TW202343593A - Resin sealing device and resin sealing method characterized by realizing the quality improvement of a molded product sealed by resin - Google Patents

Abstract

To realize the quality improvement of a molded product sealed by resin. The resin sealing device (1) includes a resin molding unit that uses compression molding to perform resin sealing on an electronic component (P) of a workpiece (W). The resin molding unit (20) and the resin molding unit (30) include: a resin sealing mold (21) consisting of an upper mold (23) and a lower mold (22); and a cleaner part (26) including a dust collecting port (26D). The dust collecting port (26D) is provided on a delivering route for delivering the workpiece to a loader gripper (61) in the resin sealing mold. When the loader gripper (61) moves on the delivering route to supply the workpiece (W) to the resin sealing mold (21) and when the loader gripper (61) moves on the delivering route to take the molded workpiece (W) out of the resin sealing mold (21), the cleaner part (26) performs a cleaning action on at least one of the loader gripper (61) moving on the delivering route and the workpiece (W).

Description

Resin sealing device and resin sealing method

The invention relates to a resin sealing device and a resin sealing method.

A resin sealing device for resin sealing an electronic component mounted on a base material is known. In such a resin-sealed device, contamination caused by particles (dust such as resin powder or foreign matter) may occur within the device, which may affect the reliability of a molded product in which an electronic component is resin-sealed. In order to prevent such contamination caused by particles, for example, Patent Document 1 discloses a resin molding device that includes: a pressing part including a molding mold that clamps a workpiece and molding resin for resin sealing; and a cleaning device, Clean the back side of the workpiece conveyed to the pressing section. [Prior art documents] [Patent Document]

[Patent Document 1] Japanese Patent Application Laid-Open No. 2021-178411

[Problem to be solved by the invention] Particles may adhere not only to the back of the workpiece, but also to the surface of the workpiece or the loader gripper that transports the workpiece. In addition to being able to adhere to the workpiece before resin sealing, the particles may also be attached to the resin-sealed workpiece in the state of a molded product.

The present invention was made in view of such circumstances, and an object of the present invention is to provide a resin sealing device and a resin sealing method that can suppress the adhesion of particles and improve the quality of a resin-sealed molded product. [Technical means to solve problems]

A resin sealing device according to one aspect of the present invention resin seals an electronic component of a workpiece including a base material and an electronic component, and includes a resin molding unit that performs resin sealing of the electronic component of the workpiece by compression molding. The resin molding The unit includes: a resin sealing mold, including an upper mold and a lower mold; and a cleaner section, including a dust collection port provided on the conveyance path of a loader gripper that conveys workpieces to the resin sealing mold, and the cleaner section is on the loader When the gripper moves on the conveyance path to supply the workpiece to the resin sealing mold, and when the loader gripper moves on the conveyance path to take out the molded workpiece from the resin sealing mold, the gripper moves on the conveyance path. At least one of the loader gripper and the workpiece performs a cleaning action.

According to the above aspect, when the loader gripper moves on the conveyance path to supply the workpiece to the resin-sealed mold, and when the loader gripper moves on the conveyance path to take out the workpiece from the resin-sealed mold, the loader is loaded At least one of the machine gripper and the workpiece performs a cleaning action. Therefore, it is possible to effectively suppress particles from adhering to workpieces or loader grippers, thereby improving the quality of molded products.

Another form of the resin sealing method of the present invention is a resin sealing method for resin sealing an electronic component including a base material and a workpiece of the electronic component, which includes: supplying the workpiece to a resin sealing mold through a loader gripper; and utilizing resin sealing. The mold performs resin sealing on the electronic component; and the resin-sealed molded workpiece is taken out from the resin-sealed mold through a loader gripper. The resin sealing method further includes: supplying the workpiece to the resin-sealed mold through the loader gripper. When moving on the conveyance path, and when the loader gripper moves on the conveyance path to take out the molded workpiece from the resin sealing mold, a cleaning operation is performed on the loader gripper or the workpiece moving on the conveyance path.

According to the above aspect, when the loader gripper moves on the conveyance path to supply the workpiece to the resin-sealed mold, and when the loader gripper moves on the conveyance path to take out the workpiece from the resin-sealed mold, the loader is loaded At least one of the machine gripper and the workpiece performs a cleaning action. Therefore, it is possible to effectively suppress particles from adhering to workpieces or loader grippers, thereby improving the quality of molded products. [Effects of the invention]

According to the present invention, adhesion of particles can be suppressed, thereby improving the quality of resin-sealed molded products.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. The drawings of each embodiment are illustrative, and the size or shape of each part is schematic, and the technical scope of the present invention is not to be construed as limiting the embodiment.

[First Embodiment] ＜Resin sealing device＞ The structure of the resin sealing device 1 according to the embodiment of the present invention will be described with reference to FIGS. 1 to 4 . FIG. 1 is a plan view of the resin sealing device according to this embodiment. Moreover, FIG. 2 is a partial enlarged view of the resin sealing device, FIG. 3 is a cross-sectional view of the resin sealing mold, and FIG. 4 is a cross-sectional view of the cleaner part. In addition, in each of the drawings of FIGS. 1 to 4 , in order to clarify the relationship between the drawings and to help understand the positional relationship of each member, the directions of front, rear, left, right, and up and down are marked for convenience.

The resin sealing device 1 is a manufacturing device that installs resin on a workpiece W to manufacture a molded product M. The workpiece W includes a substrate S and an electronic component P. The molded product M can be manufactured by molding the resin R on the workpiece W and sealing the electronic component P of the workpiece W with the resin. Here, the workpiece W has a surface on which the electronic component P is mounted (hereinafter referred to as the "surface of the workpiece W") and a surface opposite to the surface (hereinafter referred to as the "back surface of the workpiece W"). The back surface of the workpiece W is a surface on which the electronic component P is not mounted. Furthermore, in the following description, the vertical relationship between the front surface and the back surface of the workpiece W may be appropriately reversed depending on the structure of the resin sealing mold. Hereinafter, for convenience of explanation, the resin-sealed workpiece W may be referred to as the molded product M. The base material S is, for example, an interposer substrate, a lead frame, a carrier plate with an adhesive sheet, or a semiconductor substrate. The electronic component P is, for example, a semiconductor component such as an integrated circuit (IC) chip, but is not limited thereto. It may also be various active components or passive components, microelectromechanical system (Micro Electro Mechanical System, MEMS) equipment, etc. The resin R is, for example, a granular thermosetting resin. The form of the resin R is not limited to the above, and may be liquid or powdery. In this embodiment, as an example, the resin R is molded on the workpiece W and the functional member H. The functional member H is, for example, a plate-shaped member. The functional member H is provided so as to be exposed to the side opposite to the exposed side of the base material S of the molded article M. The functional member H functions, for example, as a heat dissipation member that dissipates heat generated by the electronic component P or a shielding member that shields electromagnetic waves. Furthermore, the functional member H may be a sheet resin.

The resin sealing device 1 of this embodiment is a compression (compression molding) type resin sealing device. As shown in FIG. 1 , the resin sealing device 1 includes a workpiece supply unit 10 , a resin molding unit 20 , a resin molding unit 30 , a resin supply unit 40 , a functional component supply unit 50 , a first loader 60 , a second loader 70 , and Molded product recovery unit 90. The first loader 60 is a loader that transports the workpiece W, and is configured to be movable along the first guide portion 60R. Furthermore, the second loader 70 is a loader that transports the resin R and the functional member H, and is configured to be movable along the second guide portion 70R.

The plan layout of the resin sealing device 1 is not particularly limited. In the example shown in FIG. 1 , the workpiece supply unit 10 , the resin molding unit 20 , the resin supply unit 40 , the resin molding unit 30 , and the molded product recovery unit 90 are shown in FIG. 1 are arranged sequentially from left to right along the first guide portion 60R. Furthermore, based on the first guide part 60R, the resin supply part 41 is arranged on the rear side, and the functional member supply unit 50 is arranged on the front side. The functional member supply unit 50 and the resin supply unit 40 are arranged in sequence along the second guide portion 70R from the front to the rear in FIG. 1 . Furthermore, based on the second guide portion 70R, the workpiece supply unit 10 and the resin molding unit 20 are arranged on the left side, and the resin molding unit 30 and the molded product recovery unit 90 are arranged on the right side.

The workpiece supply unit 10 supplies the workpiece W to the first loader gripper 61 of the first loader 60 . The workpiece supply unit 10 includes a workpiece storage unit 11 , a workpiece transfer unit 13 , a workpiece preheating unit 15 , and a workpiece supply control panel 19 . Furthermore, for example, the workpiece supply control panel 19 may have a display unit and an input unit that display the molded product recovery unit 90 , the resin supply unit 40 , the functional component supply unit 50 , the first loader 60 and the like described below. Each control parameter of the second loader 70 is input by the input unit.

The workpiece storage unit 11 stores a plurality of workpieces W and sequentially sends out the workpieces W. For example, the workpiece storage unit 11 includes a plurality of workpiece warehouses and a workpiece elevator. A plurality of workpieces W are stored in a workpiece magazine provided in the workpiece storage unit 11 so as to overlap in the vertical direction. The workpiece elevator adjusts the position of the workpiece magazine in order to send the workpiece W to the workpiece transfer unit 13 .

The workpiece transfer unit 13 delivers the workpiece W received from the workpiece storage unit 11 to the workpiece preheating unit 15 . For example, the workpiece transfer unit 13 includes a workpiece index unit that receives and aligns the workpiece W sent out from the workpiece storage unit 11 , and a workpiece pick-and-place unit that delivers the workpiece W with the workpiece index unit aligned to the workpiece preheating unit 15 .

The workpiece preheating unit 15 preheats the workpiece W received from the workpiece transfer unit 13 and delivers it to the first loader gripper 61 of the first loader 60 . By preheating the workpiece W before transporting it to the resin molding units 20 and 30 , deformation of the workpiece W caused by a sudden temperature change inside the resin sealing mold 21 and the resin sealing mold 31 can be suppressed. For example, the workpiece preheating section 15 includes a preheating rail that heats the workpiece W from the end. Alternatively, the workpiece preheating unit 15 may include a hot plate that heats the entire surface of the workpiece W. In addition, the workpiece preheating unit 15 may not be provided and the workpiece W may not be preheated. In this case, after the workpiece W is transferred to the resin molding unit 20 or 30 , the time before starting to transfer the resin R and the functional member H into the resin molding unit 20 or 30 or starting to mold closing may be determined. Take control.

The workpiece supply control panel 19 controls the operation of the workpiece supply unit 10 . As shown in FIG. 1 , in plan view, the workpiece supply control panel 19 is arranged in front of the workpiece supply unit 10 . For example, the workpiece supply control panel 19 includes a display unit that displays control parameters of the workpiece supply unit 10 and an input unit that inputs the control parameters of the workpiece supply unit 10 .

In addition, the workpiece supply unit 10 may further include a volume measurement unit that measures the volume of the workpiece W, an appearance inspection unit that inspects the appearance of the workpiece W, or the like.

The molded product collection unit 90 collects the molded product M from the first loader gripper 61 of the first loader 60 . The molded product collection unit 90 includes a molded product receiving part 91 , a molded product conveying part 93 , and a molded product storage part 95 . In the example shown in FIG. 1 , the molded product recovery unit 90 is arranged on the opposite side of the workpiece supply unit 10 with respect to the resin molding unit 20 and the resin molding unit 30 in the left-right direction. As a modified example, the molded product recovery unit 90 may be disposed on the same side of the workpiece supply unit 10 as the resin molding unit 20 and the resin molding unit 30 in the left-right direction.

The molded product receiving unit 91 delivers the molded product M received from the first loader gripper 61 of the first loader 60 to the molded product transfer unit 93 . For example, the molded product receiving portion 91 includes a cooling bracket that cools the molded product M. Furthermore, the cooling bracket may not be provided and the workpiece W may not be cooled.

The molded product transfer unit 93 delivers the molded product M received from the molded product receiving unit 91 to the molded product storage unit 95 . For example, the molded product transfer unit 93 includes a molded product index unit that receives the molded product M sent from the molded product receiving unit 91 and aligns it, and a molded product index unit that delivers the molded product M with the aligned molded product index portion to the molded product storage unit 95 . Molded product pick-and-place department.

The molded product storage unit 95 receives the molded product M and stores it therein. For example, the molded product storage unit 95 includes a plurality of molded product warehouses and a molded product elevator. A plurality of molded products M are stored in a molded product magazine provided in the molded product storage unit 95 so as to overlap in the vertical direction. The molded product elevator adjusts the position of the molded product warehouse in order to receive the molded product M from the molded product transfer unit 93 .

In addition, the molded product recovery unit 90 may further include a volume measurement unit that measures the volume of the molded product M, an appearance inspection unit that inspects the appearance of the molded product M, or the like.

The resin molding unit 20 molds the resin R onto the workpiece W and the functional component H. The resin molding unit 20 includes a resin sealing mold 21, a cleaner unit 26, a film processor 27, and a resin molding control panel 29.

As shown in FIG. 3 , the resin sealing mold 21 includes a pair of openable and closable lower molds 22 and an upper mold 23 in which resin R is filled in an internal mold cavity 25 and molded. In the example shown in FIG. 3 , the resin sealing mold 21 is a so-called compression molding mold with a movable lower cavity structure. Specifically, the surface of the upper mold 23 facing the lower mold 22 is flat, and a mold cavity 25 is formed on the surface of the lower mold 22 facing the upper mold 23 . The cavity 25 is a recess (an example of a cavity recess) opening toward the upper mold 23 .

The lower mold 22 includes a lower plate 22a, a cavity wedge 22b, a positioning member 22c, and an energizing member 22d. The cavity wedge 22b is fixed and assembled to the upper surface of the lower plate 22a (surface on the upper mold 23 side). The positioning member 22c is configured in a frame shape to surround the cavity wedge 22b. The positioning piece 22c is assembled so as to be able to move up and down with respect to the lower plate 22a via the urging member 22d. The cavity wedge 22b constitutes the bottom surface of the cavity 25, and the positioning member 22c constitutes the side surface of the cavity 25. The lower mold 22 is provided with a suction hole 22e, a suction hole 22f that penetrates the positioning member 22c, and a suction hole 22g that penetrates the lower plate 22a and the cavity wedge 22b. The suction hole 22e is opened on the upper surface of the positioning member 22c. The suction hole 22f is opened on the inner side of the positioning member 22c facing the cavity wedge 22b. A sealing member (not shown) is inserted under the suction hole 22f. The suction hole 22g opens on the upper surface of the cavity wedge 22b, that is, on the bottom surface of the cavity 25. The suction holes 22e, 22f, and 22g are suction holes for sucking the film F provided on the lower mold 22.

The upper mold 23 includes an upper plate 23a and a cavity plate 23b. The cavity plate 23b is fixed and assembled to the lower surface (the surface on the lower mold 22 side) of the upper plate 23a. The upper mold 23 is provided with a suction hole 23c that penetrates the upper plate 23a and the cavity plate 23b. The suction hole 23c is opened in the lower surface of the cavity plate 23b. The suction hole 23c is a suction hole for sucking the workpiece W provided on the upper mold 23.

The cleaner part 26 cleans at least one of the workpiece W and the first loader gripper 61 . In addition, the cleaner part 26 is demonstrated in detail below.

The film processor 27 supplies the film F to the resin sealing mold 21 . The film F is a release film that prevents the resin R from entering the gap in the lower mold 22 forming the recessed portion of the mold cavity 25 and allows the molded product M to be easily peeled off from the lower mold 22 . The film processor 27 processes a roll-shaped film, for example, and includes a roll-out section for supplying unused film F and a wind-up section for collecting used film F. As shown in FIG. 1 , the unwinding portion and the winding portion of the membrane processor 27 are arranged in the left-right direction of the resin sealing mold 21 . In addition, as the material of the film F, a polymer material excellent in heat resistance, ease of peeling, flexibility, and stretchability can be used. Examples include polytetrafluoroethylene (PTFE) and polytetrafluoroethylene-ethylene copolymer. (ethylene-tetrafluoroethylene copolymer, ETFE), tetrafluoroethylene-hexafluoropropylene copolymer (fluorinated ethylene propylene, FEP), polyethylene terephthalate (PET), polypropylene (PP), polyethylene Vinylidene fluoride (polyvinylidene chloride, PVDC), etc. The thickness of the film F can be appropriately selected according to the physical properties of the material. As an example, it is about 50 μm. In addition, the shape of the film F is not limited to a roll shape and may be a strip shape.

The resin molding control panel 29 controls the operation of the resin molding unit 20 . As shown in FIG. 1 , in plan view, the resin molding control panel 29 is arranged in front of the resin molding unit 20 . For example, the resin molding control panel 29 includes a display unit that displays control parameters of the resin molding unit 20 and an input unit that inputs the control parameters of the resin molding unit 20 .

The resin molding unit 30 includes a resin sealing mold 31 , a cleaner unit 26 , a film processor 37 , and a resin molding control panel 39 . In addition, in the following description, the details of the resin sealing mold 31, the cleaner unit 36, the film processor 37, and the resin molding control panel 39 are omitted, and the same structures as those described for the resin molding unit 20 can be applied.

In addition, the resin molding control panel 29 and the resin molding control panel 39 may integrate at least part of their functions into the workpiece supply control panel 19 . For example, the control parameters of the resin molding unit 20 and the resin molding unit 30 can be displayed on the display part of the workpiece supply control panel 19 , and the control parameters of the resin molding unit 20 and the resin molding unit 30 can be input to the input part of the workpiece supply control panel 19 . When all the functions of the control panels of each unit are integrated into the workpiece supply control panel 19, the resin molding control panel 29 and the resin molding control panel 39 may be omitted.

The functional component supply unit 50 includes a functional component storage part 51 and a functional component transfer part 53 .

The functional component storage unit 51 stores a plurality of functional components H and sequentially delivers the functional components H. For example, the functional component storage unit 51 includes a plurality of functional component libraries and a functional component elevator. A plurality of functional components H are stored in the functional component library provided in the functional component storage portion 51 so as to overlap in the vertical direction. The functional component elevator adjusts the position of the functional component library in order to send the functional component H to the functional component transport unit 53 .

The functional component transfer unit 53 delivers the functional component H received from the functional component storage unit 51 to the holding tool 78 . For example, the functional component transfer unit 53 receives the functional component H sent from the functional component storage unit 51 , aligns it, and delivers it to the holding tool 78 . At this time, the functional member H can be picked up by the clamping function provided in the holding tool 78 .

In addition, the functional component supply unit 50 further includes a volume measurement unit that measures the volume of the functional component H, an appearance inspection unit that inspects the appearance of the functional component H, a functional component preheating unit that preheats the functional component H, and the like.

The resin supply unit 40 supplies the granular resin R onto the functional member H. The resin supply unit 40 includes a resin supply part 41 and a resin heater 80 .

The resin supply unit 41 supplies the resin R onto the functional component H held by the holding tool 78 . The resin supply unit 41 includes a hopper (not shown) and a feeder (not shown). In addition, when the resin is in liquid form, the resin supply unit may include a syringe for storing the resin, a piston for extruding the resin, and a pinch valve for opening and closing the front end of the syringe.

The resin heater 80 heats the functional member H and the resin R supplied to the functional member H. As the heat source of the resin heater 80, for example, a known heating mechanism such as an electric wire heater or an infrared heater can be used. In addition, the resin heater 80 may not be included.

In the resin supply unit 40 , it is preferable that a resin protective cover 44 described below is arranged inside the holding tool 78 . The resin protective cover 44 is configured in a frame shape along the outer shape of the functional member H, and can be used as a frame for defining an area where the resin R is dispersed. For example, the resin shield 44 is attached to the holding tool 78 before the resin R is supplied, and is detached from the holding tool 78 after the resin R is heated.

In addition, the resin supply unit 40 may further include a weight measurement unit that measures the weight of the resin R, an excitation unit that disperses the resin R by vibration, an inspection unit that inspects the degree of dispersion of the resin R, and the like.

The first loader 60 transports the workpiece W from the workpiece supply unit 10 to the resin molding unit 20 and the resin molding unit 30 . The first loader 60 is configured to be movable along the first guide portion 60R. The first guide portion 60R extends in the left-right direction on the workpiece supply unit 10 , the resin molding unit 20 , the resin molding unit 30 , the resin supply unit 40 and the molded product recovery unit 90 . As shown in FIG. 1 , in plan view, the first guide portion 60R is provided, for example, behind the resin sealing mold 21 and the resin sealing mold 31 and in front of the resin supply portion 41 . In the structural example shown in FIG. 1 , the first loader 60 transports the molded product M from the resin molding unit 20 and the resin molding unit 30 to the molded product collection unit 90 .

As shown in FIG. 2 , the first loader 60 includes a first loader grip 61 , a first base 62 , and a first guide rod 63 .

The first loader gripper 61 is configured to be able to move forward and backward from the rear with respect to the resin sealing mold 21 . In other words, the first loader grip 61 has a conveyance path for the workpiece W or the molded product M (an example of the workpiece) on the rear side of the resin sealing mold 21 . The first loader gripper 61 holds the workpiece W or the molded product M. The first loader gripper 61 includes, for example, an L-shaped opening and closing claw that supports the lower surface of the workpiece W or the molded product M, but is not limited thereto. The first loader gripper 61 can absorb the workpiece W or the molded product M through electrostatic force, or can absorb the workpiece W or the molded product M through suction and exhaust.

As shown in FIG. 2 , the first base 62 is connected to the first guide portion 60R so as to be movable in the left-right direction.

As shown in FIG. 2 , the first guide rod 63 is connected to the first base 62 to support the first loader handle 61 . The first guide rod 63 is configured to be telescopic in the front-rear direction and moves the first loader gripper 61 in the front-rear direction.

As an example, after the first loader gripper 61 receives the workpiece W by the workpiece conveying unit 13, it is conveyed to the right via the first base 62 and moved to a position facing the resin sealing mold 21 in the front-rear direction. Next, the first loader gripper 61 directly enters the resin sealing mold 21 from the rear by extending the first guide rod 63 while holding the workpiece W. That is, the first loader gripper 61 carries the workpiece W into the resin sealing mold 21 . After delivering the workpiece W to the upper mold 23 of the resin sealing mold 21 , the first loader gripper 61 moves toward the rear of the resin sealing mold 21 by shrinking the first guide rod 63 . After the molded product M is molded and the resin sealing mold 21 is opened, the first loader gripper 61 carries out the molded product M from the resin sealing mold 21 in the same operation as when the workpiece W is loaded. Then, the first loader gripper 61 conveys the molded product M to the right through the first base 62 and delivers the molded product M to the molded product receiving part 91 .

The second loader 70 transports the resin R and the functional component H. The second loader 70 is configured to be movable along the second guide portion 70R. The second guide portion 70R is provided, for example, in the resin supply unit 40 and extends in the front-rear direction. As shown in FIG. 1 , in plan view, the second guide portion 70R intersects the first guide portion 60R, for example.

As shown in FIG. 2 , the second loader 70 includes a second loader grip 71 , a second base 72 , and a second guide rod 73 .

As shown in FIG. 2 , the second base 72 is configured to be movable in the front-rear direction with respect to the second guide portion 70R. However, the second base 72 is not limited to the movement in the front-rear direction and may be configured to be movable in the left-right direction.

As shown in FIG. 2 , the second guide rod 73 is connected to the second base 72 to support the second loader gripper 71 . The second guide rod 73 is configured to be telescopic and rotatable starting from a portion connected to the second base 72 . Thereby, the second guide rod 73 moves the second loader grip 71 in the front-rear or left-right direction, and also rotates the second loader grip 71 around the second base 72 .

As an example, the second loader gripper 71 transports the holding tool 78 to the functional member transfer unit 53 . After the functional component H is received by the functional component transfer unit 53 using the holding tool 78 , the second loader gripper 71 is transported to the rear through the second base 72 , and the functional component H is transported to the functional component via the holding tool 78 Position P2 behind the conveyor 53 . Next, the second loader gripper 71 moves to the position P1 in front of the resin supply part 41 by the rotation of the second guide rod 73 . Then, the second loader gripper 71 moves to the resin supply part 41 by the extension of the second guide rod 73 . At the resin supply part 41, the second loader gripper 71 opens the holding tool 78. A resin protective cover 44 is provided inside the opened holding tool 78 . Then, after the resin R is received on the functional member H and inside the resin protective cover 44 , the functional member H and the resin R are heated, and after heating, the resin protective cover 44 is removed. Thereafter, the second loader gripper 71 picks up the holding tool 78 again and returns to the position P1 by the contraction of the second guide rod 73 . Next, the second loader gripper 71 moves to the right position P3 of the resin sealing mold 21 by the rotation of the second guide rod 73 . Next, the second loader gripper 71 enters the resin sealing mold 21 from the right by the extension of the second guide rod 73 while holding the resin R and the functional member H via the holding tool 78 . That is, the second loader gripper 71 carries the resin R and the functional member H into the resin sealing mold 21 via the holding tool 78 . After delivering the resin R and the functional member H to the resin sealing mold 21 , the second loader gripper 71 moves to the right of the resin sealing mold 21 by contraction of the second guide rod 73 .

As described above, as long as the second loader gripper 71 can move from the resin supply unit 40 to the functional member conveying portion 53 by the telescopic extension of the second guide rod 73, the second guide portion 70R can be extended to the functional member supply unit even if the second guide portion 70R is not extended. 50, a functional component supply unit 50 can also be added.

Regarding the resin sealing mold 31 of the resin molding unit 30 , the first loader 60 and the second loader 70 operate in the same manner as in the case of the resin sealing mold 21 of the resin molding unit 20 . Therefore, description of the operations of the first loader 60 and the second loader 70 on the resin sealing mold 31 is omitted. However, the movement of the second loader 70 with respect to the resin sealing mold 31 is a left-right reverse movement with respect to the movement of the second loader 70 with respect to the resin sealing mold 21 .

Next, the conveyance path when the first loader gripper 61 supplies the workpiece to the resin sealing mold 21 will be described. The first loader gripper 61 receives the workpiece W using the workpiece preheating part 15 . Thereafter, the first loader 60 moves in the right direction along the first guide portion 60R with the first loader gripper 61 holding the workpiece W, and transports the workpiece W to the rear of the resin sealing mold 21 . Thereafter, as shown in FIG. 2 , the first loader gripper 61 and the workpiece W are transported to the resin sealing mold 21 by the expansion and contraction of the first guide rod 63 , and the workpiece W is placed on the resin sealing mold 21 by the first loader gripper 61 Mold 21. After resin sealing is performed in the resin sealing mold 21 , the workpiece W is ejected from the resin sealing mold 21 by the expansion and contraction of the first guide rod 63 while being held by the first loader gripper 61 .

On the other hand, the conveyance path when the first loader gripper 61 takes out the workpiece from the resin sealing mold 21 will be described. As shown in FIG. 2 , the first loader gripper 61 is conveyed to the resin sealing mold 21 by extending and contracting the first guide rod 63 . With the workpiece W held by the first loader gripper 61 , the workpiece W passes through the first guide. The rod 63 expands and contracts to withdraw from the resin sealing mold 21 . Thereafter, the first loader 60 moves in the right direction along the first guide portion 60R with the first loader gripper 61 holding the workpiece W, and transfers the workpiece W to the molded product receiving portion 91 . In addition, the same is true for the resin sealing mold 31 regarding the conveyance path for supplying or taking out the workpiece W described above.

In the example shown in FIGS. 1 and 2 , the conveyance path of the first loader 60 is located on the rear side of the resin sealing mold 21 and the resin sealing mold 31 , and the cleaner unit 26 is arranged on the rear side of the resin sealing mold 21 . The cleaner part 26 may be connected to the rear side of the resin sealing mold 21, or may be provided separately from the resin sealing mold 21. In order to supply the workpiece W to the resin sealing mold 21 , the cleaning operation of the cleaner unit 26 is performed during at least one of the process of entering the resin sealing mold 21 and the process of exiting the first loader gripper 61 . Furthermore, in order to take out the workpiece W from the resin sealing mold 21, the cleaning operation is performed during at least one of the process of entering the resin sealing mold 21 and the process of exiting the first loader gripper 61. As shown in FIG. 3 , the cleaner unit 26 includes a lower cleaner 26 a provided on the lower mold 22 side, and an upper cleaner 26 b provided on the upper mold 23 side.

As shown in Figure 4, the lower cleaner 26a includes a brush 262a and a dust collection port 264a. By including this structure, attachments swept off from the workpiece W or the first loader gripper 61 by the brush 262a can be recovered through the dust collecting port 264a. The dust collecting port 264a includes a plurality of openings 266a that open upward in the lower cleaner 26a, and a brush 262a is provided in a region between the openings 266a. Furthermore, as shown in FIG. 1 , the lower cleaner 26 a has a width larger than the width of at least one of the workpiece W and the first loader grip 61 (the width in the left-right direction in the example shown in FIG. 1 ). Thus, by passing the workpiece W or the first loader grip 61 through the lower cleaner 26 a in the front-rear direction, the entire width of the workpiece W or the first loader grip 61 can be cleaned. In addition, the upper cleaner 26b includes the brush 262b and the dust collection port 264b, similarly to the lower cleaner 26a. The structure of these and the opening 266b can be applied to the structure of the lower cleaner 26a.

As described above, according to the resin sealing device described in this embodiment, the cleaner unit 26 is provided on the conveyance path of the loader gripper that conveys the workpiece to the resin sealing mold, and passes through the first loader gripper 61 When the workpiece W is supplied to the resin sealing mold 21, particles adhering to the workpiece W and the first loader gripper 61 can be sucked out. Furthermore, when the molded product M is taken out from the resin sealing mold 21 using the first loader grip 61 , particles adhering to the lower surface of the molded product M and the first loader grip 61 can be suctioned away. As a result, the quality of molded products can be improved.

＜Resin sealing method＞ Next, the resin sealing method will be described in FIGS. 5 to 14 . FIG. 5 is a flowchart showing an example of a resin sealing method using the resin sealing device of this embodiment. 6 to 10 are diagrams for explaining the resin sealing method according to this embodiment. In the following description, a method of using a resin sealing device in which the lower mold has a cavity is explained. In addition, the resin sealing mold 21 of the resin molding unit 20 is taken as an example for description here, and the description of the resin sealing mold 31 of the resin molding unit 30 which operates in the same manner is omitted.

First, the first loader gripper 61 holds the workpiece W (S10).

Specifically, the workpiece W received from the workpiece transfer part 13 of FIG. 1 is preheated by the workpiece preheating part 15 and held by the first loader gripper 61 of the first loader 60 . The first loader gripper 61 moves to the resin molding unit 20 while holding the workpiece W. Before and after the above steps, the film F is moved to the mold cavity 25 provided on the lower mold 22 side. After moving the film F, the film F is sucked through the suction hole 22g and set in the mold cavity 25.

Next, when the first loader gripper 61 enters the resin sealing mold 21 and the resin sealing mold 31, the first loader gripper 61 and the workpiece W are cleaned (S20).

Specifically, as shown in FIG. 6 , the first loader gripper 61 is cleaned by the cleaner part 26 provided behind the resin sealing mold 21 just before entering the resin sealing mold 21 while holding the workpiece W. The cleaner part 26 includes a lower cleaner 26a provided on the lower mold 22 side and an upper cleaner 26b provided on the upper mold 23 side. The lower cleaner 26a cleans the lower surface of the first loader grip 61, and the upper cleaner 26b cleans the back surface of the workpiece W. After cleaning, the first loader gripper 61 enters the resin sealing mold 21 and transfers the workpiece W to the upper mold 23 .

Next, when the first loader gripper 61 is withdrawn from the resin sealing mold 21 and the resin sealing mold 31, the first loader gripper 61 is cleaned (S30).

Specifically, as shown in FIG. 7 , after the workpiece W is transferred to the upper mold 23 , the first loader gripper 61 is cleaned by the cleaner part 26 in the process of being withdrawn from the resin sealing mold 21 . At this time, the lower cleaner 26a cleans the lower surface of the first loader grip 61. Furthermore, at the same time, the upper surface of the first loader gripper 61 is cleaned by the upper cleaner 26b.

Thereafter, the electronic component P is resin-sealed using the resin sealing mold 21 and the resin sealing mold 31 (S40).

Specifically, as shown in FIG. 8 , the resin sealing mold 21 is clamped, and the resin R is pressurized and heated using the lower mold 22 and the upper mold 23 . After the resin R hardens, the mold is opened.

Next, when the first loader gripper 61 enters the resin sealing mold 21 and the resin sealing mold 31, the first loader gripper 61 is cleaned (S50).

Specifically, after resin sealing, the first loader gripper 61 enters the resin sealing mold 21 again in order to collect the molded product M. At this time, as shown in FIG. 9 , the first loader gripper 61 is cleaned by the cleaner part 26 while entering the resin sealing mold 21 . Specifically, the lower cleaner 26a cleans the lower surface of the first loader grip 61. Furthermore, at the same time, the upper surface of the first loader gripper 61 is cleaned by the upper cleaner 26b. After cleaning, the first loader gripper 61 enters the resin sealing mold 21 to recover the workpiece W.

Next, when the first loader gripper 61 is withdrawn from the resin sealing mold 21 and the resin sealing mold 31, the first loader gripper 61 and the workpiece W are cleaned (S60).

Specifically, as shown in FIG. 10 , after receiving the workpiece W, the first loader gripper 61 is cleaned by the cleaner part 26 while withdrawing from the resin sealing mold 21 . At this time, the lower cleaner 26a cleans the lower surface of the first loader grip 61, and the upper cleaner 26b cleans the back surface of the workpiece W.

As described above, according to the resin sealing method described in this embodiment, the cleaner unit 26 is provided in the first loader gripper that transports the workpiece W to the resin sealing mold 21 . On the conveyance path of the hand 61 , when the workpiece W is supplied to the resin sealing mold 21 via the first loader gripper 61 , particles adhering to the workpiece W and the first loader gripper 61 can be suctioned and removed. Furthermore, when the molded product M is taken out from the resin sealing mold 21 using the first loader grip 61 , particles adhering to the lower surface of the molded product M and the first loader grip 61 can be suctioned away. As a result, the quality of molded products can be improved.

[Second Embodiment] ＜Resin sealing device＞ Next, the structure of the resin sealing mold 121 of the second embodiment will be described with reference to FIGS. 11 to 14 . FIG. 11 is a cross-sectional view schematically showing the structure of the resin sealing mold 121 according to the second embodiment.

In this embodiment, unlike the first embodiment, a mold cavity 125 is provided on the upper mold 122 side. The resin sealing mold 21 is a pair of openable and closable molds formed by filling the inner cavity 125 with resin R. The resin sealing mold 121 includes an upper mold 122 and a lower mold 123 . The surface of the lower mold 123 opposite to the upper mold 122 is flat, and a mold cavity 125 is formed on the surface of the upper mold 122 opposite to the lower mold 123 . That is, the resin sealing mold 121 is a compression molding mold with a so-called upper cavity movable structure. The cavity 125 is a recess opening toward the lower mold 123 and corresponds to an example of the "cavity recess" in the present invention.

The upper mold 122 includes an upper plate 122a, a cavity wedge 122b, a positioning member 122c, and an energizing member 122d. The cavity wedge 122b is fixed and assembled to the lower surface (surface on the lower mold 123 side) of the upper plate 122a. The positioning member 122c is configured in a frame shape to surround the cavity wedge 122b. The positioning piece 122c is assembled so as to be able to move up and down with respect to the upper plate 122a via the urging member 122d. The cavity wedge 122b constitutes the bottom surface of the mold cavity 125, and the positioning member 122c constitutes the side surface of the mold cavity 125. The lower mold 123 is provided with a suction hole 122e, a suction hole 122f that penetrates the positioning member 122c, and a suction hole 122g that penetrates the upper plate 122a and the cavity wedge 122b. The suction hole 122e is opened on the lower surface of the positioning member 122c. The suction hole 122f is opened on the inner side of the positioning member 122c facing the cavity wedge 122b. A sealing member (not shown) is inserted under the suction hole 122f. The suction hole 122g opens on the upper surface of the cavity wedge 122b, that is, on the bottom surface of the cavity 125. The suction holes 122e, 122f, and 122g are suction holes for sucking the film F provided on the upper mold 122.

The lower mold 123 includes a lower plate 123a and a cavity plate 123b. The cavity plate 123b is fixed and assembled to the upper surface of the lower plate 123a (the surface on the upper mold 122 side). The lower mold 123 is provided with a suction hole 123c that penetrates the lower plate 123a and the cavity plate 123b. The suction hole 123c is opened in the lower surface of the cavity plate 123b. The suction hole 123c is a suction hole for sucking the workpiece W provided on the lower mold 123.

By using such a resin sealing mold, compression molding of an upper mold cavity movable structure having the cavity 125 on the upper mold 122 side can be performed. Furthermore, the molding quality can be improved by cleaning the first loader gripper on the conveyance path with the cleaner unit 26 .

＜Resin sealing method＞ Next, a resin sealing method using the resin sealing mold 121 of the second embodiment will be described with reference to FIGS. 11 to 14 . 11 to 14 are diagrams for explaining the resin sealing method according to this embodiment. In the following description, a method of using a resin sealing device in which the upper mold has a cavity is explained. The resin sealing mold 121 of this embodiment has a cavity 125 in the upper mold 122 . Therefore, unlike the first embodiment in which the workpiece W is placed on the upper mold 23 , in this embodiment, the workpiece W is placed on the lower mold 123 .

As shown in FIG. 11 , the first loader gripper 61 enters the resin sealing mold 21 while holding the workpiece W, and passes through the conveyance path provided for the first loader gripper 61 to convey the workpiece W to the resin sealing mold 21 . The cleaner part 26 on the top performs cleaning.

As shown in FIG. 12 , after transferring the workpiece W, the first loader gripper 61 is cleaned by the cleaner part 26 while being withdrawn from the resin sealing mold 121 .

After the resin sealing, the first loader gripper 61 enters the resin sealing mold 121 again in order to collect the molded product M. At this time, as shown in FIG. 13 , the first loader gripper 61 is cleaned by the cleaner part 26 while entering the resin sealing mold 121 .

As shown in FIG. 14 , after transferring the workpiece W, the first loader gripper 61 is cleaned by the cleaner part 26 while being withdrawn from the resin sealing mold 121 .

[Modification] Modifications different from the above-described embodiment will be described.

Either the resin molding unit 20 or the resin molding unit 30 may be omitted. That is, a structure may be adopted in which only one resin molding unit is provided and one resin supply unit supplies resin to one resin molding unit. Furthermore, three or more resin molding units may be provided. In this case, two or more resin supply units may be provided. For example, two resin molding units and a resin supply unit provided between the two resin molding units and supplying resin to the two resin molding units may serve as one unit group, and a plurality of unit groups may be arranged in a row along the left-right direction. .

The first loader 60 of the embodiment functions as a workpiece loader for loading the workpiece W into the resin sealing mold 21 and the resin sealing mold 31 , and also functions as a workpiece loader for transporting the molded product M from the resin sealing mold 21 and the resin sealing mold 31 . It functions as an unloader for unloaded molded products, but the function of the first loader 60 may be limited to a workpiece loader. That is, the resin sealing device may further include a third loader as a molded article unloader. For example, such a third loader may share a conveyance path with the first loader and be configured to be movable along the first guide part. Furthermore, the resin sealing device may further include a third guide portion for transporting the third loader.

The arrangement of the cleaner unit 26 is not limited to the above-described embodiment, and for example, either the lower cleaner 26a or the upper cleaner 26b may be used. Furthermore, the cleaner part 26 can be appropriately installed in the front, rear, left and right directions of the resin sealing mold 21 according to the conveyance path of the workpiece W and the first loader gripper 61 .

Furthermore, in the above embodiment, as shown in FIG. 4 , the lower cleaner 26 a and the upper cleaner 26 b have been described as having the same structure. However, preferred modes may be selected depending on the object to be cleaned, etc. Change the structure of each other. For example, when the lower cleaner 26a cleans the lower surface of the first loader grip, a form suitable for cleaning the flat portion may be used.

As shown in FIGS. 2 and 3 , the cleaner portion 26 of the embodiment is configured such that its width in the left-right direction is equal to that of the first loader grip 61 , and its width in the front-rear direction is smaller than that of the first loader grip 61 . structure, but is not limited to the above structure. For example, the width of the cleaner portion 26 in the front-rear direction may be equal to that of the first loader grip 61 . Furthermore, the cleaner part 26 may be a large area in the front, rear, left and right directions that can cover the entire first loader grip 61 . Cleaning can be performed efficiently using the dust collecting port 264a set to a predetermined size in these forms. Furthermore, the cleaner unit 26 can be movable far and near so as to move closer to the object, so that suction can be operated only during cleaning and suction can be stopped when cleaning is no longer required.

In the above embodiment, a plurality of openings 266a of the dust collecting port 264a are provided on the upper surface of the lower cleaner 26a, but the invention is not limited to this. For example, the number of openings of the dust collecting port may be one. Furthermore, the arrangement, shape, and size of the opening of the dust collecting port can be set appropriately. Furthermore, the brush 262a of this embodiment may have the arrangement, number, etc. suitably set according to the shape of the opening 266a. In addition, these structures are also applicable to the upper cleaner 26b.

In the above embodiment, the cleaner part 26 is configured to reciprocate once when the first loader gripper 61 enters and exits the resin sealing mold 21. However, it may be configured to move the cleaner part 26 back and forth once. Or multiple round trips by overlapping below.

In the embodiment, the lower cleaner 26 a and the upper cleaner 26 b have the same structure as shown in FIG. 4 , but they may have different structures depending on the object to be cleaned. For example, the lower cleaner 26a may have a structure such that the density of the brushes 262a is greater than that of the upper cleaner 26b, the suction power of the dust collecting port 264a is high, and the area of the cleaner is large. In the case of the lower mold cavity structure in FIG. 4 , the resin R is placed on the lower mold 22 side. Therefore, it is considered that the resin R adheres to the first loader grip 61 when the first loader grip 61 is withdrawn from the resin sealing mold 21 . In this case, by using the structure of the modification, efficient cleaning of the first loader gripper 61 in the lower mold cavity structure is achieved.

As described above, the resin sealing device 1 according to one aspect of the present invention is a resin sealing device for resin sealing an electronic component including a base material and a workpiece of the electronic component, and includes a resin molding unit that performs compression molding. The electronic components of the workpiece are sealed with resin. The resin molding unit includes: a resin sealing mold, including an upper mold and a lower mold; and a cleaner section, including a loader gripper disposed on a transport path for transporting the workpiece to the resin sealing mold. The dust collection port and cleaner section are used when the loader gripper moves on the conveyance path to supply the workpiece to the resin sealing mold, and when the loader gripper moves on the conveyance path to take out the molded workpiece from the resin sealing mold. When moving upward, a cleaning operation is performed on at least one of the loader gripper and the workpiece moving on the conveyance path.

This makes it possible to clean at least one of the loader gripper and the workpiece during transportation, thereby preventing particles from adhering to the workpiece before resin sealing and the molded article after resin sealing. Therefore, the quality of the resin-sealed molded product can be improved.

In this aspect, when the loader gripper enters the resin sealing mold to supply the workpiece to the resin sealing mold, the cleaner unit performs a cleaning operation on at least one of the loader gripper and the workpiece moving on the conveyance path.

In this aspect, the cleaner unit performs a cleaning operation on the loader gripper moving on the conveyance path when the loader gripper withdraws from the resin sealing mold in order to supply the workpiece to the resin sealing mold.

In this aspect, the cleaner unit performs a cleaning operation on the loader gripper moving on the conveyance path when the loader gripper enters the resin sealing mold to take out the workpiece from the resin sealing mold.

In the above aspect, when the loader gripper withdraws from the resin sealing mold in order to take out the workpiece from the resin sealing mold, the cleaner unit performs the operation on at least one of the loader gripper and the workpiece moving on the conveyance path. Cleaning action.

In this form, the dust collection port of the cleaner part is provided above the conveyance path of the loader gripper, and the cleaner part cleans the upper side of at least one of the loader gripper and the workpiece.

In this form, the dust collection port of the cleaner part is provided below the conveyance path of the loader gripper, and the cleaner part cleans the underside of at least one of the loader gripper and the workpiece.

In the above form, the dust collection ports of the cleaner part are respectively provided above and below the conveyance path of the loader gripper, and the cleaner part cleans the upper and lower sides of at least one of the loader gripper and the workpiece, respectively. .

In this form, the cleaner unit performs a cleaning operation on at least one of the loader gripper and the workpiece that reciprocates on the conveyance path.

In this form, the cleaner part further includes a brush that can contact at least one of the loader grip and the workpiece, a blowing part that blows compressed air or ionized air, or a radiation part that radiates ultrasonic waves.

In this form, the upper mold includes a mold cavity recess opening toward the lower mold.

In this form, the lower mold includes a mold cavity recess opening toward the upper mold.

Another form of the resin sealing method of the present invention is a resin sealing method for resin sealing an electronic component including a base material and a workpiece of the electronic component, which includes: supplying the workpiece to a resin sealing mold through a loader gripper; and utilizing resin sealing. The mold performs resin sealing on the electronic component; and the resin-sealed molded workpiece is taken out from the resin-sealed mold through a loader gripper. The resin sealing method further includes: supplying the workpiece to the resin-sealed mold through the loader gripper. When moving on the conveyance path, and when the loader gripper moves on the conveyance path to take out the molded workpiece from the resin sealing mold, a cleaning operation is performed on the loader gripper or the workpiece moving on the conveyance path.

This makes it possible to clean at least one of the loader gripper and the workpiece during transportation, thereby preventing particles from adhering to the workpiece before resin sealing and the molded article after resin sealing. Therefore, the quality of the resin-sealed molded product can be improved.

The embodiments described above are intended to facilitate understanding of the present invention and are not intended to limitly interpret the present invention. Each element included in the embodiment and its arrangement, materials, conditions, shape, size, etc. are not limited to those illustrated and can be changed appropriately. Furthermore, structures shown in different embodiments may be partially replaced or combined with each other.

1: Resin sealing device 10: Workpiece supply unit 11: Workpiece storage department 13: Workpiece transfer department 15: Workpiece preheating section 19: Workpiece supply control panel 20, 30: Resin molding unit 21, 31, 121: Resin sealing mold 22, 123: Lower mold 22a, 123a: lower plate 22b, 122b: Mold cavity wedge 22c, 122c: positioning parts 22d, 122d: enabling components 22e, 22f, 22g, 23c, 122e, 122f, 122g, 123c: suction hole 23, 122: Upper mold 23a, 122a: upper board 23b, 123b: cavity plate 25, 35, 125: Mold cavity 26, 36: Cleaner Department 26a: Lower cleaner 26b: Upper cleaner 27, 37: Membrane processor 29, 39: Resin molded control panel 40: Resin supply unit 41: Resin supply department 44:Resin protective cover 50: Functional component supply unit 51: Functional component storage part 53: Functional component transmission department 60:First loader 60R: First guidance department 61: First loader gripper 62:First pedestal 63:First guide rod 70: Second loader 70R: Second guidance section 71:Second loader gripper 72:Second pedestal 73:Second guide rod 78:Keep Tools 80:Resin heater 90: Molded product recycling unit 91: Molded product receiving department 93: Molded product transfer department 95: Molded product storage department 262a, 262b: brush 264a, 264b: Dust collection port 266a, 266b: opening F: membrane H: Functional component M: Molded product P: Electronic components P1, P2, P3: position R:Resin S:Substrate W: workpiece

FIG. 1 is a plan view of a resin sealing device according to an embodiment of the present invention. FIG. 2 is a partial enlarged view of the resin sealing device of FIG. 1 . FIG. 3 is a cross-sectional view of the resin sealing mold of FIG. 1 . FIG. 4 is a cross-sectional view of the cleaner part of FIG. 1 . FIG. 5 is a flowchart showing a resin sealing method according to one embodiment of the present invention. FIG. 6 is a diagram for explaining a resin sealing method according to one embodiment of the present invention. FIG. 7 is a diagram for explaining a resin sealing method according to one embodiment of the present invention. FIG. 8 is a diagram for explaining a resin sealing method according to one embodiment of the present invention. FIG. 9 is a diagram for explaining a resin sealing method according to one embodiment of the present invention. FIG. 10 is a diagram for explaining a resin sealing method according to one embodiment of the present invention. FIG. 11 is a diagram for explaining a resin sealing method according to one embodiment of the present invention. FIG. 12 is a diagram for explaining a resin sealing method according to one embodiment of the present invention. FIG. 13 is a diagram for explaining a resin sealing method according to one embodiment of the present invention. FIG. 14 is a diagram for explaining a resin sealing method according to one embodiment of the present invention.

1: Resin sealing device

10: Workpiece supply unit

11: Workpiece storage department

13: Workpiece transfer department

15: Workpiece preheating section

19: Workpiece supply control panel

20, 30: Resin molding unit

21, 31: Resin sealing mold

25, 35: Mold cavity

26, 36: Cleaner Department

27, 37: Membrane processor

29, 39: Resin molded control panel

40: Resin supply unit

41: Resin supply department

50: Functional component supply unit

51: Functional component storage part

53: Functional component transmission department

60:First loader

60R: First guidance department

70: Second loader

70R: Second guidance section

78:Keep Tools

80:Resin heater

90: Molded product recycling unit

91: Molded product receiving department

93: Molded product transfer department

95: Molded product storage department

H: Functional component

M: Molded product

P1, P2, P3: position

R:Resin

W: workpiece

Claims (13)

A resin sealing device for resin sealing the electronic component including a base material and a workpiece of the electronic component, The resin sealing device includes a resin molding unit that resin seals the electronic component of the workpiece by compression molding, The resin molding unit includes: Resin sealed molds, including upper and lower molds; and a cleaner section including a dust collection port and provided on a conveyance path of a loader gripper that conveys the workpiece to the resin sealing mold, The cleaner section is configured when the loader gripper moves on the conveyance path to supply the workpiece to the resin sealing mold, and when the loader gripper removes the workpiece from the resin sealing mold. When the formed workpiece is taken out and moved on the conveyance path, a cleaning operation is performed on at least one of the loader gripper and the workpiece moving on the conveyance path. The resin sealing device according to claim 1, wherein When the loader gripper enters the resin sealing mold in order to supply the workpiece to the resin sealing mold, the cleaner unit cleans the loader gripper and the loader gripper moving on the conveyance path. A cleaning action is performed on at least one of the workpieces. The resin sealing device according to claim 1, wherein The cleaner unit cleans the loader gripper moving on the conveyance path when the loader gripper withdraws from the resin sealing mold in order to supply the workpiece to the resin sealing mold. Perform cleaning actions. The resin sealing device according to claim 1, wherein The cleaner unit cleans the loader gripper moving on the conveyance path when the loader gripper enters the resin sealing mold to take out the workpiece from the resin sealing mold. action. The resin sealing device according to claim 1, wherein The cleaner unit cleans the loader gripper moving on the conveyance path when the loader gripper withdraws from the resin sealing mold in order to take out the workpiece from the resin sealing mold. and performing a cleaning action on at least one of the workpieces. The resin sealing device according to claim 1, wherein The dust collecting port of the cleaner part is provided above the conveying path of the loader grip, The cleaner part cleans the upper side of at least one of the loader grip and the workpiece. The resin sealing device according to claim 1, wherein The dust collecting port of the cleaner part is provided below the conveying path of the loader grip, The cleaner portion cleans the underside of at least one of the loader grip and the workpiece. The resin sealing device according to claim 1, wherein The dust collecting ports of the cleaner part are respectively provided above and below the conveying path of the loader grip, The cleaner part cleans the upper side and the lower side of at least one of the loader gripper and the workpiece respectively. The resin sealing device according to claim 1, wherein The cleaner unit performs a cleaning operation on at least one of the loader gripper and the workpiece that reciprocates on the conveyance path. The resin sealing device according to claim 1, wherein The cleaner part further includes: a brush capable of contacting at least one of the loader gripper and the workpiece; or a blowing part that blows compressed air or ionized air; or a radiation part that radiates ultrasonic waves. The resin sealing device according to any one of claims 1 to 10, wherein The upper mold includes a mold cavity recess, and the mold cavity recess opens toward the lower mold. The resin sealing device according to any one of claims 1 to 10, wherein The lower mold includes a mold cavity recess, and the mold cavity recess opens toward the upper mold. A resin sealing method for resin sealing the electronic component including a base material and a workpiece of the electronic component, the resin sealing method comprising: Feeding the workpiece to the resin-sealed mold via a loader gripper; resin sealing the electronic component using the resin sealing mold; and The resin-sealed molded workpiece is taken out from the resin-sealed mold by a loader gripper, The resin sealing method further includes: when the loader gripper moves on a conveyance path to supply the workpiece to the resin sealing mold; and when the loader gripper moves the workpiece from the resin sealing mold to the resin sealing mold. When the formed workpiece is taken out and moved on the conveyance path, a cleaning operation is performed on the loader gripper or the workpiece moving on the conveyance path.