TW202340366A - 底部填充材料、半導體封裝和半導體封裝的製造方法 - Google Patents

底部填充材料、半導體封裝和半導體封裝的製造方法 Download PDF

Info

Publication number
TW202340366A
TW202340366A TW112107122A TW112107122A TW202340366A TW 202340366 A TW202340366 A TW 202340366A TW 112107122 A TW112107122 A TW 112107122A TW 112107122 A TW112107122 A TW 112107122A TW 202340366 A TW202340366 A TW 202340366A
Authority
TW
Taiwan
Prior art keywords
underfill material
inorganic particles
epoxy resin
particles
substrate
Prior art date
Application number
TW112107122A
Other languages
English (en)
Chinese (zh)
Inventor
増田智也
佐藤亮太
鈴木真由
Original Assignee
日商力森諾科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商力森諾科股份有限公司 filed Critical 日商力森諾科股份有限公司
Publication of TW202340366A publication Critical patent/TW202340366A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW112107122A 2022-02-28 2023-02-24 底部填充材料、半導體封裝和半導體封裝的製造方法 TW202340366A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
WOPCT/JP2022/008375 2022-02-28
PCT/JP2022/008375 WO2023162252A1 (ja) 2022-02-28 2022-02-28 アンダーフィル材、半導体パッケージ及び半導体パッケージの製造方法

Publications (1)

Publication Number Publication Date
TW202340366A true TW202340366A (zh) 2023-10-16

Family

ID=87765289

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112107122A TW202340366A (zh) 2022-02-28 2023-02-24 底部填充材料、半導體封裝和半導體封裝的製造方法

Country Status (6)

Country Link
US (1) US20250140732A1 (https=)
JP (1) JPWO2023162252A1 (https=)
KR (1) KR20240157015A (https=)
CN (1) CN118525369A (https=)
TW (1) TW202340366A (https=)
WO (1) WO2023162252A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4605864B2 (ja) * 2000-07-25 2011-01-05 宇部日東化成株式会社 真球状シリカ粒子集合体の製造方法
JP3818267B2 (ja) 2003-02-25 2006-09-06 松下電工株式会社 アンダーフィル用樹脂組成物及び半導体装置
JP5116152B2 (ja) * 2008-03-17 2013-01-09 信越化学工業株式会社 半導体装置製造用の樹脂組成物
JP2012036240A (ja) * 2010-08-04 2012-02-23 Three M Innovative Properties Co 封止用樹脂組成物
JP5874327B2 (ja) * 2011-11-07 2016-03-02 住友ベークライト株式会社 封止用エポキシ樹脂組成物、及び、これを用いた電子機器の製造方法
US9613942B2 (en) * 2015-06-08 2017-04-04 Qualcomm Incorporated Interposer for a package-on-package structure
JP6822651B2 (ja) * 2016-09-16 2021-01-27 ナミックス株式会社 シリカフィラーの表面処理方法、それにより得られたシリカフィラー、および、該シリカフィラーを含有する樹脂組成物
CN114585684A (zh) * 2019-10-24 2022-06-03 松下知识产权经营株式会社 密封用树脂组合物及半导体装置
JP2021174939A (ja) * 2020-04-28 2021-11-01 昭和電工マテリアルズ株式会社 アンダーフィル用樹脂組成物及びその製造方法、半導体装置の製造方法、並びに半導体装置

Also Published As

Publication number Publication date
KR20240157015A (ko) 2024-10-31
US20250140732A1 (en) 2025-05-01
JPWO2023162252A1 (https=) 2023-08-31
CN118525369A (zh) 2024-08-20
WO2023162252A1 (ja) 2023-08-31

Similar Documents

Publication Publication Date Title
US20120172495A1 (en) Underfill for high density interconnect flip chips
US20120184646A1 (en) Semiconductor-encapsulating liquid epoxy resin composition and semiconductor device
KR20170008210A (ko) 액상 봉지재, 그것을 사용한 전자부품
WO2019146617A1 (ja) 封止用樹脂組成物
JP6512699B2 (ja) 半導体封止用一液性エポキシ樹脂組成物、硬化物、半導体部品の製造方法及び半導体部品
JP2020070347A (ja) アンダーフィル用樹脂組成物並びに電子部品装置及びその製造方法
TWI794372B (zh) 樹脂組成物、半導體封裝材料、一液型接著劑及接著薄膜
JP2016135888A (ja) 液状エポキシ樹脂組成物及び電子部品装置
JPWO2018198992A1 (ja) 液状封止樹脂組成物、電子部品装置及び電子部品装置の製造方法
JP2020066697A (ja) 液状樹脂組成物並びに電子部品装置及びその製造方法
WO2012144355A1 (ja) 液状封止樹脂組成物、液状封止樹脂組成物を用いた半導体装置、および半導体装置の製造方法
JP7000698B2 (ja) アンダーフィル用樹脂組成物、半導体装置の製造方法及び半導体装置
JP2009057575A (ja) 液状エポキシ樹脂組成物及び電子部品装置
TW202340366A (zh) 底部填充材料、半導體封裝和半導體封裝的製造方法
JP5708666B2 (ja) 液状エポキシ樹脂組成物及び電子部品装置
WO2012111652A1 (ja) 液状封止樹脂組成物および液状封止樹脂組成物を用いた半導体装置
JPWO2005080502A1 (ja) アンダーフィル用液状エポキシ樹脂組成物および同組成物を用いて封止した半導体装置
JP2016040393A (ja) 液状エポキシ樹脂組成物及び電子部品装置
WO2018181603A1 (ja) 液状エポキシ樹脂組成物、半導体装置及び半導体装置の製造方法
JP5924443B2 (ja) 液状エポキシ樹脂組成物及び電子部品装置
JP5929977B2 (ja) 液状エポキシ樹脂組成物及び電子部品装置
TW202413526A (zh) 環氧樹脂組成物
JPH01294765A (ja) エポキシ樹脂組成物
CN103221481B (zh) 液态树脂组合物
JP5804479B2 (ja) 樹脂封止型半導体装置の製造方法及び樹脂封止型半導体装置