JP2023137214A - Resin encapsulation device and resin encapsulation method - Google Patents

Abstract

To provide a resin encapsulation device that reduces molding defects.SOLUTION: A resin encapsulation device for resin encapsulating electronic components in workpieces containing base materials and electronic components includes: a cleaning unit in which a frame with a through hole for regulating spreading of a resin is provided, and a side wall of the frame surrounding the through hole is cleaned as the unit lifts and lowers; and a cleaner that sucks a first surface of the frame.SELECTED DRAWING: Figure 3A

Description

The present invention relates to a resin sealing device and a resin sealing method.

As an example of a resin sealing device that melts resin on a workpiece including a base material and electronic components to seal the electronic components with resin, a resin sealing device that molds resin onto a functional component together with the workpiece is known. There is.

Patent Document 1 discloses a resin molding apparatus that molds a workpiece into a molded product by using a molding resin introduced into a through hole of a resin guard.

Patent Document 2 describes a resin sealing device and workpiece cleaning device that prevents particles (granular resin powder, fine powder, etc.) from being carried into a molding die with adhesion to the workpiece, and prevents deterioration in molding quality. A method is disclosed.

JP 2019-145548 Publication JP2021-178411A

However, in the case of the configuration of Patent Document 1, in the process of molding the workpiece with resin and processing the molded product, the processing flow progresses with resin adhering to the side wall of the resin guard as particles, and the molded product is There is a risk of foreign matter getting mixed in.

Furthermore, even if the configuration of Patent Document 2 is applied to Patent Document 1, particles attached to the side wall of the resin guard cannot be removed, and if particles are scattered during the resin sealing process, dust may adhere or This may cause molding defects such as foreign matter contamination.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a resin sealing technique that reduces molding defects caused by particles attached to a resin guard.

A resin sealing device according to one aspect of the present invention is a resin sealing device for resin-sealing electronic components of a workpiece including a base material and electronic components, and includes a through hole for regulating the spread of the resin. To provide a resin sealing device including a cleaning unit that cleans a side wall of the frame surrounding a through hole as it moves up and down, and a cleaner that sucks a first surface of the frame. .

In the above aspect, the cleaning unit is provided with a brush, and may clean the side wall of the frame as the cleaning unit moves up and down.

In the above embodiment, the longest end of the brush from the axis may be larger than the diameter of the through hole.

In the above embodiment, a non-stick coating may be applied to the side wall of the frame.

In the above embodiment, the lifting and lowering operation of the cleaning unit may be repeated multiple times.

In the above aspect, a cleaning device may be provided that sucks the second surface of the frame opposite to the first surface, and the cleaning device may be provided on the conveyance path of the frame.

In the above aspect, the cleaning unit is provided with a top plate, and the cleaner may suck the first surface of the frame while the through hole is blocked by the top plate.

In the above aspect, the frame body is provided with a plurality of through holes, and a plurality of cleaning units are provided corresponding to each of the plurality of through holes, and the lifting/lowering operation period of the plurality of cleaning units is at least partially There may be overlapping periods.

A resin sealing method according to one aspect of the present invention is a resin sealing method for resin sealing electronic components of a work including a base material and electronic components, and the resin sealing apparatus includes a frame, a cleaning unit, and a cleaner. In the process, a cleaning unit cleans the side wall of the frame surrounding the through-hole as it moves up and down, and a cleaner cleans the side wall of the frame, which is provided with a through-hole to restrict the spread of the resin. A resin sealing method is provided, which includes the step of sucking the first surface.

FIG. 1 is a plan view schematically showing the configuration of a resin sealing device according to an embodiment. FIG. 2 is a plan view schematically showing a more detailed configuration of a first loader and a second loader. FIG. 2 is a cross-sectional view schematically showing a frame side wall in the middle of cleaning in the first embodiment of the resin sealing device according to the present invention. FIG. 3 is a cross-sectional view schematically showing a state in which the upper surface of the frame is being cleaned in the first embodiment of the resin sealing device according to the present invention. FIG. 7 is a cross-sectional view schematically showing a frame side wall in the middle of cleaning in a second embodiment of the resin sealing device according to the present invention. FIG. 7 is a cross-sectional view schematically showing the middle of cleaning the upper surface of the frame in a second embodiment of the resin sealing device according to the present invention. FIG. 7 is a cross-sectional view schematically showing a frame side wall in the middle of cleaning in a third embodiment of the resin sealing device according to the present invention. FIG. 7 is a cross-sectional view schematically showing a state in which the upper surface of the frame is being cleaned in a third embodiment of the resin sealing device according to the present invention. It is a flowchart which shows the cleaning method of the frame in the resin sealing device 1 based on one exemplary embodiment.

Embodiments of the present invention will be described below with reference to the drawings. The drawings of each embodiment are illustrative, and the dimensions and shapes of each part are schematic, and the technical scope of the present invention should not be interpreted as being limited to the embodiment.

<Resin sealing device>
1 and 2 show the layout when viewed from above. For convenience, front, back, left, right, top, and bottom directions are attached to each drawing in order to clarify the relationship between the drawings and to help understand the positional relationship of each member. Hereinafter, the resin sealing device 1 will be explained with reference to FIGS. 1 and 2.

The resin sealing device 1 is a manufacturing device that melts a resin R on a workpiece W including a base material S and an electronic component P, seals the electronic component P with the resin, and manufactures a molded product M. The resin sealing device 1 molds the resin R onto the functional member H as well as the workpiece W. The functional member H is, for example, a plate-like member, and is provided so as to be exposed on the side opposite to the side where the base material S of the molded product M is exposed. The base material S is, for example, an interposer substrate, a lead frame, a carrier plate with an adhesive sheet, a semiconductor substrate, or the like. The electronic component P is, for example, a semiconductor element such as an IC chip, but is not limited thereto, and may be various active elements, passive elements, MEMS devices, etc. The functional member H is, for example, a heat dissipating member that emits heat generated by the electronic component P or a shielding member that shields electromagnetic waves, but is not limited to the above. The resin R is, for example, a granular thermosetting resin. The shape of the resin R is not limited to the above, and may be in the form of a liquid or a tablet.

The resin sealing device 1 according to this embodiment is a compression type resin sealing device. However, the resin sealing device according to one embodiment of the present invention is not limited to the above, and may be a transfer type resin sealing device.

As shown in FIG. 1, the resin sealing apparatus 1 includes a workpiece supply unit 10, a resin supply unit 40, a functional member supply unit 50, resin molding units 20 and 30, a molded product recovery unit 90, and a first It includes a loader 60 and a second loader 70. The work supply unit 10, the resin supply unit 40, the resin molding units 20 and 30, and the molded product recovery unit 90 are arranged side by side in the left-right direction. The resin supply unit 40 and the functional member supply unit 50 are arranged side by side in the front-rear direction.

The workpiece supply unit 10 supplies the workpiece W to the first loader hand 61 of the first loader 60 . The workpiece supply unit 10 includes a workpiece storage section 11 , a workpiece delivery section 13 , a workpiece preheating section 15 , and a workpiece supply control panel 19 . As shown in FIG. 1, when viewed from above, the work supply unit 10 is arranged, for example, at the left end of the resin sealing device 1.

The work storage section 11 stores a plurality of works W and sequentially sends out the works W. For example, the work storage section 11 is equipped with a plurality of work magazines and a work elevation. A plurality of works W are stored in a work magazine set in the work storage section 11 so as to overlap in the vertical direction. Work elevation adjusts the position of the work magazine in order to send the work W to the work transfer section 13.

The workpiece delivery section 13 delivers the workpiece W received from the workpiece storage section 11 to the workpiece preheating section 15. For example, the work delivery section 13 is equipped with a work index that receives and arranges the workpieces W sent out by the workpiece storage section 11, and a workpiece pick and place that delivers the workpieces W aligned by the workpiece index to the workpiece preheating section 15. ing.

The workpiece preheating section 15 preheats the workpiece W received from the workpiece transfer section 13 and delivers it to the first loader hand 61 of the first loader 60 . By preheating the workpiece W before being transported to the resin molding units 20 and 30, deformation of the workpiece W due to sudden temperature changes inside the resin molding molds 21 and 31 is suppressed. For example, the workpiece preheating section 15 is equipped with a preheating rail that heats the workpiece W from the end. The workpiece preheating section 15 may be equipped with a hot plate that heats the entire surface of the workpiece W.

The work supply control panel 19 is a control panel for controlling the operation of the work supply unit 10. As shown in FIG. 1, when viewed from above, the workpiece supply control panel 19 is arranged at the front of the workpiece supply unit 10. For example, the work supply control panel 19 includes a display section that displays control parameters of the work supply unit 10 and an input section that inputs the control parameters of the work supply unit 10. Further, for example, the workpiece supply control panel 19 includes a display section that displays control parameters of a molded product recovery unit 90, a resin supply unit 40, a functional member supply unit 50, a first loader 60, and a second loader 70, which will be described later. The input unit for inputting control parameters may be integrated.

Note that the work supply unit 10 may further include a volume measurement section that measures the volume of the work W, an appearance inspection section that inspects the appearance of the work W, and the like.

The molded product collection unit 90 collects the molded product M from the first loader hand 61 of the first loader 60 . The molded product collection unit 90 includes a molded product receiving section 91, a molded product delivery section 93, and a molded product storage section 95. As shown in FIG. 1, when viewed from above, the molded product recovery unit 90 is disposed, for example, at the right end of the resin sealing device 1. The molded product recovery unit 90 is disposed on the opposite side of the workpiece supply unit 10 with respect to the resin molding units 20 and 30 in the left-right direction, but is not limited thereto. The molded product recovery unit 90 may be arranged on the same side as the work supply unit 10 with respect to the resin molding units 20 and 30 in the left-right direction.

The molded product receiving section 91 delivers the molded product M received from the first loader hand 61 of the first loader 60 to the molded product delivery section 93. For example, the molded product receiving section 91 is equipped with a cooling pallet that cools the molded product M.

The molded product delivery unit 93 delivers the molded product M received from the molded product receiving unit 91 to the molded product storage unit 95. For example, the molded product delivery section 93 includes a molded product index for receiving and arranging the molded products M sent out by the molded product receiving section 91, and a molding index for delivering the molded products M aligned by the molded product index to the molded product storage section 95. Items are equipped with pick and place.

The molded product storage section 95 receives and stores the molded product M. For example, the molded product storage section 95 is equipped with a plurality of molded product magazines and a molded product elevation. A plurality of molded products M are stored in a molded product magazine set in the molded product storage section 95 so as to overlap in the vertical direction. The molded product elevation adjusts the position of the molded product magazine in order to receive the molded product M from the molded product delivery section 93.

Note that the molded product recovery unit 90 may further include a volume measuring section that measures the volume of the molded product M, an appearance inspection section that inspects the appearance of the molded product M, and the like. When the resin sealing device according to an embodiment of the present invention is a transfer type resin sealing device, the molded product recovery unit includes a degate section that separates unnecessary resin called cull and liner from the molded product M, and a separation unit. A scrap box or the like may be provided for collecting unnecessary resin.

The resin molding unit 20 molds the resin R onto the workpiece W and the functional member H. The resin molding unit 20 molds the resin R so that at least a portion of the functional member H is exposed. The resin molding unit 20 includes a resin molding mold 21, a film handler 27, and a resin molding control panel 29. When viewed from above as shown in FIG. 1, the resin molding unit 20 is connected to, for example, the right side of the work supply unit 10.

The resin sealing mold 21 is a pair of openable and closable molds in which an internal cavity 25 is filled with resin R and molded. The resin sealing mold 21 includes a lower mold 22 and an upper mold 23. The surface of the lower mold 22 facing the upper mold 23 is flat, and a cavity 25 is formed in the surface of the upper mold 23 facing the lower mold 22 (hereinafter referred to as the "molding surface"). There is. That is, the resin sealing mold 21 is a compression molding mold having a so-called upper cavity movable structure.

The film handler 27 supplies the film to the resin sealing mold 21. The film is a release film that prevents the resin R from entering the gap between the upper molds 23 and facilitates the peeling of the molded product M from the upper mold 23. The film handler 27 includes an unwinding section that supplies unused film and a winding section that collects used film F. The film handler 27 corresponds to an example of a "film supply section" according to the present invention. Film materials include polymeric materials with excellent heat resistance, easy peelability, flexibility, and extensibility, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene/ethylene copolymer), and FEP (tetrafluoroethylene). Fluoroethylene/hexafluoropropylene copolymer), PET (polyethylene terephthalate), PP (polypropylene), PVDC (polyvinylidine chloride), etc. are preferably used. The material of the film is not limited to the above, and may be, for example, fluorine-impregnated glass cloth. The thickness of the film is suitably selected depending on the physical properties of the material, and is approximately 50 μm, for example. Note that the shape of the film is not limited to a roll shape, but may be a strip shape.

The resin molding control panel 29 is a control panel for controlling the operation of the resin molding unit 20. As shown in FIG. 1, when viewed from above, the resin molding control panel 29 is arranged on the front surface of the resin molding unit 20. For example, the resin molding control panel 29 includes a display section that displays control parameters of the resin molding unit 20 and an input section that inputs the control parameters of the resin molding unit 20.

The resin molding unit 30 includes a resin molding mold 31, a film handler 37, and a resin molding control panel 39. When viewed from above as shown in FIG. 1, the resin molding unit 30 is connected to, for example, the left side of the molded product recovery unit 90. Note that since the configuration of the resin molding unit 30 is similar to that of the resin molding unit 20, descriptions of the resin sealing mold 31, the film handler 37, and the resin molding control panel 39 will be omitted.

Note that at least some of the functions of the resin molding control panels 29 and 39 may be integrated into the workpiece supply control panel 19. For example, the control parameters of the resin molding units 20 and 30 may be displayed on the display section of the work supply control panel 19, and the control parameters of the resin molding units 20 and 30 may be input to the input section of the work supply control panel 19. good. When all the functions of the control panels of each unit are integrated into the work supply control panel 19, the resin molding control panels 29 and 39 may be omitted.

The resin supply unit 40 supplies granular resin R to the second loader hand 71 of the second loader 70 . As shown in FIG. 1, when viewed from above, the resin supply unit 40 is connected to the right side of the resin molding unit 20 and to the left side of the resin molding unit 30. The resin supply unit 40 includes a resin supply section 41 .

The resin supply section 41 includes, for example, a hopper and a feeder. The hopper corresponds to an example of a resin storage section that stores resin R. The feeder corresponds to an example of a resin supply unit that sends out the resin R received from the hopper. Note that when the resin is in liquid form, the resin supply unit may include a syringe that stores the resin, a piston that pushes out the resin, and a pinch valve that opens and closes the tip of the syringe. When the resin supply section supplies liquid resin, the resin supply section may apply the liquid resin onto the workpiece.

The resin supply unit 40 includes a weight measuring section that measures the weight of the resin R, a resin preheating section that preheats the resin R, a resin guard used as a frame that defines an area in which the resin R is dispersed, and a resin guard that uses vibration to disperse the resin R. The apparatus may further include a vibrating section for causing a vibration, an inspection section for inspecting the degree of dispersion of the resin R, and the like.

The functional member supply unit 50 supplies the functional member H to the second loader hand 71 of the second loader 70 . The functional component supply unit 50 includes a functional component storage section 51 and a functional component delivery section 53. When viewed from above as shown in FIG. 1, the functional member supply unit 50 is connected to the front side of the resin supply unit 40. In other words, the functional member supply unit 50 is arranged on the front side of the resin sealing device 1. Here, the front side of the resin sealing device 1 is the side on which the work supply control panel 19 and the resin molding control panels 29 and 39 are arranged in the front-rear direction. The functional member supply unit 50 is arranged side by side with the workpiece supply control panel 19 and the resin molding control panels 29 and 39 in the left-right direction. The functional member supply unit 50 is disposed on the opposite side to the resin supply section 41 when viewed from a first guide section 60R, which will be described later.

The functional member storage section 51 stores a plurality of functional members H, and sequentially sends out the functional members H. For example, the functional component storage section 51 is equipped with a plurality of functional component magazines and a functional component elevation. A plurality of functional members H are stored in the functional member magazine set in the functional member storage section 51 so as to overlap in the vertical direction. The functional member elevation adjusts the position of the functional member magazine in order to send the functional member H to the functional member delivery section 53.

The functional component delivery section 53 delivers the functional component H received from the functional component storage section 51 to the second loader hand 71 of the second loader 70 . For example, the functional component delivery section 53 has a functional component index that receives and aligns the functional components H sent out by the functional component storage section 51, and a function that delivers the functional components H aligned by the functional component index to the second loader hand 71. Equipped with component pick and place.

Note that the functional component supply unit 50 may further include a volume measuring section that measures the volume of the functional component H, an appearance inspection section that inspects the appearance of the functional component H, a functional component preheating section that preheats the functional component H, and the like. good.

The first loader 60 transports the work W from the work supply unit 10 to the resin molding units 20 and 30. The first loader 60 is configured to be movable along the first guide portion 60R. The first guide portion 60R extends in the left-right direction across the work supply unit 10, the resin molding units 20 and 30, the resin supply unit 40, and the molded product recovery unit 90. When viewed in plan as shown in FIG. 1, the first guide portion 60R is provided, for example, at the rear of the resin sealing molds 21 and 31 and in front of the resin supply portion 41. In the configuration example shown in FIG. 1, the first loader 60 transports the molded product M from the resin molding units 20 and 30 to the molded product recovery unit 90. However, for transporting the molded product M, a molded product recovery loader separate from the first loader 60 may be prepared.

As shown in FIG. 2, the first loader 60 includes a first loader hand 61, a first base 62, and a first guide rod 63.

The first loader hand 61 is configured to be able to advance and retreat from the rear with respect to the resin-sealed mold 21.

As shown in FIG. 2, the first base 62 is connected to the first guide portion 60R so as to be movable in the left-right direction, and movement in the front-back direction is restricted.

As shown in FIG. 2, the first guide rod 63 is connected to the first base 62 and supports the first loader hand 61. The first guide rod 63 is configured to be extendable and retractable in the front-rear direction, and moves the first loader hand 61 in the front-rear direction.

As an example, after the first loader hand 61 receives the workpiece W at the workpiece transfer section 13 , it is conveyed to the right by the first base 62 and moves to the rear of the resin-sealed mold 21 . Next, the first loader hand 61 enters the resin-sealing mold 21 from behind by extending the first guide rod 63 while holding the workpiece W. That is, the first loader hand 61 carries the workpiece W into the resin sealing mold 21 . After the first loader hand 61 delivers the workpiece W to the lower die 22 of the resin-sealed mold 21, it retreats to the rear of the resin-sealed mold 21 due to the contraction of the first guide rod 63. After the molded product M is molded and the resin-sealed mold 21 is opened, the first loader hand 61 carries out the molded product M from the resin-sealed mold 21 by the same operation as when loading the workpiece W. . The first loader hand 61 is then conveyed to the right by the first base 62 and delivers the molded product M at the molded product receiving section 91.

The second loader 70 transports the resin R and the functional member H. The second loader 70 is configured to be movable along the second guide portion 70R. The second guide portion 70R is provided, for example, in the resin supply unit 40 and extends in the front-rear direction. When viewed in plan as shown in FIG. 1, the second guide portion 70R intersects with the first guide portion 60R, for example.

Note that, although the second loader 70 simultaneously transports both the resin R and the functional member H, for example, the invention is not limited to this. One of the resin R and the functional member H may be transported before the other is transported.

As shown in FIG. 2, the second loader 70 includes a second loader hand 71, a second base 72, and a second guide rod 73. The second loader hand 71 transports the resin R and the functional member H to the resin sealing mold 21.

The second loader hand 71 is configured to be able to advance and retreat from the right side with respect to the resin-sealed mold 21. The resin guard 44 provided on the second loader hand 71 is a frame that surrounds the pressing member 75, and functions as a side surface of a tray for the resin R. The second loader hand 71 may include a side rail for holding the functional member H, a chuck claw, a suction mechanism, and the like. Note that the resin guard 44 may be detachable; for example, it may be attached when the resin R is supplied, and may be removed once the resin R is fused by preheating.

As shown in FIG. 2, the second base 72 is connected to the second guide portion 70R so as to be movable in the front-rear direction, and movement in the left-right direction is restricted.

As shown in FIG. 2, the second guide rod 73 is connected to the second base 72 and supports the second loader hand 71. The second guide rod 73 is configured to be extendable, retractable, and pivotable from a point connected to the second base 72 . Thereby, the second guide rod 73 moves the second loader hand 71 in the front-back or left-right direction, and also causes the second loader hand 71 to pivot around the second base 72.

As an example, after the second loader hand 71 receives the resin R at the resin supply section 41, it is transported forward by the second base 72 and moves to a position P1 in front of the resin supply section 41. Next, the second loader hand 71 moves to a position P2 behind the functional member delivery section 53 by the rotation of the second guide rod 73. Next, the second loader hand 71 moves to the functional member delivery section 53 due to the extension of the second guide rod 73. After receiving the functional member H, the second guide rod 73 contracts and returns to the position P2. Next, the second loader hand 71 moves to a position P3 to the right of the resin sealing mold 21 by the rotation of the second guide rod 73. Next, the second loader hand 71 enters the resin sealing mold 21 from the right side by extension of the second guide rod 73 while holding the resin R and the functional member H. That is, the second loader hand 71 carries the resin R and the functional member H into the resin sealing mold 21. After delivering the resin R and the functional member H to the resin sealing mold 21, the second loader hand 71 exits to the right of the resin sealing mold 21 due to the contraction of the second guide rod 73.

Note that, although the second loader hand 71 receives, for example, the resin R and then the functional member H, and carries both of them into the resin sealing mold 21 at the same time, the present invention is not limited thereto. The second loader hand 71 may receive the resin R after receiving the functional member H. Further, the second loader hand 71 may carry one of the resin R and the functional member H into the resin sealing mold 21 and then carry the other into the resin sealing mold 21.

In this way, if the second loader hand 71 can be moved from the resin supply unit 40 to the functional component delivery section 53 by expanding and contracting the second guide rod 73, the second guide section 70R does not need to be extended to the functional component supply unit 50. However, the functional member supply unit 50 can be added.

Note that in the second loader 70, the mechanism for rotating the second guide rod 73 may be omitted. As an example of this case, the second guide section 70R extends in the front-rear direction from the resin supply unit 40 to the functional member supply unit 50, and the second loader hand 71 is connected to the resin supply section 41 by the second base 72. It is only necessary to move between the member delivery section 53 and the member delivery section 53.

The first loader 60 and the second loader 70 operate with respect to the resin sealing mold 31 of the resin molding unit 30 in the same manner as with respect to the resin sealing mold 21 of the resin molding unit 20. Therefore, a description of the operations of the first loader 60 and the second loader 70 with respect to the resin-sealed mold 31 will be omitted. However, the operation of the second loader 70 with respect to the resin-sealed mold 31 is a horizontally reversed operation of the operation of the second loader 70 with respect to the resin-sealed mold 21.

Note that either one of the resin molding unit 20 and the resin molding unit 30 may be omitted. That is, only one resin molding unit may be provided, and one resin supply unit may supply resin to one resin molding unit. Further, three or more resin molding units may be provided. In this case, two or more resin supply units may be provided. For example, two resin molding units and a resin supply unit provided between the two resin molding units and supplying resin to the two resin molding units are considered as one unit group, and the plurality of unit groups are arranged in the left and right direction. may be arranged side by side.

The first loader 60 according to the present embodiment functions as a work loader that carries the workpiece W into the resin-sealed molds 21 and 31, and also functions as a molded product unloader that carries out the molded product M from the resin-sealed molds 21 and 31. However, the functionality of the first loader 60 may be limited to a workload loader. That is, the resin sealing device may further include a third loader as a molded product unloader. Such a third loader may be configured to share a transport path with the first loader, for example, and to be movable along the first guide section. Moreover, the resin sealing device may further include a third guide section for transporting the third loader.

In this embodiment, the workpiece W and the molded product M are transported between units by the first loader 60, but the invention is not limited thereto. For example, the workpiece preheating section and the molded product receiving section may be configured to be movable left and right along the first guide section. Specifically, the workpiece preheating section may transport the workpiece from the workpiece supply unit to the resin molding unit, and deliver the workpiece to a loader provided in the resin molding unit. Alternatively, the molded product receiving section may receive the molded product from the loader in the resin supply unit, and transport the molded product from the resin molding unit to the molded product recovery unit. Such a loader may be provided in each of the plurality of resin molding units when the resin sealing device includes a plurality of resin molding units.

<First embodiment>
3A and 3B are drawings in which the cleaning mechanism CM is in the middle of cleaning the resin guard 44 (hereinafter referred to as "frame FB") in the resin sealing device 1 according to the first embodiment. FIG. 3A is a cross-sectional view schematically showing a frame side wall in the middle of cleaning in the first embodiment of the resin sealing device according to the present invention. FIG. 3B is a cross-sectional view schematically showing the middle of cleaning the upper surface of the frame in the first embodiment of the resin sealing device according to the present invention. The cleaning mechanism CM in the first embodiment includes a first cleaning unit CU1, a second cleaning unit CU2, and a cleaner C.

Cleaning of the frame FB in the first embodiment is performed in a three-step process. In the first step, the brush B provided in the first cleaning unit CU1 contacts the side wall sw of the frame FB and moves up and down, so that the brush B scrapes particles attached to the side wall sw of the frame FB. . In the second step, similarly to the first step, the second cleaning unit CU2 performs an up-and-down operation to scrape off particles attached to the side wall SW of the frame FB. In the third step, the particles rubbed off in the previous two steps are removed from the surface formed by the top surface ts of the frame FB and the top surface tp of the top plates TP of the first and second cleaning units CU1 and CU2. Since the particles are deposited on the surface, the particles are removed by suctioning the surface with Cleaner C.

The first cleaning unit CU1 includes a telescopic member EM, a top plate TP, and a brush B. Details of each first configuration will be described below.

The extensible member EM is, for example, a cylinder, an actuator, or the like that is configured to be extensible and retractable in the vertical direction.

The top plate TP is provided so as to close the through hole th of the frame body FB during the stop time when the first cleaning unit CU1 does not perform an ascending and descending operation, and is attached, for example, to the tip of the expandable member EM. Note that during the stop time of the first cleaning unit CU1, the top surface tp of the top plate TP may be flush with the top surface ts of the frame body FB to close the through hole th.

The brush B is provided so as to come into contact with the side wall sw of the frame body FB during at least a part of the lifting operation period in which the first cleaning unit CU1 moves up and down, and is, for example, bristled on the side surface of the elastic member EM. . Note that the longest end of the brush B from the axis may be larger than the diameter of the through hole th formed in the frame FB. With such a configuration, the brush B comes into contact with the side wall sw of the frame FB during at least a part of the lifting/lowering operation period in which the cleaning unit CU performs the lifting/lowering operation. Note that the side wall sw of the frame body FB may be coated with a non-adhesive coating. Applying a non-adhesive coating to the side wall sw of the frame FB has the advantage of suppressing the adhesion of particles and facilitating the removal of particles during cleaning.

A detailed description of each configuration of the second cleaning unit CU2 will be omitted, but the configuration may be similar to that of the first cleaning unit CU1.

The cleaner C is connected to a dust collector (not shown) that is provided to suck at least particles on the upper surface ts of the frame FB, and that performs air suction or electrostatic suction, for example. Incidentally, scraped particles are accumulated on the surface formed by the upper surface ts of the frame FB and the top surface tp of the top plates TP of the first and second cleaning units CU1 and CU2. Remove by suctioning the surface with Cleaner C. At this time, the cleaner C performs suction while moving relative to the frame FB. Further, a rotating brush (not shown) or the like may be provided at the tip of the cleaner C on the opposite side to the direction of movement, and particles that cannot be suctioned by the cleaner C may be brushed off.

<Second embodiment>
FIG. 4A and FIG. 4B are drawings in the middle of cleaning the frame FB in the resin sealing device 1 according to the second embodiment. FIG. 4A is a cross-sectional view schematically showing the middle of cleaning the side wall of the frame in the second embodiment of the resin sealing device according to the present invention. FIG. 4B is a cross-sectional view schematically showing the middle of cleaning the upper surface of the frame in the second embodiment of the resin sealing device according to the present invention. The second embodiment differs from the first embodiment in that the first and second cleaning units CU10 and CU20 are composed of a top plate TP and an elastic member EM. Note that the material of the top plate TP may be a plastic material with appropriate flexibility since it rubs against the frame FB.

Cleaning of the frame body FB in the second embodiment is also performed in a three-step process. In the first step, the top plate TP provided in the first cleaning unit CU10 comes into contact with the side wall sw of the frame FB and moves up and down, so that the top plate TP removes particles attached to the side wall sw of the frame FB. Scrape it off. In the second step, similarly to the first step, the second cleaning unit CU20 performs an up-and-down operation to scrape off particles attached to the side wall SW of the frame FB. In the third step, the particles rubbed off in the previous two steps are removed from the surface formed by the top surface ts of the frame FB and the top surface tp of the top plate TP of the first and second cleaning units CU10 and CU20. Since the particles are deposited on the surface, the particles are removed by suctioning the surface with Cleaner C.

The first and second cleaning units CU10 and CU20 may be, for example, plungers provided in the lower mold 22 of the resin-filled mold 21. In this way, the plunger provided in the resin sealing device 1 may be used as the first and second cleaning units CU10 and CU20, and the cleaner C may be provided in the vicinity thereof to configure the cleaning mechanism CM.

As described above, in the first embodiment, the cleaning mechanism CM is provided on the conveyance path that carries the resin R from the resin supply unit 40 to the resin-filled mold 21. In comparison, in the second embodiment, the plunger of the resin-filled mold 21 is used as a part of the cleaning mechanism CM, so there is no need to provide a separate cleaning unit. Note that in the second embodiment, a brush may be provided on the side surface of the expandable member EM of the first and second cleaning units CU10 and CU20. In addition, the frame FB is provided with a telescopic member (not shown), and when the frame FB moves up and down with respect to the first and second cleaning units CU10 and CU20, it adheres to the side wall sw of the frame FB. Particles may be rubbed off.

<Third embodiment>
5A and 5B are diagrams showing the frame FB being cleaned by the cleaning mechanism CM in the resin sealing device 1 according to the third embodiment. FIG. 5A is a cross-sectional view schematically showing a frame side wall in the middle of cleaning in a third embodiment of the resin sealing device according to the present invention. FIG. 5B is a cross-sectional view schematically showing a state in the middle of cleaning the bottom surface of the frame in the third embodiment of the resin sealing device according to the present invention. The third embodiment differs from the first embodiment in that the first cleaning unit CU100, the second cleaning unit CU200, and the cleaner C, which constitute the cleaning mechanism CM, are configured upside down.

Also in the third embodiment, cleaning of the frame FB is performed in a three-step process. In the first step, the brush B provided in the first cleaning unit CU100 contacts the side wall sw of the frame FB and performs a descending operation, so that the brush B scrubs particles attached to the side wall sw of the frame FB. Drop it. In the second step, similarly to the first step, the second cleaning unit CU200 performs a descending operation to scrape off particles attached to the side wall SW of the frame FB. In the third step, particles that may fly up or otherwise adhere to the bottom surface bs of the frame FB and the bottom surface bs formed by the top plates TP of the first and second cleaning units CU100 and CU200 in the previous two steps are removed. are removed by suction with Cleaner C. Further, in the first and second steps, when the particles on the side wall sw of the frame body FB are rubbed off without flying up or the like due to the vertical movement of the first and second cleaning units CU100 and CU200, The top plate TP or the cleaner C may be omitted from the cleaning mechanism CM.

Although the configuration of the cleaning mechanism CM in the first embodiment, the second embodiment, and the third embodiment has been described above, the configuration of the cleaning mechanism CM is not limited thereto. Further, the resin sealing device 1 may be provided with a separate cleaning device (not shown) that sucks the surface of the frame FB opposite to the surface to be cleaned. The suction by the cleaning device may be performed on the transport path of the resin R before cleaning using the cleaning mechanism CM.

FIG. 6 is a flowchart illustrating a method for cleaning the frame (hereinafter referred to as "main cleaning method") in the resin sealing device 1 according to one exemplary embodiment. As shown in FIG. 6, this cleaning method includes a lifting and lowering operation step S10 of the first cleaning units CU1, CU10, and CU100, a lifting and lowering operation step S20 of the second cleaning units CU2, CU20, and CU200, and a lifting and lowering operation step S20 of the first cleaning units CU1, CU10, and CU100. This includes a step S30 of suctioning with cleaner C. Note that the main surface of the frame FB in this cleaning method refers to the surface on which suction is performed by the cleaner C, that is, the top surface ts of the frame FB in the first and second embodiments, and the bottom surface of the frame FB in the third embodiment. Points to bs.

(Step S10: Lifting and lowering operation of the first cleaning unit)
In step S10, the first cleaning units CU1, CU10, and CU100 perform an elevating operation from the starting state. As the first cleaning units CU1, CU10, and CU100 move up and down, particles on the side wall SW of the frame body FB corresponding to the first cleaning units CU1, CU10, and CU100 are scraped off. Note that the starting state means that the first and second cleaning units CU1, CU10, CU100, CU2, CU20, and CU200 are stopped with their corresponding through holes th blocked, and the cleaner C is also stopped at a predetermined position. It is in a state of being.

(Step S20: Lifting and lowering operation of the second cleaning unit)
In step S20, the second cleaning units CU2, CU20, and CU200 perform an elevating operation. As the second cleaning units CU2, CU20, and CU200 move up and down, particles on the side wall sw of the frame body FB corresponding to the second cleaning units CU2, CU20, and CU200 are scraped off.

(Step S30: Suction the main surface of the frame with a cleaner)
In step S30, the cleaner C performs suction on the main surface (top surface ts or bottom surface bs) of the frame FB. The first and second cleaning units CU1, CU10, CU100, CU2, CU20, and CU200 are in a stopped state, blocking their corresponding through holes th. The particles scraped off from the side wall sw of the frame body FB in step S10 and step S20 are removed from the top surface ts of the frame body FB and the top plate TP of the first and second cleaning units CU1, CU10, CU100, CU2, CU20, and CU200. The particles are deposited on the surface formed by the top surface tp of the particles, and the particles are removed by suctioning the cleaner C while moving relative to this surface.

Step S10, step S20, and step S30 may be repeatedly performed. The number of times step S10, step S20, and step S30 are repeated may be set arbitrarily. For example, step S10, step S20, and step S30 are considered as one cycle, and it is determined whether the number of cycles has reached a preset number of repetitions, and step S10, step S20, and step S30 are repeated until the number of repetitions is reached. good. Note that the number of repetitions may be set based on the amount of particles remaining on the side wall sw of the frame body FB.

In step S10 and step S20, the lifting and lowering operation periods of the first and second cleaning units CU1, CU10, CU100, CU2, CU20, and CU200 may have periods that at least partially overlap. That is, for example, while the first cleaning units CU1, CU10, and CU100 are descending, the second cleaning units CU2, CU20, and CU200 may begin to ascend. As another example, the first and second cleaning units CU1, CU10, CU100, CU2, CU20, and CU200 may move up and down at the same time. By performing such lifting and lowering operations of the first and second cleaning units CU1, CU10, CU100, CU2, CU20, and CU200, the cleaning time in this cleaning method can be shortened.

In step S10 and step S20, the lifting and lowering operation periods of the first and second cleaning units CU1, CU10, CU100, CU2, CU20, and CU200 do not need to overlap. That is, for example, the first cleaning units CU1, CU10, and CU100 finish their lifting and lowering operations, close the corresponding through holes th, and stop, and after a predetermined period, the second cleaning units CU2, CU20, and CU200 begin to rise. good. By raising and lowering the first and second cleaning units CU1, CU10, CU100, CU2, CU20, and CU200 in this way, particles that have been rubbed off due to the raising and lowering of one cleaning unit are transferred to the other cleaning unit. It is possible to prevent the liquid from spilling out of the corresponding through hole th.

In step S20 and step S30, the up-and-down operation period of the second cleaning units CU2, CU20, and CU200 and the suction period of the cleaner C may have a period that at least partially overlaps. That is, for example, the cleaner C may start moving while the second cleaning units CU2, CU20, and CU200 are descending. By performing such lifting and lowering operations of the second cleaning units CU2, CU20, and CU200 and suction of the cleaner C, the cleaning time in this cleaning method can be shortened.

<Other examples of this embodiment>
In the first to third embodiments, an example is described in which the frame body FB has two holes th, and two corresponding cleaning units are provided, but the number of holes is not limited to two, and may be one or more. Bye. Furthermore, in the first to third embodiments, a cleaning unit was provided for each of the two holes th of the frame body FB, but one cleaning unit may be moved laterally to clean a plurality of holes th. good. That is, after the cleaning unit moves up and down to one hole th among the plurality of holes th of the frame body FB and the cleaner C performs suction, the cleaning unit is moved laterally and moves to another hole th. On the other hand, the cleaning unit may move up and down to perform suction by the cleaner C.

The embodiments described above are intended to facilitate understanding of the present invention, and are not intended to be interpreted as limiting the present invention. Each element included in the embodiment, as well as its arrangement, material, conditions, shape, size, etc., are not limited to those illustrated, and can be changed as appropriate. Further, it is possible to partially replace or combine the structures shown in different embodiments.

1...Resin sealing device 10...Work supply unit 20, 30...Resin molding unit 40...Resin supply unit 44...Resin guard (frame FB)
50... Functional component supply unit 60... First loader 70... Second loader 80... Resin heater 90... Molded product recovery unit W... Work P... Electronic component S... Base material R... Resin H... Functional member CM... Cleaning mechanism CU1, CU10, CU100...First cleaning unit CU2, CU20, CU200...Second cleaning unit C...Cleaner EM...Extensible member TP...Top plate B...Brush tp...Top surface ts...Top surface sw...Side wall bs...Bottom surface th...Th...Through hole

Claims (9)

A resin sealing device for resin-sealing electronic components of a work including a base material and electronic components,
a frame body provided with a through hole for regulating the spread of the resin;
a cleaning unit that cleans a side wall of the frame surrounding the through hole as it moves up and down;
a cleaner that sucks the first surface of the frame;
Equipped with
Resin sealing equipment. The resin sealing device according to claim 1, wherein the cleaning unit is provided with a brush, and the side wall of the frame is cleaned as the cleaning unit moves up and down. The resin sealing device according to claim 2, wherein the longest end of the brush from the axis is larger than the diameter of the through hole. The resin sealing device according to claim 1, wherein a non-adhesive coating is applied to a side wall of the frame. The resin sealing device according to claim 1, wherein the lifting and lowering operation of the cleaning unit is repeated multiple times. The resin sealing device according to claim 1, further comprising a cleaning device that sucks a second surface opposite to the first surface of the frame, and the cleaning device is provided on a conveyance path of the frame. The resin sealing device according to claim 1, wherein the cleaning unit is provided with a top plate, and the cleaner sucks the first surface of the frame while the through hole is blocked by the top plate. . The frame body is provided with a plurality of the through holes,
Any one of claims 1 to 7, wherein a plurality of the cleaning units are provided corresponding to each of the plurality of through holes, and the lifting and lowering operation periods of the plurality of cleaning units at least partially overlap. The resin sealing device according to item 1. A resin sealing method for resin sealing electronic components of a workpiece including a base material and electronic components, the resin sealing apparatus comprising a frame, a cleaning unit, and a cleaner,
With respect to the frame provided with a through hole for regulating the spread of the resin,
a step in which the cleaning unit cleans a side wall of the frame surrounding the through hole as it moves up and down;
suctioning the first surface of the frame with the cleaner;
A resin sealing method having

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