份 | 質量份 | |||||
比較例1 | - | - | 3A4O | 95 | 水 | 5 | - | - |
比較例2 | - | - | 3A4O | 5 | 水 | 5 | BDG | 90 |
比較例3 | - | - | 3A4O | 5 | 水 | 5 | MFTG | 90 |
比較例4 | - | - | 3A4O | 5 | 水 | 5 | MFDG | 90 |
比較例5 | BFDG | 95 | - | - | 水 | 5 | - | - |
比較例6 | BFDG | 90 | MBD | 5 | 水 | 5 | - | - |
比較例7 | BFDG | 90 | AEE | 5 | 水 | 5 | - | - |
比較例8 | BFDG | 90 | MEA | 5 | 水 | 5 | - | - |
比較例9 | BFDG | 90 | AMP | 5 | 水 | 5 | - | - |
比較例10 | BFDG | 90 | TRISA | 5 | 水 | 5 | - | - |
比較例11 | BFDG | 90 | DMDA | 5 | 水 | 5 | - | - |
比較例12 | BFDG | 65 | 3A4O | 5 | 水 | 30 | - | - |
比較例13 | BFDG | 50 | 3A4O | 50 | - | - | - | - |
比較例14 | BFDG | 25 | 3A4O | 70 | 水 | 5 | - | - |
比較例15 | BFDG BFG | 19 19 | 3A4O | 19 | 水 | 5 | MFTG | 38 |
比較例16 | BFDG | 19 | 3A4O | 19 | 水 | 5 | MFDG MFTG | 19 38 |
比較例17 | BFDG BFG | 5 5 | 3A4O | 5 | 水 | 75 | MFTG | 10 |
比較例18 | BFDG | 5 | 3A4O | 5 | 水 | 75 | MFDG MFTG | 5 10 |
表1、表2的各成分的簡稱、(A)成分、(D)成分於水中的溶解度如表3所示。
[表3]
簡稱 | 化合物名稱 | 於水中的溶解度、20℃(質量%) | |
(A) | PFDG | 二丙二醇單正丙基醚 | 4.8 |
BFG | 丙二醇單正丁基醚 | 6.4 | |
BFDG | 二丙二醇單正丁基醚 | 3.0 | |
BFTG | 三丙二醇單正丁基醚 | 0.4 | |
HeG | 乙二醇單正己基醚 | 1.0 | |
HeDG | 二乙二醇單正己基醚 | 1.7 | |
EHG | 乙二醇單2-乙基己基醚 | 0.2 | |
EHDG | 二乙二醇單2-乙基己基醚 | 0.3 | |
PhG | 乙二醇單苯基醚 | 2.7 | |
PhDG | 二乙二醇單苯基醚 | 3.4 | |
PhFG | 丙二醇單苯基醚 | 0.2 | |
BzOH | 苄醇 | 4.0 | |
BzG | 乙二醇單苄基醚 | 0.4 | |
BDM | 二乙二醇丁基甲基醚 | 9.2 | |
DBDG | 二乙二醇二正丁基醚 | 0.3 | |
(B) | 3A4O | 3-胺基-4-辛醇 | - |
(C) | 水 | 水 | - |
(D) | BDG | 二乙二醇單正丁基醚 | ∞ |
MFTG | 三丙二醇單甲基醚 | ∞ | |
MFDG | 二丙二醇單甲基醚 | ∞ | |
(B)' | MBD | N-正丁基二乙醇胺 | - |
AEE | 二乙二醇胺 | - | |
MEA | 單乙醇胺 | - | |
AMP | 2-胺基-2-甲基-1-丙醇 | - | |
TRISA | 三(羥基甲基)胺基甲烷 | - | |
DMDA | N,N-二甲基十二烷基胺 | - |
使用實施例1~實施例26及比較例1~比較例18中所獲得的清洗劑組成物用原液,對外觀進行評價。另外,使用實施例1~實施例26及比較例1~比較例18中所獲得的清洗劑組成物X、清洗劑組成物Y,對清洗性、銅氧化膜去除性及銅再氧化防止性進行評價。將結果示於表4、表5中。
[表4]
原液 | 清洗劑組成物X | 清洗劑組成物Y | ||||||
外觀 | 清洗性 | 銅氧化膜 去除性 | 銅再氧化 防止性 | 清洗性 | 銅氧化膜 去除性 | 銅再氧化 防止性 | ||
實施例1 | 均勻 | ◎ | ○ | ○ | ◎ | ○ | ○ | |
實施例2 | 均勻 | ◎ | ○ | ○ | ◎ | ○ | ○ | |
實施例3 | 均勻 | ◎ | ○ | ○ | ◎ | ○ | ○ | |
實施例4 | 均勻 | ◎ | ○ | ○ | ◎ | ○ | ○ | |
實施例5 | 均勻 | ◎ | ○ | ○ | ◎ | ○ | ○ | |
實施例6 | 均勻 | ◎ | ○ | ○ | ◎ | ○ | ○ | |
實施例7 | 均勻 | ◎ | ○ | ○ | ◎ | ○ | ○ | |
實施例8 | 均勻 | ◎ | ○ | ○ | ◎ | ○ | ○ | |
實施例9 | 均勻 | ◎ | ○ | ○ | ◎ | ○ | ○ | |
實施例10 | 均勻 | ◎ | ○ | ○ | ◎ | ○ | ○ | |
實施例11 | 均勻 | ◎ | ○ | ○ | ◎ | ○ | ○ | |
實施例12 | 均勻 | ◎ | ○ | ○ | ◎ | ○ | ○ | |
實施例13 | 均勻 | ◎ | ○ | ○ | ◎ | ○ | ○ | |
實施例14 | 均勻 | ◎ | ○ | ○ | ◎ | ○ | ○ | |
實施例15 | 均勻 | ◎ | ○ | ○ | ◎ | ○ | ○ | |
實施例16 | 均勻 | ◎ | ○ | ○ | ◎ | ○ | ○ | |
實施例17 | 均勻 | ◎ | ○ | ○ | ◎ | ○ | ○ | |
實施例18 | 均勻 | ◎ | ○ | ○ | ◎ | ○ | ○ | |
實施例19 | 均勻 | ◎ | ○ | ○ | ◎ | ○ | ○ | |
實施例20 | 均勻 | ○ | ○ | ○ | ○ | ○ | ○ | |
實施例21 | 均勻 | ○ | ○ | ○ | ○ | ○ | ○ | |
實施例22 | 均勻 | ○ | ○ | ○ | ○ | ○ | ○ | |
實施例23 | 均勻 | ◎ | ○ | ○ | ◎ | ○ | ○ | |
實施例24 | 均勻 | ◎ | ○ | ○ | ◎ | ○ | ○ | |
實施例25 | 均勻 | ○ | ○ | ○ | ○ | ○ | ○ | |
實施例26 | 均勻 | ◎ | ○ | ○ | ◎ | ○ | ○ |
[表5]
表5中的注釋如以下所示。
(1)由於清洗劑組成物用原液不均勻,因此不對清洗劑組成物X、清洗劑組成物Y進行評價。
(2)由於在銅氧化膜去除性的評價中殘存有銅氧化膜,因此不對銅再氧化防止性進行評價。
原液 | 清洗劑組成物X | 清洗劑組成物Y | ||||||
外觀 | 清洗性 | 銅氧化膜 去除性 | 銅再氧化 防止性 | 清洗性 | 銅氧化膜 去除性 | 銅再氧化 防止性 | ||
比較例1 | 均勻 | × | ○ | ○ | × | ○ | ○ | |
比較例2 | 均勻 | × | ○ | ○ | × | ○ | ○ | |
比較例3 | 均勻 | × | ○ | ○ | × | ○ | ○ | |
比較例4 | 均勻 | × | ○ | ○ | × | ○ | ○ | |
比較例5 | 均勻 | × | × | - ( 2 ) | × | × | - ( 2 ) | |
比較例6 | 均勻 | △ | × | - ( 2 ) | △ | × | - ( 2 ) | |
比較例7 | 均勻 | × | × | - ( 2 ) | × | × | - ( 2 ) | |
比較例8 | 均勻 | × | ○ | × | × | ○ | × | |
比較例9 | 均勻 | △ | × | - ( 2 ) | △ | × | - ( 2 ) | |
比較例10 | 不均勻 | - ( 1 ) | - ( 1 ) | - ( 1 ) | - ( 1 ) | - ( 1 ) | - ( 1 ) | |
比較例11 | 均勻 | ○ | × | - ( 2 ) | ○ | × | - ( 2 ) | |
比較例12 | 不均勻 | - ( 1 ) | - ( 1 ) | - ( 1 ) | - ( 1 ) | - ( 1 ) | - ( 1 ) | |
比較例13 | 均勻 | △ | ○ | ○ | △ | ○ | ○ | |
比較例14 | 均勻 | × | ○ | ○ | × | ○ | ○ | |
比較例15 | 均勻 | × | ○ | ○ | × | ○ | ○ | |
比較例16 | 均勻 | × | ○ | ○ | × | ○ | ○ | |
比較例17 | 不均勻 | × | ○ | ○ | × | ○ | ○ | |
比較例18 | 不均勻 | × | ○ | ○ | × | ○ | ○ |
<外觀的評價>
將表1、表2的清洗劑組成物用原液放入至50 mL的玻璃容器中,目視確認25℃下的均勻性。表4、表5中,所謂均勻,是指外觀透明且清洗劑組成物用原液為完全相溶狀態;所謂不均勻,是指外觀白濁或分離成水層與油層兩層且清洗劑組成物用原液發生相分離。
<清洗性的評價>
(清洗性試驗的試驗片的製作)
使用金屬遮罩將市售的無鉛無鹵素焊膏(商品名「環保焊膏(ECO SOLDER PASTE)M705-S70G-HF Type4」、千住金屬工業(股)製造)印刷於玻璃環氧覆銅積層板(50 mm×50 mm×厚度1.0 mm)的銅圖案上,並按照以下的輪廓進行回流,藉此製作附著有助焊劑的試驗基板。
(試驗基板的回流輪廓)
環境:空氣
升溫速度:1℃/秒
峰值溫度:240℃、10秒
(清洗性試驗)
使用所述試驗基板,於以下的清洗及水漂洗的條件下,利用氣中噴淋法進行清洗性試驗。使試驗基板與液溫為60℃的實施例1~實施例26及比較例1~比較例18中所獲得的清洗劑組成物X、清洗劑組成物Y接觸來進行30秒或1分鐘清洗。繼而,使試驗基板與液溫為25℃的漂洗水接觸來進行1分鐘預漂洗。進而,利用離子交換水的流水進行1分鐘最終漂洗。其後,對試驗基板吹氣1分鐘,將水分去除來進行乾燥。基於以下的判定基準來目視判定乾燥後的試驗基板表面,並對清洗性進行評價。
◎:於清洗時間為30秒的情況與清洗時間為1分鐘的情況兩情況下,可良好地去除助焊劑(助焊劑殘渣的表面積為0%)。
○:於清洗時間為30秒的情況下,殘存有助焊劑,但於清洗時間為1分鐘的情況下,可良好地去除助焊劑(助焊劑殘渣的表面積為0%)。
△:於清洗時間為1分鐘的情況下,稍微殘存有助焊劑(助焊劑殘渣的表面積超過0%且為10%以下)。
×:於清洗時間為1分鐘的情況下,相當地殘存有助焊劑(助焊劑殘渣的表面積超過10%)。
(利用氣中噴淋法進行的清洗及水漂洗的條件)
流量:2.3 L/分鐘
壓力:0.1 MPa
噴射噴嘴與試驗基板的距離:50 mm
<銅氧化膜去除性的評價>
(銅氧化膜去除性評價用的試驗基板的製作)
將磷脫氧銅板(C1220P、50 mm×50 mm×厚度0.3 mm)於170℃的循環風乾燥機內加熱10分鐘,藉此製作形成有銅氧化膜的試驗基板。
(銅氧化膜去除性試驗)
使用所述試驗基板,藉由浸漬攪拌來進行銅氧化膜去除試驗。使銅氧化膜去除性評價用的試驗基板與液溫為60℃的實施例1~實施例26及比較例1~比較例18中所獲得的清洗劑組成物X、清洗劑組成物Y接觸10分鐘來進行清洗。繼而,使試驗基板與液溫為25℃的離子交換水接觸10分鐘來進行預漂洗。進而,利用離子交換水的流水進行1分鐘最終漂洗。其後,對試驗基板吹氣1分鐘,將水分去除來進行乾燥。基於以下的判定基準來目視判定乾燥後的試驗基板表面,並對銅氧化膜去除性進行評價。
○:可去除銅氧化膜。
×:殘存有銅氧化膜。
<銅再氧化防止性的評價>
將銅氧化膜去除性試驗後的去除了銅氧化膜的試驗基板於23℃的恆溫室內保管14天。基於以下的判定基準來目視判定保管後的試驗基板表面,並對銅再氧化防止性進行評價。
○:銅氧化膜去除後,於23℃的恆溫室內保管14天時,未產生銅氧化膜。
×:銅氧化膜去除後,於23℃的恆溫室內保管14天時,產生了銅氧化膜。
無
無
Claims (4)
- 一種清洗劑組成物用原液,包含以下成分: 作為20℃下於水中的溶解度為10質量%以下的二醇醚(A1)及/或苄醇(A2)的非鹵素系有機溶劑(A); 3-胺基-4-辛醇(B);以及 視需要的水(C), 各成分的含有比率是(A)成分為50質量%~99.9質量%、(B)成分為0.1質量%~45質量%、(C)成分為0質量%~20質量%,且所述清洗劑組成物用原液中, 相對於所述清洗劑組成物用原液100質量份混合100質量份~1500質量份的水而成的清洗劑組成物於1℃~90℃下成為白濁狀態。
- 如請求項1所述的清洗劑組成物用原液,其中,(A1)成分為選自由二丙二醇單正丙基醚、丙二醇單正丁基醚、二丙二醇單正丁基醚、三丙二醇單正丁基醚、乙二醇單正己基醚、二乙二醇單正己基醚、乙二醇單2-乙基己基醚、二乙二醇單2-乙基己基醚、乙二醇單苯基醚、二乙二醇單苯基醚、丙二醇單苯基醚、乙二醇單苄基醚、二乙二醇丁基甲基醚及二乙二醇二正丁基醚所組成的群組中的至少一種。
- 一種清洗劑組成物,包含如請求項1或請求項2所述的清洗劑組成物用原液及水, 包含相對於所述清洗劑組成物用原液100質量份而為100質量份~1500質量份的水。
- 如請求項3所述的清洗劑組成物,用於助焊劑殘渣去除。
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