JPWO2023054692A1 - - Google Patents
Info
- Publication number
- JPWO2023054692A1 JPWO2023054692A1 JP2023513244A JP2023513244A JPWO2023054692A1 JP WO2023054692 A1 JPWO2023054692 A1 JP WO2023054692A1 JP 2023513244 A JP2023513244 A JP 2023513244A JP 2023513244 A JP2023513244 A JP 2023513244A JP WO2023054692 A1 JPWO2023054692 A1 JP WO2023054692A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Reciprocating Pumps (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023115429A JP7473064B2 (ja) | 2021-09-30 | 2023-07-13 | ベーパーチャンバおよび電子機器 |
| JP2023214064A JP7709686B2 (ja) | 2021-09-30 | 2023-12-19 | ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法 |
| JP2025107427A JP2025148370A (ja) | 2021-09-30 | 2025-06-25 | ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法 |
Applications Claiming Priority (15)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021161894 | 2021-09-30 | ||
| JP2021161894 | 2021-09-30 | ||
| JP2021161481 | 2021-09-30 | ||
| JP2021161481 | 2021-09-30 | ||
| JP2021185161 | 2021-11-12 | ||
| JP2021185161 | 2021-11-12 | ||
| JP2021198039 | 2021-12-06 | ||
| JP2021198039 | 2021-12-06 | ||
| JP2021204523 | 2021-12-16 | ||
| JP2021204523 | 2021-12-16 | ||
| JP2021208635 | 2021-12-22 | ||
| JP2021208635 | 2021-12-22 | ||
| JP2022028635 | 2022-02-25 | ||
| JP2022028635 | 2022-02-25 | ||
| PCT/JP2022/036767 WO2023054692A1 (ja) | 2021-09-30 | 2022-09-30 | ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023115429A Division JP7473064B2 (ja) | 2021-09-30 | 2023-07-13 | ベーパーチャンバおよび電子機器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023054692A1 true JPWO2023054692A1 (https=) | 2023-04-06 |
| JP7315121B1 JP7315121B1 (ja) | 2023-07-26 |
| JPWO2023054692A5 JPWO2023054692A5 (https=) | 2023-09-06 |
Family
ID=85780779
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023513244A Active JP7315121B1 (ja) | 2021-09-30 | 2022-09-30 | ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法 |
| JP2023115429A Active JP7473064B2 (ja) | 2021-09-30 | 2023-07-13 | ベーパーチャンバおよび電子機器 |
| JP2023214064A Active JP7709686B2 (ja) | 2021-09-30 | 2023-12-19 | ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法 |
| JP2025107427A Pending JP2025148370A (ja) | 2021-09-30 | 2025-06-25 | ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法 |
Family Applications After (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023115429A Active JP7473064B2 (ja) | 2021-09-30 | 2023-07-13 | ベーパーチャンバおよび電子機器 |
| JP2023214064A Active JP7709686B2 (ja) | 2021-09-30 | 2023-12-19 | ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法 |
| JP2025107427A Pending JP2025148370A (ja) | 2021-09-30 | 2025-06-25 | ベーパーチャンバ、電子機器およびベーパーチャンバの製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250185214A1 (https=) |
| JP (4) | JP7315121B1 (https=) |
| KR (1) | KR20240089099A (https=) |
| TW (1) | TW202332876A (https=) |
| WO (1) | WO2023054692A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11306974B2 (en) * | 2016-06-15 | 2022-04-19 | Delta Electronics, Inc. | Temperature plate and heat dissipation device |
| US12520457B2 (en) * | 2019-09-06 | 2026-01-06 | Dai Nippon Printing Co., Ltd. | Vapor chamber having condensate flow paths and vapor flow paths with varying cross-sectional areas in linear parts and a curved part, electronic device, and sheet for such vapor chamber |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2981505B2 (ja) * | 1998-04-10 | 1999-11-22 | ダイヤモンド電機株式会社 | ヒートパイプの加工方法 |
| JP2004198096A (ja) * | 2002-10-25 | 2004-07-15 | Furukawa Electric Co Ltd:The | 優れた毛細管力を有する扁平型ヒートパイプおよびそれを用いた冷却装置 |
| US11306974B2 (en) | 2016-06-15 | 2022-04-19 | Delta Electronics, Inc. | Temperature plate and heat dissipation device |
| WO2018056439A1 (ja) * | 2016-09-23 | 2018-03-29 | 古河電気工業株式会社 | 断熱構造体 |
| JP6827362B2 (ja) * | 2017-04-26 | 2021-02-10 | 株式会社フジクラ | ヒートパイプ |
| JP6462771B2 (ja) | 2017-06-01 | 2019-01-30 | 古河電気工業株式会社 | 平面型ヒートパイプ |
| JP7211021B2 (ja) * | 2017-11-06 | 2023-01-24 | 大日本印刷株式会社 | ベーパーチャンバ、ベーパーチャンバ用シートおよびベーパーチャンバの製造方法 |
| CN110012637A (zh) * | 2018-01-05 | 2019-07-12 | 神讯电脑(昆山)有限公司 | 热导板及散热装置 |
| US20190269034A1 (en) * | 2018-02-28 | 2019-08-29 | Microsoft Technology Licensing, Llc | Vapor chamber |
| US20190354148A1 (en) | 2018-05-17 | 2019-11-21 | Microsoft Technology Licensing, Llc | Conducting heat through a hinge |
| JP6877513B2 (ja) * | 2019-11-06 | 2021-05-26 | 古河電気工業株式会社 | ベーパーチャンバ |
| JP2021143809A (ja) * | 2020-03-13 | 2021-09-24 | 株式会社村田製作所 | ベーパーチャンバー及び電子機器 |
-
2022
- 2022-09-30 US US18/695,460 patent/US20250185214A1/en active Pending
- 2022-09-30 JP JP2023513244A patent/JP7315121B1/ja active Active
- 2022-09-30 TW TW111137362A patent/TW202332876A/zh unknown
- 2022-09-30 WO PCT/JP2022/036767 patent/WO2023054692A1/ja not_active Ceased
- 2022-09-30 KR KR1020247013919A patent/KR20240089099A/ko active Pending
-
2023
- 2023-07-13 JP JP2023115429A patent/JP7473064B2/ja active Active
- 2023-12-19 JP JP2023214064A patent/JP7709686B2/ja active Active
-
2025
- 2025-06-25 JP JP2025107427A patent/JP2025148370A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP7315121B1 (ja) | 2023-07-26 |
| KR20240089099A (ko) | 2024-06-20 |
| JP7709686B2 (ja) | 2025-07-17 |
| JP2023153819A (ja) | 2023-10-18 |
| US20250185214A1 (en) | 2025-06-05 |
| WO2023054692A1 (ja) | 2023-04-06 |
| TW202332876A (zh) | 2023-08-16 |
| JP2024039034A (ja) | 2024-03-21 |
| JP7473064B2 (ja) | 2024-04-23 |
| JP2025148370A (ja) | 2025-10-07 |
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