JP5507740B2 - Single wafer type semiconductor molding equipment - Google Patents

Description

  The present invention relates to a semiconductor product in which a semiconductor such as an IC chip held on a substrate is inserted into a mold for each substrate and is molded with a synthetic resin supplied into the mold and sealed with a resin. The present invention relates to a single wafer type semiconductor mold apparatus.

  A semiconductor such as an IC that is bonded and held on the substrate by bonding the connection terminals is inserted into the mold for each substrate and one substrate at a time, and the resin is molded by a synthetic resin material that is fed into the mold. Single-wafer type semiconductor mold equipment that seals and finishes into semiconductor products is usually fixed to the machine frame and mounted on the lower surface of the upper die set that can be mounted, and the mold can be raised and lowered freely. A substrate to be molded is housed around a mold device composed of a lower mold mounted on the upper surface side of a lower die set that is mounted and moved up and down with respect to the upper die set by a lifting mold clamping mechanism. A rack to be removed, a substrate removal tool for taking out the substrates from the rack one by one, and a substrate taken out by the substrate removal tool at a position above the temporary placement table for placing the substrate in front of the lower mold. Move the board, and remove the substrate at that position. An operation mechanism that operates the substrate removal tool to return to the starting position after being placed on the upper surface of the table, a substrate transfer tool that holds and transfers the substrate on the temporary table, and this substrate transfer tool holds it The substrate is transferred from the upper surface of the temporary mounting table to the upper surface of the lower mold of the mold that is assembled to the mold apparatus, where the substrate is held, placed on the upper surface of the lower mold of the mold, and then returned to the starting position. A tablet that holds a tablet in which the resin mechanism resin powder that molds the substrate set in the mold is pressed and consolidated based on the amount of resin required for one mold clamping operation. A container, a tablet removal tool for taking out one tablet from the tablet container, and a tablet taken out by the tablet removal tool are temporarily received before being supplied to the mold. An operation mechanism for giving the operation to take out the tablet from the tablet container into the pot and the tablet taking-out tool, and the action to drop the taken-out tablet into the pot of the subpot, and moving the subpot above the lower mold of the mold. And an operation mechanism for operating the tablet held in the pot to drop with respect to the mold, and from the substrate taken out by the operation of the above-mentioned substrate transport tool after the molding with the resin material of the tablet in the mold is completed. A molded resin curl, a runner and a gate break unit for breaking the gate, and a completed substrate storage rack for storing the completed substrate from the gate break unit, which is taken out by the substrate extraction tool. Various types of devices and mechanisms are installed, and a single wafer type semiconductor mold Configured in the device.

  This single-wafer type semiconductor molding apparatus further includes a suction cleaning tool using a dust collector and a gate break for cleaning the upper surface of the mold after the resin molding operation is finished around the mold apparatus. In addition to a cleaning tool using a suction blower for cleaning, and a mold that has been cleaned with a suction-type cleaning tool, a brush tool that scrapes off resin waste adhering during resin molding by brushing, and a mold When the resin molding operation is finished, a tool and a device such as a collection hopper for collecting the remaining pot dropped from the subpot may be incorporated.

  Since this single-wafer type semiconductor molding device is configured by arranging various types of devices / equipment and equipment / mechanisms around the mold device, the number of parts increases due to the mechanism increase, There is a problem of high costs.

  Moreover, there is a problem that the reliability of the apparatus / equipment is lowered due to an increase in the number of parts.

In addition, the cleaning of the mold performed every fixed shot is performed by the operator's operation by opening the open / close door provided in the outer enclosure surrounding the entire body of the semiconductor mold apparatus, so the equipment / equipment every time it is cleaned There is a problem of restricting the installation place of the apparatus / equipment caused by the loss of time due to stopping the operation and the generation of dust accompanying the opening of the door for cleaning.

  As disclosed in Japanese Patent Publication No. 04-028133, a semiconductor molding apparatus that molds and seals a semiconductor such as an IC bonded to a substrate (lead frame) with a resin, and incorporates a robot. ing.

Japanese Patent Publication No. 04-028133

  The semiconductor molding device described in this publication constitutes a semiconductor sealing device in which two molding presses are arranged symmetrically with one robot sandwiched between them, and a robot is combined. Lead frame chucking in which the lead frame that is transported to the lead frame supply position on one side of the press (die) is mounted on the robot arm by transport means such as a conveyor lead frame unloader attached to the machine. The operation of gripping with the head and transporting it to the upper surface of the lower die of the press, and the lead frame remaining on the upper surface of the lower die of the press after the sealing molding by the press is completed with the aforementioned lead frame chucking head Grasping and transporting to the gate break device of the other molding press, and mold performed each time the press is opened The cleaning, the lead frame chucking head mounted on the arm of the robot, and a cleaning operation of the mold surface to perform instead put the die cleaning head, but only perform.

  The means described in this publication allows the lead frame to be transported to a position where the lead frame chucking head is gripped by a commonly used transport means such as a conveyor or a lead frame unloader. In addition, for taking out the resin tablet from the tablet hopper to be placed around the press mold, supplying it to the preheating device, and supplying to the press mold, it was assembled exclusively for parts feeder, tablet loader, etc. In addition, the product is discharged to the gate break device by the lead frame chucking head and the gate break device is removed by the gate break device. This is performed using a normal conveying means.

  This conventional semiconductor molding apparatus with a built-in robot allows the robot to perform only a part of the operations of various devices and mechanisms required to seal the lead frame with resin. Since it is performed by the operation, there is a problem in that the number of parts increases and the cost increases due to an increase in the mechanism, as in the conventional single-wafer type semiconductor mold apparatus described above. Furthermore, there is a problem that dust is scattered around the periphery of the mold when it is cleaned every certain shot.

  In semiconductor mold processing means, in order to cope with the supply and movement of the resin tablet in accordance with the substrate form and the supply and movement of the substrate that change with the progress of the molding process, various devices, equipment, and mechanisms are installed. This is to solve the high cost caused by the increase in the number of parts due to the attachment and to solve the restriction of the installation location of the equipment device due to dust scattering at the time of mold cleaning.

As a means for solving the above-described problems, in the present invention, a substrate storage rack for storing a substrate to be molded at a peripheral position of a mold apparatus installed in a machine frame of a single wafer type semiconductor mold apparatus; A tablet container for housing a resin tablet for molding the substrate, a gate break unit for breaking the resin runner and gate from the substrate after the mold processing by the resin in the mold apparatus, and a mold taken out from the gate break unit A completed substrate storage rack for storing processed substrates is disposed,
At the position facing the mold apparatus, a six-axis articulated robot having a six-axis joint is provided,
At the position between the six-axis articulated robot and the mold apparatus, a stage for arranging and mounting various tools is installed,
On this stage, a substrate removal tool for removing the substrate from the substrate storage rack, a substrate transfer tool for transferring the extracted substrate to the mold surface of the mold apparatus, and a resin tablet are removed from the tablet container, and the mold apparatus Tablet take-out tool transported to the mold surface, substrate unloading tool that takes out the substrate that has been molded by the die device and supplies it to the gate break unit, and takes out the substrate after the gate break is completed and accommodates the finished substrate Various tools with the substrate removal tool to be transported to the rack are placed on the line,
The six-axis articulated robot is equipped with a tool connection chuck (A) for engaging and connecting to the various tools on the tip side of the robot's operating arm,
The various types of tools include a connection chuck that engages and connects to a connection chuck (A) for connecting a tool, which is provided on the distal end side of the operating arm of the six-axis articulated robot, at each base end of the tools. The present invention proposes a single wafer type semiconductor molding apparatus equipped with (B).

  According to the present invention, a substrate housing rack, a tablet container, a gate break unit, and a completed substrate housing rack are disposed around a mold device installed in the machine frame. A six-axis articulated robot is arranged at a position facing the. A stage on which various tools are aligned and mounted is installed at a position between the six-axis articulated robot and the mold apparatus. A substrate removal tool for removing the substrate from the substrate rack and a substrate taken out are placed on the stage. A substrate transfer tool for transferring to a mold apparatus, a tablet extraction tool for taking out a resin tablet from a tablet container and transferring it to the mold surface of the mold apparatus, and a substrate after mold processing in the mold apparatus is completed. Various tools such as a substrate carry-out tool that is taken out from the gate break unit and supplied to the gate break unit and a substrate take-out tool that takes the substrate out of the gate break unit and transports it to the completed substrate storage rack are arranged and mounted. And, on the distal end side of the working arm of the six-axis articulated robot, a tool connection chuck A for engaging and connecting with the various tools is equipped, and the various tools are provided at the base end portions. A tool for supplying the substrate to the mold apparatus and a resin tablet for the mold apparatus are provided because the apparatus is equipped with a connection chuck B that engages and connects to the connection chuck A mounted on the tip side of the operating arm. Tool for supplying the substrate to the gate break unit from the mold device, and the work movement of the various tools for transferring the tool from the gate break unit to the finished substrate receiving rack. Since the operation is performed by the operation, each tool has an operation mechanism and a drive means for performing a predetermined work operation. Main cities, with less significantly parts, may reduce the production cost.

  Each tool is placed in an aligned state on a stage installed between an articulated robot and a mold apparatus, and a rack that accommodates a substrate to be molded, and a rack that accommodates a substrate that has been molded. And various devices such as a tablet alignment plate for storing resin tablets and a gate break unit are installed around the mold device, so that each tool can be quickly adapted to the operation of the operation arm of the articulated robot. The tool can be accurately attached and detached, and the predetermined work movement of each tool connected to the operating arm of the articulated robot can be performed quickly and accurately.

  In addition, when the semiconductor mold apparatus of the present invention is stored in an airtight case, the work of cleaning the mold by brushing is automatically performed by the robot in the airtight case, and the mold vacuum cleaner is used. Since the cleaning is performed by collecting the removed dust in the dust collector 87 installed in the case, the cleaning can be performed without scattering the dust around the four circumferences.

It is a perspective view of the semiconductor mold apparatus used for implementation of the method of the present invention. It is explanatory drawing of the motion of each joint of the six-axis articulated robot incorporated in the apparatus same as the above. It is a perspective view of the board | substrate extraction tool integrated in an apparatus same as the above. It is a perspective view at the time of the state which is taking out the board | substrate with the board | substrate extraction tool same as the above in the enlarged view of a part of apparatus same as the above. It is a perspective view of the board | substrate conveyance tool integrated in an apparatus same as the above. It is a partial enlarged view of an apparatus same as the above, and is a perspective view at the time of the state which is taking out the board | substrate with the board | substrate conveyance tool same as the above. It is a perspective view of the tablet extraction tool incorporated in the apparatus same as the above. It is the one part enlarged perspective view of the apparatus same as the above at the time of the state which has picked out the tablet from the tablet alignment plate by the tablet removal tool same as the above. It is a perspective view of the tablet conveyance tool integrated in an apparatus same as the above. It is the one part enlarged perspective view of an apparatus same as the above at the time of the state which conveyed the tablet to the upper surface of the metal mold | die lower mold with the tablet conveyance tool same as the above. It is a perspective view of the board | substrate carrying-out tool integrated in an apparatus same as the above. It is the one part enlarged perspective view of the same apparatus at the time of the state which is carrying out the board | substrate by the board | substrate carrying-out tool same as the above. It is a perspective view of the brushing tool integrated in an apparatus same as the above. It is the one part enlarged perspective view of the same apparatus at the time of the state which has brushed the metal mold | die with the same brushing tool. It is a perspective view of the cleaning tool integrated in an apparatus same as the above. It is the one part enlarged perspective view of the same apparatus at the time of the state which is cleaning the metal mold with a cleaning tool same as the above. It is a perspective view of another Example.

  Next, an embodiment will be described in detail with reference to the drawings for each embodiment.

  FIG. 1 is an overall perspective view of a single-wafer type semiconductor mold apparatus used for carrying out the method of the present invention, in which k indicates a mold apparatus.

  In the mold apparatus k, the upper die set 10 is assembled on the lower surface of the upper platen fixedly mounted on the ceiling of the machine frame 1 composed of four support columns, and the upper mold set 11 is mounted on the lower surface side of the upper die set 10. Assembling and mounting, a movable platen is mounted on the upper and lower intermediate parts of the machine frame 1 so as to be movable up and down, and a lower die set 12 is assembled and mounted on the movable platen, and is installed on the lower surface side of the movable platen (not shown) ), The lower die set 12 is moved up and down, and a lower die set 13 facing the upper die 11 is assembled on the upper surface side of the lower die set 12. In this example, it is installed at the left corner on the rear end side of the upper surface of the base 1a.

  Reference numeral 2 denotes a rack that accommodates a substrate (lead frame) to be molded by the mold apparatus k, and the left and right side edges of the substrate are fitted into locking grooves provided on the left and right inner wall surfaces of the rack 2. Inserting a large number of substrates in a stacked state, and having a normal configuration, is mounted on the rear side of the support machine frame 1b erected from the base 1a on the right side of the mold apparatus k described above. It is.

  A temporary table 20 for temporarily supporting the taken-out board is formed in a bowl shape at the take-out opening that opens to the front side of the support machine frame 1b of the rack 2.

  Reference numeral 3 denotes a tablet container for accommodating and preparing a resin tablet for molding a substrate, and is mounted on the front surface position of the support machine frame 1b on the right side of the mold apparatus k.

  4 is a gate break unit that breaks the runner, the cull and the gate from the molded substrate by the resin tablet supplied to the mold apparatus k. Coordinated so as to be parallel to the rack 2 and supported on the support machine frame 1b.

  Reference numeral 5 denotes a rack for accommodating a substrate that has been subjected to gate processing in the gate break unit 4 and has been subjected to molding, and is arranged in parallel with the rack 2 that accommodates the substrate before being subjected to the above-described molding. And is supported on the support machine frame 1b.

  6 is an articulated robot disposed at a position facing the mold apparatus k, and as shown by an imaginary line in the explanatory view of FIG. 2, a first arm 60 that rotates left and right by a vertical rotation axis a; A second arm 61 that pivots back and forth with respect to the first arm 60 about a rotational axis b in the left-right direction; a third arm 62 that pivots with respect to the second arm 61 up and down with a rotational axis c in the lateral direction; A fourth arm 63 that pivots left and right with a rotation axis d in the front-rear direction relative to the third arm 62; a fifth arm 64 that pivots back and forth with a rotation axis e in the left-right direction with respect to the fourth arm 63; This is a six-axis articulated robot comprising a sixth arm 65 that pivots and rotates with a vertical rotation axis f with respect to the five arms 64.

  In this example, the articulated robot 6 is configured such that a support base 67 that supports the base body 66 can be moved left and right on a rail 68 that is installed on the front side of the mold apparatus k with the longitudinal direction being the left-right direction. By mounting, it can move to the left and right along the front surface of various devices such as the rack 2, the gate break unit 4 and the alignment plate 3 arranged in parallel on the front surface of the mold device k and on the right side of the mold device k. It is installed.

  Reference numeral 7 denotes a stage that can be disposed between the articulated robot 6, the mold apparatus k, and the attached devices, on which various tools 8 are arranged and mounted. These tools are selected in accordance with the processing sequence when the substrate is molded, and are used by being connected to the operating arm 65 of the robot.

  Reference numeral 80 denotes a substrate take-out tool for taking out a substrate to be molded from the rack 2 when starting the mold processing of the substrate. As shown in FIG. 3, the substrate is held on the front end side. And a pair of holding pieces 801 and 802 for engaging the connecting chuck A provided on the sixth arm 65 which is the operating arm of the articulated robot 6 on the base end side. The connecting chuck B to be connected is mounted on the stage 7 in such a state that the connecting chuck B on the base end side is exposed on the upper surface side of the stage 7.

  Then, the function provided to the articulated robot 6 moves the sixth arm 65, which is the operating arm of the robot 6, so that the connecting chuck A at the tip is brought into contact with the connecting chuck B of the tool 80 on the stage 7 and meshes with each other. In this state, the robot moves to pull out the substrate from the rack 2 and place it on the upper surface of the temporary table 20 as shown in FIG. After that, the stage 7 is moved above a predetermined storage position and lowered, the connection chuck A is opened, and the connection is released.

  Next, the operating arm 65 of the robot moves above the substrate transfer tool 81 mounted on the stage 7 and is connected to the substrate transfer tool 81 in the same manner as in the case of the substrate takeout tool 80 described above.

  As shown in FIG. 5, the substrate transfer tool 81 is provided with a suction plate 811 protruding in an orthogonal direction on the inner surface side of the base 810 equipped with the connection chuck B on the outer surface side, and a vacuum pump ( (Not shown) holds the suction pipe 813 connected via the flexible tube 812, and forms a suction port at the tip thereof. As shown in FIG. Then, the substrate removal tool 80 moves to a position covering the upper surface of the substrate placed on the upper surface of the temporary table 20, and at that position, the substrate is adsorbed and held by the suction pressure of the suction port of the suction pipe 813. By the above operation, it is carried to the upper surface of the lower mold 13 of the mold, and by releasing the suction, the suction is released and the substrate is placed there and returned to the upper side of the stage 7 to be carried out by the substrate take-out tool 80 described above. It is stored in the stage 7 in the same operation.

  Next, the operating arm 65 of the robot moves above the tablet removal tool 82 stored in the stage 7 and is connected to the tool 82.

  As shown in FIG. 7, this tool 82 has a pair of sandwiching pieces 821 and 822 whose opposing intervals are expanded and contracted by an opening / closing operation mechanism on the lower surface side of the base 820 equipped with the connecting chuck B on the outer surface side. The support plate 823 supported by the robot is suspended, and the movement of the operation arm 65 of the robot causes the tablet tablet 3 formed on the tablet alignment plate to move above and aligned therewith. As shown in FIG. 8, it operates to move to a subpot provided on the tablet transport tool 83 that is picked up and placed on the stage 7, and when a predetermined number of resin tablets have been transferred. Returning to the upper side of the storage position of the stage 7, it is stored by opening the connecting chuck A.

  Next, the operating arm 65 of the robot moves toward the connection chuck B of the tablet transfer tool 83 placed on the upper surface of the stage 7 and is connected thereto.

The tablet transport tool 83 has a form as shown in FIG. 9. In this embodiment, the tablet transport tool 83 is attached to a board having a form in which semiconductors are placed in parallel in a single board on five boards. Therefore, the five subpots 830 and the five claw pieces 831 for pushing down the resin tablet dropped in there are provided in correspondence with the number of semiconductors attached to the substrate. It is equipped with a connecting chuck B at one end. The number of subpots 830 provided in the tablet transport tool 83 is changed in accordance with the number of semiconductors attached to the substrate to be molded. When the number of semiconductors provided on the substrate is as small as one or two, the tablet is directly transferred to the upper surface of the lower mold by the tablet take-out tool 82 without using the tablet transfer tool 83.

  The tablet transport tool 83 in a state where the resin tablet is inserted into the subpot 830 by the above-described tablet take-out tool 82 is the top surface of the lower mold 13 as shown in FIG. 10 by the operation of the operation arm 65 of the connected robot. Therefore, the resin tablet in the subpot 830 is dropped on the lower mold 13 of the mold, returned to the upper side of the stage 7, separated from the operating arm 65 by releasing the connection chuck A, and placed on the stage 7. The

  At this time, the mold apparatus k is clamped at the end of the supply of the resin tablet by the tablet transport tool 83, and the molding process is started.

  When the mold processing is completed and the mold is opened, the robot operating arm 65 moves above the substrate carry-out tool 84 on the stage 7 and is connected to the tool 84. As shown in FIG. 11, the substrate carry-out tool 84 is provided with a suction plate 841 protruding in a direction orthogonal to the base 840 on the inner surface of the base 840 equipped with the connecting chuck B on the outer surface. A suction pipe 843 connected to a vacuum pump (not shown) via a flexible tube 842 is held by this, and a suction disk 844 is provided at the tip of the pipe 843, and the operating arm 65 of the connected robot 6 is provided. 12, as shown in FIG. 12, the substrate is moved above the lower mold 13, and the substrate that has been molded is sucked and held, carried out, and supplied to the gate break unit 4. The operation arm 65 of the robot returns to the storage position of the stage 7 and is stored away from the operation arm 65.

  Here, the substrate supplied to the gate break unit 4 is a substrate in which the runner cal and the gate are separated to complete the molding process, and a rack that accommodates the molding completion substrate by the mechanism equipped in the unit 4. 5 is discharged onto the alignment rail 50 which is located on the front surface of 5 and installed.

  At this time, the robot's working arm 65 moves over the first used substrate removal tool 80 on the stage 7 and is coupled to and holds the tool 80, where it is aligned rails. The substrate on 50 is gripped, inserted into the storage rack 5 and stored, released, returned to the storage position of the stage 7 and stored.

  The mold processing operation for the substrate to be subjected to the molding process is completed by a series of work operations sequentially performed by exchanging the tool.

  When this one-shot mold processing operation is completed, the operating arm 65 of the robot 6 moves toward the cleaning tool 86 mounted on the shelf 862 and is connected to the connecting chuck B of the tool 86. The upper surface of the lower mold 13 is cleaned with the tool 86.

  As shown in FIGS. 15 and 1, the cleaning tool for cleaning the upper surface of the mold is attached to the vacuum suction type dust collector 87 on the other side of the support plate 860 provided with the connecting chuck B on one side of the front side. A suction device 861 connected through a flexible tube 88 is held, and is mounted on a shelf 862 provided in a shelf shape on the upper part of the front side of the support machine frame 1b that supports the rack 2 and the like. It is prepared.

  In this tool 86, the operating arm 65 of the robot 6 moves toward the tool 86 at a predetermined time set in the operation control program of the semiconductor mold apparatus when the one-shot mold processing operation is completed. When the connecting chuck A at the tip is connected to the connecting chuck B of the tool 86, it is supported by the operating arm 65 and acts to clean the upper surface of the mold as shown in FIG.

  Reference numeral 85 denotes a brushing tool that cleans the periphery of the mold by brushing when a predetermined number of shots have been molded or when a day's work has been completed.

  As shown in FIG. 13, the brushing tool 85 has a configuration in which a brush 851 is attached to the inner surface side of a base 850 equipped with a connection chuck B on the outer surface side, and is connected to the connection chuck B of the operating arm 65. In this state, the movement of the operating arm 65 moves to the upper position of the lower mold 13 as shown in FIG. 14, and at that position, the operating arm 65 acts to brush the mold surface by moving back and forth and from side to side. . When the predetermined brushing operation is completed, the signal is returned to the stage 7 and stored.

  In the embodiment apparatus configured as described above, various tools such as a substrate removal tool, a substrate transfer tool, a resin tablet extraction tool, a substrate discharge tool, a mold cleaning tool, etc., which are equipped with the operation of the apparatus are predetermined. The mold processing was completed by clamping the mold, the workpiece operation in the process of transporting the substrate taken out by the workpiece operation in the process of taking out the substrate from the storage rack to each tool. A series of work operations in the process of taking the substrate out of the mold and transporting it to the gate break unit, and the work operation in the process of taking out the substrate after the break of the runner and gate from the gate break unit and transporting it to the storage rack for the processed substrate After the one-shot molding process for a single-leaf substrate is completed by this process, the mold surface is cleared. A single six-axis that keeps the workpiece movement of the predetermined process performed on each tool at a position facing the mold device when performing the workpiece movement of the machining process and molding the substrate The articulated robot performs the movement by the movement of the operation arm of the robot using the function provided in the robot.

  In other words, one 6-axis multi-joint robot that is installed facing the mold device is prepared by separating it from the mold device at the tip of its working arm and arranging it around the mold device. Various tools such as a board removal tool to be installed are sequentially replaced and mounted according to the movement of the operating arm, and the mounted tool is caused to perform a workpiece operation in a predetermined process by operating the operating arm. Yes.

  In addition, each tool is placed in parallel between the articulated robot and the mold apparatus, and stores a rack that accommodates a substrate to be molded, a rack that accommodates a substrate that has been molded, and a resin tablet. Since various devices such as tablet containers and gate break units are installed around the mold device, each tool can be attached and detached quickly and accurately by the operation of the articulated robot's operating arm, and The predetermined workpiece movement of each tool connected to the working arm of the six-axis articulated robot can be performed quickly and accurately.

  FIG. 17 is an overall perspective view of another embodiment. This example is an example in which the semiconductor molding apparatus of Example 1 described above is installed in a sealed case having an open / close door.

  In the figure, reference numeral 9 denotes a box-like case in which the outer wall of the four circumferences is formed by an enclosure fitted with transparent glass, and an open / close door 90 made of a transparent plate is attached to the front side.

  Reference numeral 6 denotes an articulated robot combined with a semiconductor mold apparatus installed in the storage state in the case 9, which is disposed in a part of the case 9 on the front side where the opening / closing door 90 is provided.

  k is a mold apparatus of the semiconductor mold apparatus, 7 is a stage on which a tool disposed between the mold apparatus k and the articulated robot 6 is placed, and 87 is a dust collector connected to the cleaning tool.

  Since the semiconductor mold apparatus stored in the case 9 is the semiconductor mold apparatus itself shown in the first embodiment, detailed description of each device and various tools provided therein is omitted.

  In this embodiment, since the semiconductor molding apparatus is stored in a completely airtight case, the work of cleaning the mold by brushing is automatically performed by the robot in the airtight case, and the vacuum of the mold is also obtained. Since the cleaning by the cleaner is performed by collecting the removed dust in the dust collector 87 installed in the case, the cleaning can be performed without scattering the dust around the four circumferences.

AB Link chuck a b cd d Rotation axis k Mold device 1 Machine frame 1a Base 1b Support machine frame 10 Upper die set 11 Mold upper mold 12 Lower die set 13 Mold lower mold 2 5 Rack 20 Temporary table 3 Tablet Container 4 Gate break unit 50 Alignment rail 6 Articulated robot 60 1st arm 61 2nd arm 62 3rd arm 63 4th arm 64 5th arm 65 6th arm (working arm)
66 Substrate 67 Support stand 68 Rail 7 Stage 8 Tool 80 Substrate extraction tool 801 802 Holding piece 81 Substrate transfer tool 810 840 850 Base 811 841 Suction plate 812 842 88 Flexible tube 813 843 Suction pipe 82 Tablet extraction tool 821 822 Support plate 83 Tablet transport tool 830 Subpot 831 Claw piece 84 Substrate carry-out tool 844 Suction plate 85 Brushing tool 851 Brush 86 Cleaning tool 861 Suction device 862 Shelf stand 87 Dust collector 9 Case 90 Open / close door

Claims (1)

A substrate storage rack for storing a substrate to be molded, a tablet container for storing a resin tablet for molding the substrate, and a metal mold at a peripheral position of a mold device installed in a machine frame of a single-wafer type semiconductor molding device A gate break unit that breaks the resin runner and gate from the substrate that has been molded with resin in the mold apparatus, and a completed substrate storage rack that accommodates the substrate that has been molded and removed from the gate break unit. And
At the position facing the mold apparatus, a six-axis articulated robot having a six-axis joint is provided,
At the position between the six-axis articulated robot and the mold apparatus, a stage for arranging and mounting various tools is installed,
On this stage, a substrate removal tool for removing the substrate from the substrate storage rack, a substrate transfer tool for transferring the extracted substrate to the mold surface of the mold apparatus, and a resin tablet are removed from the tablet container, and the mold apparatus Tablet take-out tool transported to the mold surface, substrate unloading tool that takes out the substrate that has been molded by the die device and supplies it to the gate break unit, and takes out the substrate after the gate break is completed and accommodates the finished substrate Various tools with the substrate removal tool to be transported to the rack are placed on the line,
The six-axis articulated robot is equipped with a tool connection chuck (A) for engaging and connecting to the various tools on the tip side of the robot's operating arm,
The various types of tools include a connection chuck that engages and connects to a connection chuck (A) for connecting a tool, which is provided on the distal end side of the operating arm of the six-axis articulated robot, at each base end of the tools. A single-wafer type semiconductor molding apparatus comprising (B).

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