KR20240089099A - 베이퍼 챔버, 전자 기기 및 베이퍼 챔버의 제조 방법 - Google Patents

베이퍼 챔버, 전자 기기 및 베이퍼 챔버의 제조 방법 Download PDF

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Publication number
KR20240089099A
KR20240089099A KR1020247013919A KR20247013919A KR20240089099A KR 20240089099 A KR20240089099 A KR 20240089099A KR 1020247013919 A KR1020247013919 A KR 1020247013919A KR 20247013919 A KR20247013919 A KR 20247013919A KR 20240089099 A KR20240089099 A KR 20240089099A
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KR
South Korea
Prior art keywords
sheet
vapor
area
region
passage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247013919A
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English (en)
Korean (ko)
Inventor
신이치로 다카하시
도시히코 다케다
다카유키 오타
가즈노리 오다
마코토 야마키
신야 기우라
다카유키 데라우치
나오히로 다카하시
유우지 고즈루
Original Assignee
다이니폰 인사츠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 다이니폰 인사츠 가부시키가이샤 filed Critical 다이니폰 인사츠 가부시키가이샤
Publication of KR20240089099A publication Critical patent/KR20240089099A/ko
Pending legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H01L23/427—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Reciprocating Pumps (AREA)
KR1020247013919A 2021-09-30 2022-09-30 베이퍼 챔버, 전자 기기 및 베이퍼 챔버의 제조 방법 Pending KR20240089099A (ko)

Applications Claiming Priority (15)

Application Number Priority Date Filing Date Title
JP2021161894 2021-09-30
JPJP-P-2021-161894 2021-09-30
JPJP-P-2021-161481 2021-09-30
JP2021161481 2021-09-30
JP2021185161 2021-11-12
JPJP-P-2021-185161 2021-11-12
JP2021198039 2021-12-06
JPJP-P-2021-198039 2021-12-06
JPJP-P-2021-204523 2021-12-16
JP2021204523 2021-12-16
JP2021208635 2021-12-22
JPJP-P-2021-208635 2021-12-22
JP2022028635 2022-02-25
JPJP-P-2022-028635 2022-02-25
PCT/JP2022/036767 WO2023054692A1 (ja) 2021-09-30 2022-09-30 ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法

Publications (1)

Publication Number Publication Date
KR20240089099A true KR20240089099A (ko) 2024-06-20

Family

ID=85780779

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247013919A Pending KR20240089099A (ko) 2021-09-30 2022-09-30 베이퍼 챔버, 전자 기기 및 베이퍼 챔버의 제조 방법

Country Status (5)

Country Link
US (1) US20250185214A1 (https=)
JP (4) JP7315121B1 (https=)
KR (1) KR20240089099A (https=)
TW (1) TW202332876A (https=)
WO (1) WO2023054692A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11306974B2 (en) * 2016-06-15 2022-04-19 Delta Electronics, Inc. Temperature plate and heat dissipation device
US12520457B2 (en) * 2019-09-06 2026-01-06 Dai Nippon Printing Co., Ltd. Vapor chamber having condensate flow paths and vapor flow paths with varying cross-sectional areas in linear parts and a curved part, electronic device, and sheet for such vapor chamber

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018221369A1 (ja) 2017-06-01 2018-12-06 古河電気工業株式会社 平面型ヒートパイプ

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2981505B2 (ja) * 1998-04-10 1999-11-22 ダイヤモンド電機株式会社 ヒートパイプの加工方法
JP2004198096A (ja) * 2002-10-25 2004-07-15 Furukawa Electric Co Ltd:The 優れた毛細管力を有する扁平型ヒートパイプおよびそれを用いた冷却装置
US11306974B2 (en) 2016-06-15 2022-04-19 Delta Electronics, Inc. Temperature plate and heat dissipation device
WO2018056439A1 (ja) * 2016-09-23 2018-03-29 古河電気工業株式会社 断熱構造体
JP6827362B2 (ja) * 2017-04-26 2021-02-10 株式会社フジクラ ヒートパイプ
JP7211021B2 (ja) * 2017-11-06 2023-01-24 大日本印刷株式会社 ベーパーチャンバ、ベーパーチャンバ用シートおよびベーパーチャンバの製造方法
CN110012637A (zh) * 2018-01-05 2019-07-12 神讯电脑(昆山)有限公司 热导板及散热装置
US20190269034A1 (en) * 2018-02-28 2019-08-29 Microsoft Technology Licensing, Llc Vapor chamber
US20190354148A1 (en) 2018-05-17 2019-11-21 Microsoft Technology Licensing, Llc Conducting heat through a hinge
JP6877513B2 (ja) * 2019-11-06 2021-05-26 古河電気工業株式会社 ベーパーチャンバ
JP2021143809A (ja) * 2020-03-13 2021-09-24 株式会社村田製作所 ベーパーチャンバー及び電子機器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018221369A1 (ja) 2017-06-01 2018-12-06 古河電気工業株式会社 平面型ヒートパイプ
JP2018204841A (ja) 2017-06-01 2018-12-27 古河電気工業株式会社 平面型ヒートパイプ

Also Published As

Publication number Publication date
JP7315121B1 (ja) 2023-07-26
JP7709686B2 (ja) 2025-07-17
JPWO2023054692A1 (https=) 2023-04-06
JP2023153819A (ja) 2023-10-18
US20250185214A1 (en) 2025-06-05
WO2023054692A1 (ja) 2023-04-06
TW202332876A (zh) 2023-08-16
JP2024039034A (ja) 2024-03-21
JP7473064B2 (ja) 2024-04-23
JP2025148370A (ja) 2025-10-07

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