TW202332876A - 蒸氣腔、電子機器及蒸氣腔之製造方法 - Google Patents

蒸氣腔、電子機器及蒸氣腔之製造方法 Download PDF

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Publication number
TW202332876A
TW202332876A TW111137362A TW111137362A TW202332876A TW 202332876 A TW202332876 A TW 202332876A TW 111137362 A TW111137362 A TW 111137362A TW 111137362 A TW111137362 A TW 111137362A TW 202332876 A TW202332876 A TW 202332876A
Authority
TW
Taiwan
Prior art keywords
sheet
flow path
area
mentioned
vapor
Prior art date
Application number
TW111137362A
Other languages
English (en)
Chinese (zh)
Inventor
高橋伸一郎
武田利彦
太田貴之
小田和範
山木誠
木浦伸哉
寺内崇之
高橋直大
小鶴洋次
Original Assignee
日商大日本印刷股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商大日本印刷股份有限公司 filed Critical 日商大日本印刷股份有限公司
Publication of TW202332876A publication Critical patent/TW202332876A/zh

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336Heat pipes, e.g. wicks or capillary pumps
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/70Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Reciprocating Pumps (AREA)
TW111137362A 2021-09-30 2022-09-30 蒸氣腔、電子機器及蒸氣腔之製造方法 TW202332876A (zh)

Applications Claiming Priority (14)

Application Number Priority Date Filing Date Title
JP2021161481 2021-09-30
JP2021-161894 2021-09-30
JP2021-161481 2021-09-30
JP2021161894 2021-09-30
JP2021-185161 2021-11-12
JP2021185161 2021-11-12
JP2021-198039 2021-12-06
JP2021198039 2021-12-06
JP2021-204523 2021-12-16
JP2021204523 2021-12-16
JP2021-208635 2021-12-22
JP2021208635 2021-12-22
JP2022-028635 2022-02-25
JP2022028635 2022-02-25

Publications (1)

Publication Number Publication Date
TW202332876A true TW202332876A (zh) 2023-08-16

Family

ID=85780779

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111137362A TW202332876A (zh) 2021-09-30 2022-09-30 蒸氣腔、電子機器及蒸氣腔之製造方法

Country Status (5)

Country Link
US (1) US20250185214A1 (https=)
JP (4) JP7315121B1 (https=)
KR (1) KR20240089099A (https=)
TW (1) TW202332876A (https=)
WO (1) WO2023054692A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11306974B2 (en) * 2016-06-15 2022-04-19 Delta Electronics, Inc. Temperature plate and heat dissipation device
US12520457B2 (en) * 2019-09-06 2026-01-06 Dai Nippon Printing Co., Ltd. Vapor chamber having condensate flow paths and vapor flow paths with varying cross-sectional areas in linear parts and a curved part, electronic device, and sheet for such vapor chamber

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2981505B2 (ja) * 1998-04-10 1999-11-22 ダイヤモンド電機株式会社 ヒートパイプの加工方法
JP2004198096A (ja) * 2002-10-25 2004-07-15 Furukawa Electric Co Ltd:The 優れた毛細管力を有する扁平型ヒートパイプおよびそれを用いた冷却装置
US11306974B2 (en) 2016-06-15 2022-04-19 Delta Electronics, Inc. Temperature plate and heat dissipation device
WO2018056439A1 (ja) * 2016-09-23 2018-03-29 古河電気工業株式会社 断熱構造体
JP6827362B2 (ja) * 2017-04-26 2021-02-10 株式会社フジクラ ヒートパイプ
JP6462771B2 (ja) 2017-06-01 2019-01-30 古河電気工業株式会社 平面型ヒートパイプ
JP7211021B2 (ja) * 2017-11-06 2023-01-24 大日本印刷株式会社 ベーパーチャンバ、ベーパーチャンバ用シートおよびベーパーチャンバの製造方法
CN110012637A (zh) * 2018-01-05 2019-07-12 神讯电脑(昆山)有限公司 热导板及散热装置
US20190269034A1 (en) * 2018-02-28 2019-08-29 Microsoft Technology Licensing, Llc Vapor chamber
US20190354148A1 (en) 2018-05-17 2019-11-21 Microsoft Technology Licensing, Llc Conducting heat through a hinge
JP6877513B2 (ja) * 2019-11-06 2021-05-26 古河電気工業株式会社 ベーパーチャンバ
JP2021143809A (ja) * 2020-03-13 2021-09-24 株式会社村田製作所 ベーパーチャンバー及び電子機器

Also Published As

Publication number Publication date
JP7315121B1 (ja) 2023-07-26
KR20240089099A (ko) 2024-06-20
JP7709686B2 (ja) 2025-07-17
JPWO2023054692A1 (https=) 2023-04-06
JP2023153819A (ja) 2023-10-18
US20250185214A1 (en) 2025-06-05
WO2023054692A1 (ja) 2023-04-06
JP2024039034A (ja) 2024-03-21
JP7473064B2 (ja) 2024-04-23
JP2025148370A (ja) 2025-10-07

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