TW202344567A - 聚醯胺酸、聚醯亞胺、非熱塑性聚醯亞胺膜、多層聚醯亞胺膜及金屬貼合積層板 - Google Patents
聚醯胺酸、聚醯亞胺、非熱塑性聚醯亞胺膜、多層聚醯亞胺膜及金屬貼合積層板 Download PDFInfo
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- TW202344567A TW202344567A TW112105328A TW112105328A TW202344567A TW 202344567 A TW202344567 A TW 202344567A TW 112105328 A TW112105328 A TW 112105328A TW 112105328 A TW112105328 A TW 112105328A TW 202344567 A TW202344567 A TW 202344567A
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- polyimide film
- residue
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- thermoplastic polyimide
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- 229920006259 thermoplastic polyimide Polymers 0.000 title claims abstract description 105
- 239000004952 Polyamide Substances 0.000 title claims abstract description 86
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- -1 imide compound Chemical class 0.000 claims description 10
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- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical group C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 claims description 3
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
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| JP2022-021710 | 2022-02-16 | ||
| JP2022021710 | 2022-02-16 |
Publications (1)
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| TW202344567A true TW202344567A (zh) | 2023-11-16 |
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| JP (1) | JPWO2023157789A1 (https=) |
| TW (1) | TW202344567A (https=) |
| WO (1) | WO2023157789A1 (https=) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2039715A4 (en) * | 2006-07-06 | 2010-07-21 | Toray Industries | THERMOPLASTIC POLYIMIDE AND LAMINATED POLYIMIDE FOIL AND METAL FILM-COATED POLYIMIDE FOIL USING THE THERMOPLASTIC POLYIMIDE |
| JP5733072B2 (ja) * | 2011-07-13 | 2015-06-10 | 宇部興産株式会社 | フレキシブルデバイス基板用ポリイミド前駆体樹脂組成物、フレキシブルデバイスの製造方法、及びフレキシブルデバイス |
| JP6515180B2 (ja) * | 2015-03-31 | 2019-05-15 | 株式会社カネカ | 多層接着フィルム及びフレキシブル金属張積層板 |
| JP6767759B2 (ja) * | 2016-03-17 | 2020-10-14 | 日鉄ケミカル＆マテリアル株式会社 | ポリイミド、樹脂フィルム及び金属張積層板 |
| CN109503836A (zh) * | 2018-09-28 | 2019-03-22 | 广东圣帕新材料股份有限公司 | 聚酰胺酸树脂的制备方法及双面柔性覆铜板的制备方法 |
| WO2022085619A1 (ja) * | 2020-10-22 | 2022-04-28 | 株式会社カネカ | 非熱可塑性ポリイミドフィルム、複層ポリイミドフィルム、及び金属張積層板 |
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2023
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- 2023-02-13 JP JP2024501357A patent/JPWO2023157789A1/ja active Pending
- 2023-02-15 TW TW112105328A patent/TW202344567A/zh unknown
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| WO2023157789A1 (ja) | 2023-08-24 |
| JPWO2023157789A1 (https=) | 2023-08-24 |
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