CN116913801A - Resin sealing device and resin sealing method - Google Patents
Resin sealing device and resin sealing method Download PDFInfo
- Publication number
- CN116913801A CN116913801A CN202310011787.0A CN202310011787A CN116913801A CN 116913801 A CN116913801 A CN 116913801A CN 202310011787 A CN202310011787 A CN 202310011787A CN 116913801 A CN116913801 A CN 116913801A
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- China
- Prior art keywords
- resin sealing
- resin
- workpiece
- loader hand
- loader
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 title claims abstract description 387
- 229920005989 resin Polymers 0.000 title claims abstract description 387
- 238000007789 sealing Methods 0.000 title claims abstract description 247
- 238000000034 method Methods 0.000 title claims abstract description 39
- 238000000465 moulding Methods 0.000 claims abstract description 64
- 238000004140 cleaning Methods 0.000 claims abstract description 30
- 239000000428 dust Substances 0.000 claims abstract description 21
- 238000000748 compression moulding Methods 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 12
- 230000005855 radiation Effects 0.000 claims description 3
- 238000007664 blowing Methods 0.000 claims description 2
- 239000002245 particle Substances 0.000 description 14
- 238000010586 diagram Methods 0.000 description 11
- 238000011084 recovery Methods 0.000 description 11
- 238000003860 storage Methods 0.000 description 11
- 230000008602 contraction Effects 0.000 description 8
- 230000000149 penetrating effect Effects 0.000 description 5
- -1 polytetrafluoroethylene Polymers 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 239000005033 polyvinylidene chloride Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000004812 Fluorinated ethylene propylene Substances 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229920009441 perflouroethylene propylene Polymers 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 238000011027 product recovery Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The present invention relates to a resin sealing apparatus and a resin sealing method. The resin sealing apparatus of the present invention includes a resin molding unit for resin-sealing an electronic component of a work by compression molding, the resin molding unit and the resin molding unit including: a resin sealing mold including an upper mold and a lower mold; and a cleaner section including a dust collection port provided on a conveyance path of the loader hand that conveys the workpiece to the resin sealing mold, the cleaner section performing a cleaning operation on at least one of the loader hand and the workpiece that moves on the conveyance path when the loader hand moves on the conveyance path for supplying the workpiece to the resin sealing mold and when the loader hand moves on the conveyance path for removing the molded workpiece from the resin sealing mold.
Description
Technical Field
The present invention relates to a resin sealing apparatus and a resin sealing method.
Background
A resin sealing apparatus for resin sealing an electronic component mounted on a substrate is known. In such a resin sealing apparatus, contamination by particles (dust such as resin powder or foreign matter) may occur in the apparatus, and there is a case where the reliability of a molded article for resin sealing an electronic component is affected. In order to prevent such contamination by particles, for example, patent document 1 discloses a resin molding apparatus comprising: a pressing part including a molding die for clamping the workpiece and molding resin for resin sealing; and a cleaning device for cleaning the back surface of the workpiece conveyed to the pressing part.
[ Prior Art literature ]
[ patent literature ]
[ patent document 1] Japanese patent laid-open No. 2021-178411
Disclosure of Invention
[ problem to be solved by the invention ]
Particles may adhere not only to the back surface of the workpiece but also to the surface of the workpiece, a loader hand for transporting the workpiece, and the like. In addition, particles may adhere to the work before resin sealing, and may adhere to the work in the state of a molded article of the resin-sealed work.
The present invention has been made in view of such circumstances, and an object of the present invention is to provide a resin sealing apparatus and a resin sealing method capable of suppressing adhesion of particles and improving the quality of a resin-sealed molded article.
[ means of solving the problems ]
The resin sealing apparatus of an embodiment of the present invention, which resin seals an electronic component of a work including a base material and the electronic component, includes a resin molding unit that resin seals the electronic component of the work by compression molding, the resin molding unit including: a resin sealing mold including an upper mold and a lower mold; and a cleaner section including a dust collection port provided on a conveyance path of a loader hand that conveys the workpiece to the resin sealing mold, the cleaner section performing a cleaning operation on at least one of the loader hand and the workpiece that move on the conveyance path when the loader hand moves on the conveyance path for supplying the workpiece to the resin sealing mold and when the loader hand moves on the conveyance path for removing the molded workpiece from the resin sealing mold.
According to the above aspect, the cleaning operation is performed on at least one of the loader hand and the workpiece when the loader hand moves on the conveyance path to supply the workpiece to the resin sealing mold and when the loader hand moves on the conveyance path to remove the workpiece from the resin sealing mold. Therefore, the particles can be effectively prevented from adhering to the workpiece or the loader hand, and the quality of the molded product can be improved.
A resin sealing method of another embodiment of the present invention is a resin sealing method of resin sealing an electronic component including a base material and a work of the electronic component, including: feeding the work piece to the resin sealing mold by a loader handle; resin sealing the electronic component by using a resin sealing mold; and removing the resin-sealed formed workpiece from the resin sealing mold by a loader hand, the resin sealing method further comprising: the cleaning operation is performed on the loader hand or the workpiece that moves on the conveyance path when the loader hand moves on the conveyance path to supply the workpiece to the resin sealing mold and when the loader hand moves on the conveyance path to remove the molded workpiece from the resin sealing mold.
According to the above aspect, the cleaning operation is performed on at least one of the loader hand and the workpiece when the loader hand moves on the conveyance path to supply the workpiece to the resin sealing mold and when the loader hand moves on the conveyance path to remove the workpiece from the resin sealing mold. Therefore, the particles can be effectively prevented from adhering to the workpiece or the loader hand, and the quality of the molded product can be improved.
[ Effect of the invention ]
According to the present invention, the adhesion of particles can be suppressed, and the quality of a molded article sealed with a resin can be improved.
Drawings
Fig. 1 is a plan view of a resin sealing apparatus according to an embodiment of the present invention.
Fig. 2 is a partially enlarged view of the resin sealing apparatus of fig. 1.
Fig. 3 is a cross-sectional view of the resin sealing mold of fig. 1.
Fig. 4 is a cross-sectional view of the cleaner section of fig. 1.
Fig. 5 is a flowchart showing a resin sealing method according to an embodiment of the present invention.
Fig. 6 is a diagram for explaining a resin sealing method according to an embodiment of the present invention.
Fig. 7 is a diagram for explaining a resin sealing method according to an embodiment of the present invention.
Fig. 8 is a diagram for explaining a resin sealing method according to an embodiment of the present invention.
Fig. 9 is a diagram for explaining a resin sealing method according to an embodiment of the present invention.
Fig. 10 is a diagram for explaining a resin sealing method according to an embodiment of the present invention.
Fig. 11 is a diagram for explaining a resin sealing method according to an embodiment of the present invention.
Fig. 12 is a diagram for explaining a resin sealing method according to an embodiment of the present invention.
Fig. 13 is a diagram for explaining a resin sealing method according to an embodiment of the present invention.
Fig. 14 is a diagram for explaining a resin sealing method according to an embodiment of the present invention.
[ description of symbols ]
1: resin sealing device
10: workpiece supply unit
11: workpiece storage part
13: workpiece conveying part
15: workpiece preheating part
19: workpiece supply control panel
20. 30: resin molding unit
21. 31, 121: resin sealing mould
22. 123: lower die
22a, 123a: lower plate
22b, 122b: die cavity wedge
22c, 122c: positioning piece
22d, 122d: energizing member
22e, 22f, 22g, 23c, 122e, 122f, 122g, 123c: suction hole
23. 122: upper die
23a, 122a: upper plate
23b, 123b: die cavity plate
25. 35, 125: mold cavity
26. 36: cleaner part
26a: lower cleaner
26b: upper cleaner
27. 37: membrane processor
29. 39: resin molding control panel
40: resin supply unit
41: resin supply part
44: resin protective cover
50: functional component supply unit
51: functional component housing part
53: functional component conveying part
60: first loader
60R: first guide part
61: first loader hand grip
62: first base
63: first guide rod
70: second loader
70R: second guide part
71: second loader hand grip
72: second base
73: second guide rod
78: holding tool
80: resin heater
90: molded article recovery unit
91: molded article receiving section
93: molded article conveying section
95: molded article storage section
262a, 262b: brush with brush body
264a, 264b: dust collecting port
266a, 266b: an opening part
F: film and method for producing the same
H: functional component
M: molded article
P: electronic assembly
P1, P2, P3: position of
R: resin composition
S: substrate material
W: workpiece
Detailed Description
Hereinafter, embodiments of the present application will be described with reference to the drawings. The drawings of the embodiments are illustrative, and the sizes and shapes of the parts are schematic, and the technical scope of the present application is not limited to the embodiments.
First embodiment
< resin sealing device >)
The structure of the resin sealing apparatus 1 according to the embodiment of the present invention will be described with reference to fig. 1 to 4. Fig. 1 is a plan view of a resin sealing apparatus according to the present embodiment. Fig. 2 is an enlarged view of a part of the resin sealing apparatus, fig. 3 is a cross-sectional view of the resin sealing mold, and fig. 4 is a cross-sectional view of the cleaner section. In fig. 1 to 4, the positional relationship of the members is indicated for convenience by making clear the relationship between the drawings.
The resin sealing apparatus 1 is a manufacturing apparatus for manufacturing a molded article M by providing a resin on a work W. The workpiece W includes a substrate S and an electronic component P. The resin R is molded on the work W, and the electronic component P of the work W is sealed with the resin, whereby the molded article M can be manufactured. Here, the workpiece W has a surface on which the electronic component P is mounted (hereinafter referred to as "the surface of the workpiece W") and a surface opposite to the surface (hereinafter referred to as "the back surface of the workpiece W"). The back surface of the workpiece W is a surface on which the electronic component P is not mounted. In the following description, the upper and lower relationship between the front surface and the rear surface of the work W may be appropriately reversed according to the structure of the resin sealing mold. Hereinafter, for convenience of explanation, the resin-sealed work W may be referred to as a molded article M. The base material S is, for example, an interposer substrate, a lead frame, a carrier plate with an adhesive sheet, or a semiconductor substrate. The electronic component P is, for example, a semiconductor device such as an integrated circuit (integrated circuit, IC) chip, but not limited thereto, and may be various active or passive devices, a microelectromechanical system (Micro Electro Mechanical System, MEMS) device, or the like. The resin R is, for example, a granular thermosetting resin. The form of the resin R is not limited to the above, and may be liquid or powder. In the present embodiment, the resin R is molded into the workpiece W and the functional member H as an example. The functional member H is, for example, a plate-like member. The functional member H is provided so as to be exposed to the side opposite to the side on which the base material S of the molded article M is exposed. The functional member H functions as, for example, a heat radiation member that radiates heat generated by the electronic component P or a shielding member that shields electromagnetic waves. Further, the functional member H may be a sheet resin.
The resin sealing apparatus 1 of the present embodiment is a compression (compression molding) type resin sealing apparatus. As shown in fig. 1, the resin sealing apparatus 1 includes a work supply unit 10, a resin molding unit 20, a resin molding unit 30, a resin supply unit 40, a functional member supply unit 50, a first loader 60, a second loader 70, and a molded article recovery unit 90. The first loader 60 is a loader that conveys the workpiece W, and is configured to be movable along the first guide 60R. The second loader 70 is a loader that conveys the resin R and the functional member H, and is configured to be movable along the second guide portion 70R.
The planar layout of the resin sealing apparatus 1 is not particularly limited, and in the example shown in fig. 1, the work supply unit 10, the resin molding unit 20, the resin supply unit 40, the resin molding unit 30, and the molded article recovery unit 90 are arranged in order along the first guide portion 60R from left to right in fig. 1. The resin supply portion 41 is disposed on the rear side and the functional member supply unit 50 is disposed on the front side with reference to the first guide portion 60R. The functional member supply units 50 and the resin supply units 40 are arranged in order along the second guide portion 70R from the front to the rear in fig. 1. The work supply unit 10 and the resin molding unit 20 are disposed on the left side and the resin molding unit 30 and the molded article recovery unit 90 are disposed on the right side with reference to the second guide portion 70R.
The workpiece supply unit 10 supplies the workpiece W to the first loader hand 61 of the first loader 60. The workpiece supply unit 10 includes a workpiece storage section 11, a workpiece conveying section 13, a workpiece preheating section 15, and a workpiece supply control panel 19. For example, the work supply control panel 19 may be provided with a display unit for displaying control parameters of each of the molded product recovery unit 90, the resin supply unit 40, the functional member supply unit 50, the first loader 60, and the second loader 70, and an input unit for inputting the control parameters.
The workpiece housing portion 11 houses a plurality of workpieces W and sequentially feeds out the workpieces W. For example, the work storage 11 includes a plurality of work libraries and work lifters. A plurality of workpieces W are stored in a workpiece magazine provided in the workpiece storage unit 11 so as to overlap in the vertical direction. The workpiece lifter adjusts the position of the workpiece magazine so as to send out the workpiece W to the workpiece conveying section 13.
The workpiece conveying section 13 delivers the workpiece W received from the workpiece housing section 11 to the workpiece preheating section 15. For example, the work conveying section 13 includes a work indexing section that receives and aligns the work W sent out by the work housing section 11, and a work pick-and-place section that delivers the work W aligned by the work indexing section to the work preheating section 15.
The workpiece preheating section 15 preheats the workpiece W received from the workpiece conveying section 13 and delivers it to the first loader hand 61 of the first loader 60. By preheating the work W before being conveyed to the resin molding units 20, 30, deformation of the work W due to abrupt temperature change inside the resin sealing molds 21, 31 can be suppressed. For example, the workpiece preheating section 15 includes a preheating rail that heats the workpiece W from the end. Or the workpiece preheating section 15 may include a hot plate that heats the entire surface of the workpiece W. Further, the work preheating section 15 may be omitted and the work W may not be preheated. In this case, after the work W is transferred to the resin molding unit 20 or the resin molding unit 30, the time until the resin R and the functional member H are initially transferred to the resin molding unit 20 or the resin molding unit 30 or the mold closing is started may be controlled.
The work supply control panel 19 controls the operation of the work supply unit 10. As shown in fig. 1, the work supply control panel 19 is arranged in front of the work supply unit 10 in a plan view. For example, the work supply control panel 19 includes a display portion that displays control parameters of the work supply unit 10, and an input portion that inputs control parameters of the work supply unit 10.
The work supply unit 10 may further include a volume measuring unit that measures the volume of the work W, an appearance checking unit that checks the appearance of the work W, and the like.
The molded article recovery unit 90 recovers the molded article M from the first loader hand 61 of the first loader 60. The molded article recovery unit 90 includes a molded article receiving portion 91, a molded article conveying portion 93, and a molded article accommodating portion 95. In the example shown in fig. 1, the molded article recovery unit 90 is disposed on the opposite side of the work supply unit 10 with respect to the resin molding unit 20 and the resin molding unit 30 in the left-right direction. As a modification, the molded article recovery unit 90 may be disposed on the same side of the work supply unit 10 as the resin molding units 20, 30 in the left-right direction.
The molded article receiving portion 91 delivers the molded article M received from the first loader hand 61 of the first loader 60 to the molded article conveying portion 93. For example, the molded article receiving portion 91 includes a cooling bracket that cools the molded article M. Further, the work W may be not cooled without providing the cooling bracket.
The molded article conveying section 93 delivers the molded article M received from the molded article receiving section 91 to the molded article accommodating section 95. For example, the molded article conveying section 93 includes a molded article index section for receiving and aligning the molded articles M sent from the molded article receiving section 91, and a molded article pickup section for delivering the molded articles M aligned with the molded article index section to the molded article accommodating section 95.
The molded article storage section 95 receives and stores the molded article M. For example, the molded article storage section 95 includes a plurality of molded article storage sections and molded article lifters. A plurality of molded articles M are stored in a molded article storage provided in the molded article storage 95 so as to overlap in the vertical direction. The molded article lifter adjusts the position of the molded article magazine in order to receive the molded articles M from the molded article conveying section 93.
The molded article recovery unit 90 may further include a volume measuring unit for measuring the volume of the molded article M, an appearance checking unit for checking the appearance of the molded article M, and the like.
The resin molding unit 20 molds the resin R to the work W and the functional member H. The resin molding unit 20 includes a resin sealing mold 21, a cleaner section 26, a film processor 27, and a resin molding control panel 29.
As shown in fig. 3, the resin sealing mold 21 includes a pair of openable and closable lower and upper molds 22 and 23 that are molded while filling the resin R in an inner cavity 25. In the example shown in fig. 3, the resin sealing mold 21 is a compression molding mold of a so-called lower cavity movable structure. Specifically, the surface of the upper die 23 facing the lower die 22 is flat, and a cavity 25 is formed in the surface of the lower die 22 facing the upper die 23. The cavity 25 is a recess (an example of a cavity recess) that opens toward the upper die 23.
The lower die 22 includes a lower plate 22a, a cavity wedge 22b, a retainer 22c, and an energizing member 22d. The cavity wedge 22b is fixed to and assembled with the upper surface (surface on the upper die 23 side) of the lower plate 22 a. The positioning member 22c is configured in a frame shape so as to surround the cavity wedge member 22 b. The positioning piece 22c is assembled via the energizing member 22d so as to be movable up and down with respect to the lower plate 22 a. The cavity wedge 22b forms a bottom surface portion of the cavity 25, and the positioning member 22c forms a side surface portion of the cavity 25. The lower die 22 is provided with a suction hole 22e, a suction hole 22f, and a suction hole 22g penetrating the retainer 22c, the lower plate 22a, and the cavity wedge 22 b. The suction hole 22e is opened at the upper surface of the positioning member 22 c. The suction hole 22f opens on the inner side surface of the positioning piece 22c facing the cavity wedge piece 22 b. A sealing member (not shown) is inserted under the suction hole 22 f. The suction hole 22g opens on the upper surface of the cavity wedge 22b, i.e., the bottom surface of the cavity 25. The suction holes 22e, 22F, 22g are suction holes for sucking the film F placed on the lower die 22.
The upper mold 23 includes an upper plate 23a and a cavity plate 23b. The cavity plate 23b is fixed to and assembled with the lower surface (surface on the lower die 22 side) of the upper plate 23 a. The upper die 23 is provided with a suction hole 23c penetrating the upper plate 23a and the cavity plate 23b. The suction hole 23c opens at the lower surface of the cavity plate 23b. The suction hole 23c is a suction hole for sucking the workpiece W placed on the upper die 23.
The cleaner section 26 cleans at least one of the workpiece W and the first loader hand 61. Further, the cleaner section 26 will be described in detail below.
The film processor 27 supplies the film F to the resin sealing mold 21. The film F is a release film for blocking the resin R from entering the gap in the lower die 22 forming the recess of the cavity 25 and making the molded article M easily peeled from the lower die 22. The film processor 27 processes, for example, a film in a roll form, and includes a roll-out section for supplying an unused film F and a roll-up section for recovering the used film F. As shown in fig. 1, the winding-out portion and the winding-up portion of the film processor 27 are arranged in the left-right direction of the resin sealing mold 21. As the material of the film F, a polymer material excellent in heat resistance, peeling easiness, flexibility, and stretchability can be used, and examples thereof include: polytetrafluoroethylene (PTFE), polytetrafluoroethylene-ethylene copolymer (ethylene-tetrafluoroethylene copolymer, ETFE), tetrafluoroethylene-hexafluoropropylene copolymer (fluorinated ethylene propylene, FEP), polyethylene terephthalate (polyethylene terephthalate, PET), polypropylene (PP), polyvinylidene fluoride (polyvinylidene chloride, PVDC), and the like. The thickness of the film F can be appropriately selected depending on the physical properties of the material, and is, for example, about 50 μm. The shape of the film F is not limited to a roll shape, and may be a long shape.
The resin molding control panel 29 controls the operation of the resin molding unit 20. As shown in fig. 1, the resin molding control panel 29 is disposed in front of the resin molding unit 20 in a plan view. For example, the resin molding control panel 29 includes a display unit for displaying control parameters of the resin molding unit 20, and an input unit for inputting control parameters of the resin molding unit 20.
The resin molding unit 30 includes a resin sealing mold 31, a cleaner section 26, a film processor 37, and a resin molding control panel 39. In the following description, details of the resin sealing mold 31, the cleaner section 36, the film processor 37, and the resin molding control panel 39 are omitted, and the same configurations as those described for the resin molding unit 20 can be applied.
The resin molding control panel 29 and the resin molding control panel 39 may collect at least part of the functions thereof on the work supply control panel 19. For example, the control parameters of the resin molding units 20 and 30 may be displayed on the display portion of the work supply control panel 19, and the control parameters of the resin molding units 20 and 30 may be input to the input portion of the work supply control panel 19. In the case where the functions of the control panels of the respective units are all integrated in the work supply control panel 19, the resin molding control panel 29 and the resin molding control panel 39 may be omitted.
The functional component supply unit 50 includes a functional component housing portion 51 and a functional component conveying portion 53.
The functional component housing unit 51 houses a plurality of functional components H and sequentially feeds out the functional components H. For example, the functional component housing unit 51 includes a plurality of functional component libraries and a functional component lifter. A plurality of functional members H are stored in the functional member library provided in the functional member storage unit 51 so as to overlap in the up-down direction. The function member elevator adjusts the position of the function member magazine so as to send the function member H to the function member conveying unit 53.
The functional component conveying portion 53 delivers the functional component H received from the functional component housing portion 51 to the holding tool 78. For example, the functional component conveying portion 53 receives and aligns the functional component H sent out from the functional component housing portion 51, and delivers it to the holding tool 78. At this time, the functional member H may be picked up by a gripping function provided to the holding tool 78.
The functional member supply unit 50 further includes a volume measuring section for measuring the volume of the functional member H, an appearance checking section for checking the appearance of the functional member H, a functional member preheating section for preheating the functional member H, and the like.
The resin supply unit 40 supplies the granular resin R onto the functional member H. The resin supply unit 40 includes a resin supply portion 41 and a resin heater 80.
The resin supply portion 41 supplies the resin R to the functional member H held by the holding tool 78. The resin supply unit 41 includes a hopper (not shown) and a feeder (not shown). In addition, in the case where the resin is in a liquid state, the resin supply portion may include a syringe storing the resin, a plunger extruding the resin, and a pinch valve opening and closing the tip of the syringe.
The resin heater 80 heats the functional member H and the resin R supplied to the functional member H. As a heat source of the resin heater 80, for example, a known heating mechanism such as an electrothermal wire heater or an infrared heater can be used. Further, the resin heater 80 may not be included.
In the resin supply unit 40, a resin boot 44 described below is preferably disposed inside the holding tool 78. The resin boot 44 is formed in a frame shape along the outer shape of the functional member H, and can be used as a frame body for defining a region where the resin R is dispersed. The resin boot 44 is attached to the holding tool 78 before the resin R is supplied, for example, and detached from the holding tool 78 after the resin R is heated.
The resin supply unit 40 may further include a weight measuring unit for measuring the weight of the resin R, an excitation unit for dispersing the resin R by vibration, an inspection unit for inspecting the degree of dispersion of the resin R, and the like.
The first loader 60 conveys the work W from the work supply unit 10 to the resin molding unit 20 and the resin molding unit 30. The first loader 60 is configured to be movable along the first guide 60R. The first guide 60R extends in the left-right direction on the work supply unit 10, the resin molding unit 20, the resin molding unit 30, the resin supply unit 40, and the molded article recovery unit 90. As shown in fig. 1, the first guide portion 60R is provided, for example, in front of the resin supply portion 41 and behind the resin sealing mold 21 and the resin sealing mold 31 in a plan view. In the configuration example shown in fig. 1, the first loader 60 conveys the molded article M from the resin molding unit 20, 30 to the molded article recovery unit 90.
As shown in fig. 2, the first loader 60 includes a first loader hand 61, a first base 62, and a first guide bar 63.
The first loader hand 61 is configured to be capable of being moved back and forth with respect to the resin sealing mold 21. In other words, the first loader hand 61 has a conveying path for the work W or the molded article M (an example of the work) at the rear side of the resin sealing mold 21. The first loader hand 61 holds the workpiece W or the formed article M. The first loader hand 61 includes, for example, an L-shaped opening/closing claw that supports the lower surface of the workpiece W or the molded article M, but is not limited thereto. The first loader hand 61 may suck the workpiece W or the molded article M by electrostatic force, or may suck the workpiece W or the molded article M by suction and exhaust.
As shown in fig. 2, the first base 62 is connected to be movable in the left-right direction with respect to the first guide portion 60R.
As shown in fig. 2, a first guide bar 63 is connected to the first base 62, supporting the first loader hand 61. The first guide rod 63 is configured to be extendable in the front-rear direction, and moves the first loader hand 61 in the front-rear direction.
As an example, the first loader hand 61 receives the workpiece W by the workpiece transfer section 13, then transfers the workpiece W rightward by the first base 62, and moves the workpiece W to a position facing the resin sealing mold 21 in the front-rear direction. Next, the first loader hand 61 directly enters the resin sealing mold 21 from the rear by the extension of the first guide bar 63 in a state where the work W is held. That is, the first loader hand 61 carries the work W into the resin sealing mold 21. After the first loader hand 61 delivers the work W to the upper die 23 of the resin sealing die 21, the work W moves rearward of the resin sealing die 21 by contraction of the first guide rod 63. After the molded article M is molded and the resin sealing mold 21 is opened, the first loader hand 61 removes the molded article M from the resin sealing mold 21 by the same operation as when the workpiece W is carried in. Then, the first loader hand 61 conveys the molded article to the right by the first base 62, and delivers the molded article M to the molded article receiving portion 91.
The second loader 70 conveys the resin R and the functional member H. The second loader 70 is configured to be movable along the second guide portion 70R. The second guide portion 70R is provided in the resin supply unit 40, for example, and extends in the front-rear direction. As shown in fig. 1, the second guide portion 70R intersects with the first guide portion 60R, for example, in a plan view.
As shown in fig. 2, the second loader 70 includes a second loader hand 71, a second base 72, and a second guide bar 73.
As shown in fig. 2, the second base 72 is configured to be movable in the front-rear direction with respect to the second guide portion 70R, but is not limited to the movement in the front-rear direction, and may be configured to be movable in the left-right direction.
As shown in fig. 2, a second guide bar 73 is connected to the second base 72, supporting the second loader hand 71. The second guide bar 73 is configured to be extendable and pivotable from a portion connected to the second base 72. Thus, the second guide bar 73 moves the second loader hand 71 in the front-rear or left-right direction, and rotates the second loader hand 71 around the second base 72.
As an example, the second loader hand 71 conveys the holding tool 78 to the functional component conveying section 53. After the functional component H is received by the functional component conveying section 53 by the holding tool 78, the second loader hand 71 is conveyed to the rear by the second base 72, and the functional component H is conveyed to the position P2 behind the functional component conveying section 53 via the holding tool 78. Then, the second loader hand 71 is moved to a position P1 in front of the resin supply portion 41 by the rotation of the second guide bar 73. Then, the second loader hand 71 is moved to the resin supply portion 41 by the extension of the second guide bar 73. At the resin supply portion 41, the second loader hand 71 opens the holding tool 78. A resin boot 44 is provided on the inside of the opened holding tool 78. Then, after the resin R is received on the functional member H and inside the resin boot 44, the functional member H and the resin R are heated, and after the heating, the resin boot 44 is detached. Thereafter, the second loader hand 71 picks up the holding tool 78 again, and returns to the position P1 by contraction of the second guide bar 73. Next, the second loader hand 71 is moved to the right position P3 of the resin sealing mold 21 by the rotation of the second guide bar 73. Next, the second loader hand 71 enters the resin sealing mold 21 from the right by the extension of the second guide bar 73 in a state where the resin R and the functional member H are held by the holding tool 78. That is, the second loader hand 71 carries the resin R and the functional member H into the resin sealing mold 21 via the holding tool 78. After the resin R and the functional member H are delivered to the resin sealing mold 21, the second loader hand 71 moves to the right of the resin sealing mold 21 by contraction of the second guide bar 73.
As described above, as long as the second loader hand 71 can be moved from the resin supply unit 40 to the functional component conveying portion 53 by the extension and contraction of the second guide bar 73, the functional component supply unit 50 may be added without extending the second guide portion 70R to the functional component supply unit 50.
The first loader 60 and the second loader 70 are operated in the same manner as in the case of the resin sealing mold 21 of the resin molding unit 20 with respect to the resin sealing mold 31 of the resin molding unit 30. Therefore, the operation of the first loader 60 and the second loader 70 with respect to the resin sealing mold 31 will be omitted. However, the operation of the second loader 70 on the resin sealing mold 31 is reversed from the operation of the second loader 70 on the resin sealing mold 21.
Next, a conveying path when the first loader hand 61 supplies the work to the resin sealing mold 21 will be described. The first loader hand 61 receives the workpiece W by the workpiece preheating section 15. Thereafter, the first loader 60 moves rightward along the first guide portion 60R with the workpiece W held by the first loader hand 61, and conveys the workpiece W to the rear of the resin sealing mold 21. Thereafter, as shown in fig. 2, the first loader hand 61 and the work W are conveyed to the resin sealing mold 21 by the expansion and contraction of the first guide rod 63, and the work W is placed on the resin sealing mold 21 by the first loader hand 61. After the resin sealing mold 21 is resin-sealed, the work W is withdrawn from the resin sealing mold 21 by the expansion and contraction of the first guide rod 63 in a state held by the first loader hand 61.
On the other hand, a description will be given of a conveying path when the first loader hand 61 takes out a workpiece from the resin sealing mold 21. As shown in fig. 2, the first loader hand 61 is conveyed to the resin sealing mold 21 by the expansion and contraction of the first guide bar 63, and the workpiece W is withdrawn from the resin sealing mold 21 by the expansion and contraction of the first guide bar 63 in a state where the workpiece W is held by the first loader hand 61. Thereafter, the first loader 60 moves in the rightward direction along the first guide portion 60R in a state where the first loader hand 61 holds the workpiece W, and conveys the workpiece W to the formed article receiving portion 91. The same applies to the conveyance path for supplying or taking out the work W, and the resin sealing mold 31.
In the example shown in fig. 1 and 2, the conveyance path of the first loader 60 is located at the rear side of the resin sealing mold 21 and the resin sealing mold 31, and the cleaner unit 26 is disposed at the rear side of the resin sealing mold 21. The cleaner section 26 may be attached to the rear side of the resin sealing mold 21, or may be provided separately from the resin sealing mold 21. In order to supply the work W to the resin sealing mold 21, the cleaning operation of the cleaner section 26 is performed at the time of at least one of the process of entering and the process of exiting the first loader hand 61 into and from the resin sealing mold 21. In order to remove the work W from the resin sealing mold 21, the cleaning operation is performed at the time of at least one of the process of entering and the process of exiting the first loader hand 61 into and from the resin sealing mold 21. As shown in fig. 3, the cleaner section 26 includes a lower cleaner 26a provided on the lower die 22 side, and an upper cleaner 26b provided on the upper die 23 side.
As shown in fig. 4, the lower cleaner 26a includes a brush 262a and a dust collection port 264a. By including such a structure, the attached matter scraped off from the work W or the first loader hand 61 by the brush 262a can be recovered through the dust collection port 264a. The dust collection port 264a includes a plurality of openings 266a that open upward in the lower cleaner 26a, and a brush 262a is provided in a region between the openings 266 a. As shown in fig. 1, the lower cleaner 26a has a width larger than the width of at least one of the workpiece W and the first loader hand 61 (the width in the left-right direction in the example shown in fig. 1). Thus, the work W or the first loader hand 61 can be cleaned in its full width by passing through the lower cleaner 26a in the front-rear direction. The upper cleaner 26b includes a brush 262b and a dust collection port 264b, similar to the lower cleaner 26a, and these and opening portions 266b are configured as described above with respect to the lower cleaner 26 a.
As described above, according to the resin sealing apparatus described in the present embodiment, the cleaner section 26 is provided on the conveying path for conveying the workpiece to the loader hand in the resin sealing mold, and when the workpiece W is supplied to the resin sealing mold 21 by the first loader hand 61, particles adhering to the workpiece W and the first loader hand 61 can be sucked and removed. When the molded article M is taken out of the resin sealing mold 21 by the first loader hand 61, particles adhering to the lower surface of the molded article M and the first loader hand 61 can be removed by suction. As a result, the quality of the molded article can be improved.
< method of resin sealing >)
Next, a resin sealing method will be described with reference to fig. 5 to 14. Fig. 5 is a flowchart showing an example of a resin sealing method using the resin sealing apparatus according to the present embodiment. Fig. 6 to 10 are diagrams for explaining the resin sealing method according to the present embodiment. In the following description, a method of using a resin sealing apparatus having a cavity in a lower mold will be described. Here, the resin sealing mold 21 of the resin molding unit 20 is exemplified, and the explanation of the resin sealing mold 31 of the resin molding unit 30 operating in the same manner is omitted.
First, the first loader hand 61 holds the workpiece W (S10).
Specifically, the workpiece W received from the workpiece conveying section 13 of fig. 1 is preheated by the workpiece preheating section 15 and held by the first loader hand 61 of the first loader 60. The first loader hand 61 is moved to the resin forming unit 20 in a state of holding the work W. Before and after the above step, the film F is moved to the cavity 25 provided on the lower die 22 side. After moving the film F, the film F is sucked through the suction hole 22g and is set in the cavity 25.
Next, when the first loader hand 61 enters the resin sealing mold 21 and the resin sealing mold 31, the first loader hand 61 and the work W are cleaned (S20).
Specifically, as shown in fig. 6, the first loader hand 61 is cleaned by the cleaner section 26 provided at the rear of the resin sealing mold 21 before entering the resin sealing mold 21 in a state where the work W is held. The cleaner section 26 includes a lower cleaner 26a provided on the lower die 22 side and an upper cleaner 26b provided on the upper die 23 side. The lower cleaner 26a cleans the lower surface of the first loader hand 61, and the upper cleaner 26b cleans the back surface of the workpiece W. After cleaning, the first loader hand 61 enters the resin sealing mold 21, and transfers the work W to the upper mold 23.
Next, when the first loader hand 61 is withdrawn from the resin sealing mold 21 or the resin sealing mold 31, the first loader hand 61 is cleaned (S30).
Specifically, as shown in fig. 7, after the workpiece W is transferred to the upper die 23, the first loader hand 61 is cleaned by the cleaner portion 26 during the withdrawal from the resin sealing die 21. At this time, the lower cleaner 26a cleans the lower surface of the first loader hand 61. Also, the upper surface of the first loader hand 61 is simultaneously cleaned by the upper cleaner 26b.
Thereafter, the electronic component P is resin-sealed by the resin sealing mold 21 and the resin sealing mold 31 (S40).
Specifically, as shown in fig. 8, the resin sealing mold 21 is locked, and the resin R is pressurized and heated by the lower mold 22 and the upper mold 23. And (5) opening the die after hardening the resin R.
Next, when the first loader hand 61 enters the resin sealing mold 21 and the resin sealing mold 31, the first loader hand 61 is cleaned (S50).
Specifically, after the resin sealing, the first loader hand 61 enters the resin sealing mold 21 again in order to collect the molded article M. At this time, as shown in fig. 9, the first loader hand 61 is cleaned by the cleaner section 26 while entering the resin sealing mold 21. Specifically, the lower cleaner 26a cleans the lower surface of the first loader hand 61. Also, the upper surface of the first loader hand 61 is simultaneously cleaned by the upper cleaner 26 b. After cleaning, the first loader hand 61 enters the resin sealing mold 21 to collect the work W.
Next, when the first loader hand 61 is withdrawn from the resin sealing mold 21 or the resin sealing mold 31, the first loader hand 61 and the workpiece W are cleaned (S60).
Specifically, as shown in fig. 10, after receiving the workpiece W, the first loader hand 61 is cleaned by the cleaner section 26 while being withdrawn from the resin sealing mold 21. At this time, the lower cleaner 26a cleans the lower surface of the first loader hand 61, and the upper cleaner 26b cleans the back surface of the workpiece W.
As described above, according to the resin sealing method described in the present embodiment, the cleaner section 26 is provided on the conveying path of the first loader hand 61 that conveys the work W to the resin sealing mold 21, and particles adhering to the work W and the first loader hand 61 can be removed by suction when the work W is supplied to the resin sealing mold 21 by the first loader hand 61. When the molded article M is taken out of the resin sealing mold 21 by the first loader hand 61, particles adhering to the lower surface of the molded article M and the first loader hand 61 can be removed by suction. As a result, the quality of the molded article can be improved.
Second embodiment
< resin sealing device >)
Next, the structure of the resin sealing mold 121 according to the second embodiment will be described with reference to fig. 11 to 14. Fig. 11 is a cross-sectional view schematically showing the structure of a resin sealing mold 121 according to the second embodiment.
In the present embodiment, unlike the first embodiment, a cavity 125 is provided on the upper die 122 side. The resin sealing mold 21 is a pair of openable and closable molds formed by filling the resin R into the cavity 125 inside. The resin sealing mold 121 includes an upper mold 122 and a lower mold 123. The lower die 123 has a flat surface on the side facing the upper die 122, and the upper die 122 has a cavity 125 on the side facing the lower die 123. That is, the resin sealing mold 121 is a compression molding mold of a so-called upper cavity movable structure. The cavity 125 is a recess opening toward the lower die 123, and corresponds to an example of the "cavity recess" of the present invention.
Upper die 122 includes upper plate 122a, cavity wedge 122b, retainer 122c, and energizing member 122d. The cavity wedge 122b is fixed to and assembled with the lower surface (surface on the lower die 123 side) of the upper plate 122 a. The positioning piece 122c is configured in a frame shape so as to surround the cavity wedge 122 b. The positioning piece 122c is assembled via the energizing member 122d so as to be movable up and down with respect to the upper plate 122 a. The cavity wedge 122b forms a bottom surface portion of the cavity 125, and the positioning piece 122c forms a side surface portion of the cavity 125. The lower die 123 is provided with a suction hole 122e, a suction hole 122f penetrating the positioning member 122c, and a suction hole 122g penetrating the upper plate 122a and the cavity wedge 122 b. The suction hole 122e is opened at the lower surface of the positioning piece 122 c. The suction hole 122f opens on the inner side surface of the positioning piece 122c facing the cavity wedge 122 b. A sealing member (not shown) is inserted under the suction hole 122 f. The suction hole 122g opens on the upper surface of the cavity wedge 122b, i.e., the bottom surface of the cavity 125. The suction holes 122e, 122F, 122g are suction holes for sucking the film F placed on the upper die 122.
The lower die 123 includes a lower plate 123a and a cavity plate 123b. The cavity plate 123b is fixed to and assembled with the upper surface (surface on the upper die 122 side) of the lower plate 123 a. The lower die 123 is provided with a suction hole 123c penetrating the lower plate 123a and the cavity plate 123b. The suction hole 123c opens at the lower surface of the cavity plate 123b. The suction hole 123c is a suction hole for sucking the workpiece W placed on the lower die 123.
By using such a resin sealing mold, compression molding of an upper cavity movable structure having a cavity 125 on the upper mold 122 side can be performed. Further, the cleaner unit 26 cleans the first loader hand on the conveyance path, thereby improving the molding quality.
< method of resin sealing >)
Next, a resin sealing method using the resin sealing mold 121 according to the second embodiment will be described with reference to fig. 11 to 14. Fig. 11 to 14 are diagrams for explaining the resin sealing method according to the present embodiment. In the following description, a method of using the resin sealing apparatus having the cavity in the upper mold will be described. The resin sealing mold 121 of the present embodiment has a cavity 125 in the upper mold 122. Therefore, unlike the first embodiment in which the workpiece W is placed on the upper die 23, the workpiece W is placed on the lower die 123 in the present embodiment.
As shown in fig. 11, the first loader hand 61 is cleaned by the cleaner section 26 provided on the conveyance path of the first loader hand 61 that conveys the work W to the resin sealing mold 21 while entering the resin sealing mold 21 in a state of holding the work W.
As shown in fig. 12, after the workpiece W is transferred, the first loader hand 61 is cleaned by the cleaner section 26 while being withdrawn from the resin sealing mold 121.
After the resin sealing, the first loader hand 61 enters the resin sealing mold 121 again for recovering the molded article M. At this time, as shown in fig. 13, the first loader hand 61 is cleaned by the cleaner section 26 while entering the resin sealing mold 121.
As shown in fig. 14, after the workpiece W is transferred, the first loader hand 61 is cleaned by the cleaner section 26 while being withdrawn from the resin sealing mold 121.
Modification example
A modification different from the above embodiment will be described.
Either one of the resin molding unit 20 and the resin molding unit 30 may be omitted. That is, the following structure is possible: only one resin forming unit is provided, and one resin supply unit supplies resin to one resin forming unit. Further, three or more resin molding units may be provided. In this case, two or more resin supply units may be provided. For example, two resin molding units and a resin supply unit provided between the two resin molding units and supplying resin to the two resin molding units may be provided as one unit group, and a plurality of unit groups may be arranged in the left-right direction.
The first loader 60 of the above embodiment functions as a workpiece loader for carrying the workpiece W into the resin sealing mold 21 and the resin sealing mold 31 and also functions as a molded article unloader for carrying the molded article M out of the resin sealing mold 21 and the resin sealing mold 31, but the function of the first loader 60 may be limited to the workpiece loader. That is, the resin sealing apparatus may further include a third loader as a molded article unloader. Such a third loader may be configured to be movable along the first guide portion, for example, by sharing a conveyance path with the first loader. Further, the resin sealing apparatus may further include a third guide portion for conveying the third loader.
The arrangement of the cleaner section 26 is not limited to the above embodiment, and for example, either one of the lower cleaner 26a and the upper cleaner 26b may be used. The cleaner section 26 may be provided in the front-rear, left-right direction of the resin sealing mold 21 as appropriate according to the conveying path of the work W and the first loader hand 61.
In the above embodiment, the lower cleaner 26a and the upper cleaner 26b have been described as having the same structure as shown in fig. 4, but the structures may be changed to each other in accordance with the object to be cleaned. For example, in the case where the lower cleaner 26a cleans the lower surface of the first loader hand grip, a form suitable for cleaning of the flat portion may be used.
As shown in fig. 2 and 3, the cleaner section 26 of the embodiment is configured such that the width in the left-right direction is equal to the width of the first loader hand 61 and such that the width in the front-rear direction is smaller than the width of the first loader hand 61, but the configuration is not limited thereto. For example, the cleaner section 26 may be configured such that the width in the front-rear direction is also equal to that of the first loader hand 61. Further, the cleaner section 26 may be formed to have a large area in the front-rear-left-right direction so as to cover the entire first loader hand 61. The dust collection port 264a set to a predetermined size by these modes can be efficiently cleaned. Further, the cleaner unit 26 may be movable to be further closer to the object, and suction may be performed only during cleaning, and suction may be stopped when cleaning is not required.
The dust collection port 264a of the above embodiment has a plurality of openings 266a provided on the upper surface of the lower cleaner 26a, but is not limited thereto. For example, the opening of the dust collection port may be one. The arrangement, shape and size of the opening of the dust collecting port can be appropriately set. The brush 262a of the present embodiment may be appropriately arranged and number of the openings 266 a. Further, these structures are also applicable to the upper cleaner 26b as well.
In the above embodiment, the cleaner unit 26 is configured to be reciprocated once when the first loader hand 61 enters and exits the resin sealing mold 21, but may be reciprocated a plurality of times so as to overlap with the upper or lower part of the cleaner unit 26.
In the above embodiment, the lower cleaner 26a and the upper cleaner 26b have the same configuration as shown in fig. 4, but may have different configurations depending on the object to be cleaned. For example, the lower cleaner 26a may have a structure in which the density of the brush 262a is higher than that of the upper cleaner 26b, the suction force of the dust collection port 264a is high, the cleaner area is large, and the like. In the lower cavity structure of fig. 4, the resin R is placed on the lower die 22 side. It is therefore considered that the resin R adheres to the first loader hand 61 when the first loader hand 61 is withdrawn from the resin sealing mold 21. In this case, by using the structure of the modification, efficient cleaning of the first loader hand 61 in the lower cavity configuration is achieved.
As described above, the resin sealing apparatus 1 of an embodiment of the present invention is a resin sealing apparatus for resin-sealing an electronic component of a work including a base material and the electronic component, and includes a resin molding unit that resin-seals the electronic component of the work by compression molding, the resin molding unit including: a resin sealing mold including an upper mold and a lower mold; and a cleaner section including a dust collection port provided on a conveyance path of a loader hand that conveys the workpiece to the resin sealing mold, the cleaner section performing a cleaning operation on at least one of the loader hand and the workpiece that move on the conveyance path when the loader hand moves on the conveyance path for supplying the workpiece to the resin sealing mold and when the loader hand moves on the conveyance path for removing the molded workpiece from the resin sealing mold.
This allows at least one of the loader hand and the workpiece to be cleaned during conveyance, and prevents particles from adhering to the workpiece before resin sealing and the molded article after resin sealing. Thus, the quality of the resin-sealed molded article can be improved.
In this aspect, the cleaner section performs a cleaning operation for at least one of the loader hand and the workpiece that move on the conveyance path when the loader hand enters the resin sealing mold in order to supply the workpiece to the resin sealing mold.
In this aspect, the cleaner section performs a cleaning operation on the loader hand moving on the conveyance path when the loader hand is withdrawn from the resin sealing mold in order to supply the work to the resin sealing mold.
In this aspect, the cleaner section performs a cleaning operation on the loader hand moving on the conveyance path when the loader hand enters the resin sealing mold in order to remove the work from the resin sealing mold.
In this aspect, the cleaner section performs a cleaning operation on at least one of the loader hand and the workpiece that move on the conveyance path when the loader hand is withdrawn from the resin sealing mold in order to remove the workpiece from the resin sealing mold.
In the above-described aspect, the dust collection port of the cleaner unit is provided above the conveyance path of the loader hand, and the cleaner unit cleans the upper side of at least one of the loader hand and the workpiece.
In the above-described aspect, the dust collection port of the cleaner unit is provided below the conveyance path of the loader hand, and the cleaner unit cleans the underside of at least one of the loader hand and the workpiece.
In the above-described aspect, dust collection ports of the cleaner section are provided above and below the conveyance path of the loader hand, respectively, and the cleaner section cleans the upper side and the lower side of at least one of the loader hand and the workpiece, respectively.
In this aspect, the cleaner section performs a cleaning operation for at least one of the loader hand and the workpiece that move back and forth on the conveyance path.
In this aspect, the cleaner section further includes a brush capable of contacting at least one of the loader hand and the workpiece, or a blowing section that blows compressed air or ion air, or a radiation section that radiates ultrasonic waves.
In this aspect, the upper die includes a cavity recess opening toward the lower die.
In this aspect, the lower die includes a cavity recess opening toward the upper die.
A resin sealing method of another embodiment of the present invention is a resin sealing method of resin sealing an electronic component including a base material and a work of the electronic component, including: feeding the work piece to the resin sealing mold by a loader handle; resin sealing the electronic component by using a resin sealing mold; and removing the resin-sealed formed workpiece from the resin sealing mold by a loader hand, the resin sealing method further comprising: the cleaning operation is performed on the loader hand or the workpiece that moves on the conveyance path when the loader hand moves on the conveyance path to supply the workpiece to the resin sealing mold and when the loader hand moves on the conveyance path to remove the molded workpiece from the resin sealing mold.
This allows at least one of the loader hand and the workpiece to be cleaned during conveyance, and prevents particles from adhering to the workpiece before resin sealing and the molded article after resin sealing. Thus, the quality of the resin-sealed molded article can be improved.
The embodiments described above are for facilitating understanding of the present invention, and are not intended to limit the present invention. The elements included in the embodiments, their arrangement, materials, conditions, shapes, sizes, and the like are not limited to those exemplified, and may be appropriately modified. Moreover, the structures shown in the different embodiments may be partially substituted or combined with each other.
Claims (13)
1. A resin sealing apparatus for resin sealing an electronic component including a base material and a work of the electronic component,
the resin sealing apparatus includes a resin molding unit that resin-seals the electronic component of the work by compression molding,
the resin molding unit includes:
a resin sealing mold including an upper mold and a lower mold; and
a cleaner section including a dust collection port and provided on a conveyance path of a loader hand for conveying the work to the resin sealing mold,
The cleaner unit performs a cleaning operation on at least one of the loader hand and the workpiece that move on the conveyance path when the loader hand moves on the conveyance path to supply the workpiece to the resin sealing mold and when the loader hand moves on the conveyance path to remove the molded workpiece from the resin sealing mold.
2. The resin sealing apparatus according to claim 1, wherein
The cleaner unit performs a cleaning operation on at least one of the loader hand and the workpiece that moves on the conveyance path when the loader hand enters the resin sealing mold in order to supply the workpiece to the resin sealing mold.
3. The resin sealing apparatus according to claim 1, wherein
The cleaner unit performs a cleaning operation on the loader hand moving on the conveyance path when the loader hand is withdrawn from the resin sealing mold in order to supply the work to the resin sealing mold.
4. The resin sealing apparatus according to claim 1, wherein
The cleaner unit performs a cleaning operation on the loader hand moving on the conveyance path when the loader hand enters the resin sealing mold in order to remove the work from the resin sealing mold.
5. The resin sealing apparatus according to claim 1, wherein
The cleaner unit performs a cleaning operation on at least one of the loader hand and the workpiece that move on the conveyance path when the loader hand is withdrawn from the resin sealing mold in order to remove the workpiece from the resin sealing mold.
6. The resin sealing apparatus according to claim 1, wherein
The dust collection port of the cleaner part is arranged above the conveying path of the loader hand grip,
the cleaner section cleans an upper side of at least one of the loader hand and the workpiece.
7. The resin sealing apparatus according to claim 1, wherein
The dust collection port of the cleaner part is arranged below the conveying path of the loader hand grip,
the cleaner section cleans an underside of at least one of the loader hand and the workpiece.
8. The resin sealing apparatus according to claim 1, wherein
The dust collection ports of the cleaner part are respectively arranged above and below the conveying path of the loader hand grip,
the cleaner section cleans an upper side and a lower side of at least one of the loader hand and the workpiece, respectively.
9. The resin sealing apparatus according to claim 1, wherein
The cleaner section performs a cleaning operation on at least one of the loader hand and the workpiece that reciprocate on the conveyance path.
10. The resin sealing apparatus according to claim 1, wherein
The cleaner section further includes: a brush capable of contacting at least one of the loader handle and the workpiece; or a blowing part that blows compressed air or ion air; or a radiation part for radiating ultrasonic waves.
11. The resin sealing apparatus according to any one of claims 1 to 10, wherein
The upper die includes a die cavity recess that opens toward the lower die.
12. The resin sealing apparatus according to any one of claims 1 to 10, wherein
The lower die includes a die cavity recess that opens toward the upper die.
13. A resin sealing method of resin sealing an electronic component including a base material and a work of the electronic component, the resin sealing method comprising:
feeding the work piece to a resin sealing mold by a loader handle;
resin sealing the electronic component with the resin sealing mold; and
Removing the resin-sealed formed workpiece from the resin sealing mold by a loader hand grip,
the resin sealing method further includes: and a cleaning unit configured to perform a cleaning operation on the loader hand or the workpiece that moves on the conveyance path when the loader hand moves on the conveyance path to supply the workpiece to the resin sealing mold and when the loader hand moves on the conveyance path to remove the molded workpiece from the resin sealing mold.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022-067508 | 2022-04-15 | ||
| JP2022067508A JP2023157539A (en) | 2022-04-15 | 2022-04-15 | Resin sealing device and resin sealing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116913801A true CN116913801A (en) | 2023-10-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310011787.0A Pending CN116913801A (en) | 2022-04-15 | 2023-01-05 | Resin sealing device and resin sealing method |
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| Country | Link |
|---|---|
| JP (1) | JP2023157539A (en) |
| CN (1) | CN116913801A (en) |
| TW (1) | TWI826230B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG143180A1 (en) * | 2006-11-22 | 2008-06-27 | Apic Yamada Corporaton | Resin molding machine and method of resin molding |
| JP7284514B2 (en) * | 2020-05-11 | 2023-05-31 | アピックヤマダ株式会社 | RESIN MOLDING DEVICE AND CLEANING METHOD |
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- 2023-01-05 CN CN202310011787.0A patent/CN116913801A/en active Pending
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| TWI826230B (en) | 2023-12-11 |
| TW202343593A (en) | 2023-11-01 |
| JP2023157539A (en) | 2023-10-26 |
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