JPWO2023162252A1 - - Google Patents
Info
- Publication number
- JPWO2023162252A1 JPWO2023162252A1 JP2024502768A JP2024502768A JPWO2023162252A1 JP WO2023162252 A1 JPWO2023162252 A1 JP WO2023162252A1 JP 2024502768 A JP2024502768 A JP 2024502768A JP 2024502768 A JP2024502768 A JP 2024502768A JP WO2023162252 A1 JPWO2023162252 A1 JP WO2023162252A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/69—Insulating materials thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
- H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
- H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07331—Connecting techniques
- H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
- H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/321—Structures or relative sizes of die-attach connectors
- H10W72/325—Die-attach connectors having a filler embedded in a matrix
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/351—Materials of die-attach connectors
- H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/351—Materials of die-attach connectors
- H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
- H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/008375 WO2023162252A1 (ja) | 2022-02-28 | 2022-02-28 | アンダーフィル材、半導体パッケージ及び半導体パッケージの製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023162252A1 true JPWO2023162252A1 (https=) | 2023-08-31 |
Family
ID=87765289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024502768A Pending JPWO2023162252A1 (https=) | 2022-02-28 | 2022-02-28 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20250140732A1 (https=) |
| JP (1) | JPWO2023162252A1 (https=) |
| KR (1) | KR20240157015A (https=) |
| CN (1) | CN118525369A (https=) |
| TW (1) | TW202340366A (https=) |
| WO (1) | WO2023162252A1 (https=) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002037620A (ja) * | 2000-07-25 | 2002-02-06 | Ube Nitto Kasei Co Ltd | 真球状シリカ粒子集合体、その製造方法およびそれを用いた樹脂組成物 |
| JP2009221363A (ja) * | 2008-03-17 | 2009-10-01 | Shin Etsu Chem Co Ltd | 半導体装置製造用の樹脂組成物 |
| JP2012036240A (ja) * | 2010-08-04 | 2012-02-23 | Three M Innovative Properties Co | 封止用樹脂組成物 |
| JP2013095911A (ja) * | 2011-11-07 | 2013-05-20 | Sumitomo Bakelite Co Ltd | 封止用エポキシ樹脂組成物、これを用いた電子機器の製造方法、及び、その電子機器 |
| JP2018044116A (ja) * | 2016-09-16 | 2018-03-22 | ナミックス株式会社 | シリカフィラーの表面処理方法、それにより得られたシリカフィラー、および、該シリカフィラーを含有する樹脂組成物 |
| JP2018518057A (ja) * | 2015-06-08 | 2018-07-05 | クアルコム，インコーポレイテッド | パッケージオンパッケージ構造体用のインターポーザ |
| WO2021079677A1 (ja) * | 2019-10-24 | 2021-04-29 | パナソニックＩｐマネジメント株式会社 | 封止用樹脂組成物、及び半導体装置 |
| JP2021174939A (ja) * | 2020-04-28 | 2021-11-01 | 昭和電工マテリアルズ株式会社 | アンダーフィル用樹脂組成物及びその製造方法、半導体装置の製造方法、並びに半導体装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3818267B2 (ja) | 2003-02-25 | 2006-09-06 | 松下電工株式会社 | アンダーフィル用樹脂組成物及び半導体装置 |
-
2022
- 2022-02-28 CN CN202280087914.9A patent/CN118525369A/zh active Pending
- 2022-02-28 WO PCT/JP2022/008375 patent/WO2023162252A1/ja not_active Ceased
- 2022-02-28 US US18/837,603 patent/US20250140732A1/en active Pending
- 2022-02-28 KR KR1020247023575A patent/KR20240157015A/ko active Pending
- 2022-02-28 JP JP2024502768A patent/JPWO2023162252A1/ja active Pending
-
2023
- 2023-02-24 TW TW112107122A patent/TW202340366A/zh unknown
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002037620A (ja) * | 2000-07-25 | 2002-02-06 | Ube Nitto Kasei Co Ltd | 真球状シリカ粒子集合体、その製造方法およびそれを用いた樹脂組成物 |
| JP2009221363A (ja) * | 2008-03-17 | 2009-10-01 | Shin Etsu Chem Co Ltd | 半導体装置製造用の樹脂組成物 |
| JP2012036240A (ja) * | 2010-08-04 | 2012-02-23 | Three M Innovative Properties Co | 封止用樹脂組成物 |
| JP2013095911A (ja) * | 2011-11-07 | 2013-05-20 | Sumitomo Bakelite Co Ltd | 封止用エポキシ樹脂組成物、これを用いた電子機器の製造方法、及び、その電子機器 |
| JP2018518057A (ja) * | 2015-06-08 | 2018-07-05 | クアルコム，インコーポレイテッド | パッケージオンパッケージ構造体用のインターポーザ |
| JP2018044116A (ja) * | 2016-09-16 | 2018-03-22 | ナミックス株式会社 | シリカフィラーの表面処理方法、それにより得られたシリカフィラー、および、該シリカフィラーを含有する樹脂組成物 |
| WO2021079677A1 (ja) * | 2019-10-24 | 2021-04-29 | パナソニックＩｐマネジメント株式会社 | 封止用樹脂組成物、及び半導体装置 |
| JP2021174939A (ja) * | 2020-04-28 | 2021-11-01 | 昭和電工マテリアルズ株式会社 | アンダーフィル用樹脂組成物及びその製造方法、半導体装置の製造方法、並びに半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20240157015A (ko) | 2024-10-31 |
| US20250140732A1 (en) | 2025-05-01 |
| CN118525369A (zh) | 2024-08-20 |
| TW202340366A (zh) | 2023-10-16 |
| WO2023162252A1 (ja) | 2023-08-31 |
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