JPWO2023157789A1 - - Google Patents
Info
- Publication number
- JPWO2023157789A1 JPWO2023157789A1 JP2024501357A JP2024501357A JPWO2023157789A1 JP WO2023157789 A1 JPWO2023157789 A1 JP WO2023157789A1 JP 2024501357 A JP2024501357 A JP 2024501357A JP 2024501357 A JP2024501357 A JP 2024501357A JP WO2023157789 A1 JPWO2023157789 A1 JP WO2023157789A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022021710 | 2022-02-16 | ||
| PCT/JP2023/004719 WO2023157789A1 (ja) | 2022-02-16 | 2023-02-13 | ポリアミド酸、ポリイミド、非熱可塑性ポリイミドフィルム、複層ポリイミドフィルム及び金属張積層板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023157789A1 true JPWO2023157789A1 (https=) | 2023-08-24 |
| JPWO2023157789A5 JPWO2023157789A5 (https=) | 2024-10-22 |
Family
ID=87578222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024501357A Pending JPWO2023157789A1 (https=) | 2022-02-16 | 2023-02-13 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2023157789A1 (https=) |
| TW (1) | TW202344567A (https=) |
| WO (1) | WO2023157789A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2039715A4 (en) * | 2006-07-06 | 2010-07-21 | Toray Industries | THERMOPLASTIC POLYIMIDE AND LAMINATED POLYIMIDE FOIL AND METAL FILM-COATED POLYIMIDE FOIL USING THE THERMOPLASTIC POLYIMIDE |
| JP5733072B2 (ja) * | 2011-07-13 | 2015-06-10 | 宇部興産株式会社 | フレキシブルデバイス基板用ポリイミド前駆体樹脂組成物、フレキシブルデバイスの製造方法、及びフレキシブルデバイス |
| JP6515180B2 (ja) * | 2015-03-31 | 2019-05-15 | 株式会社カネカ | 多層接着フィルム及びフレキシブル金属張積層板 |
| JP6767759B2 (ja) * | 2016-03-17 | 2020-10-14 | 日鉄ケミカル＆マテリアル株式会社 | ポリイミド、樹脂フィルム及び金属張積層板 |
| CN109503836A (zh) * | 2018-09-28 | 2019-03-22 | 广东圣帕新材料股份有限公司 | 聚酰胺酸树脂的制备方法及双面柔性覆铜板的制备方法 |
| WO2022085619A1 (ja) * | 2020-10-22 | 2022-04-28 | 株式会社カネカ | 非熱可塑性ポリイミドフィルム、複層ポリイミドフィルム、及び金属張積層板 |
-
2023
- 2023-02-13 WO PCT/JP2023/004719 patent/WO2023157789A1/ja not_active Ceased
- 2023-02-13 JP JP2024501357A patent/JPWO2023157789A1/ja active Pending
- 2023-02-15 TW TW112105328A patent/TW202344567A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023157789A1 (ja) | 2023-08-24 |
| TW202344567A (zh) | 2023-11-16 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240514 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20251224 |