TW202330683A - 芳烷基樹脂、環氧樹脂之稀釋劑、硬化性樹脂組合物、感光性樹脂組合物、硬化物、電子裝置、芳烷基樹脂之製造方法 - Google Patents

芳烷基樹脂、環氧樹脂之稀釋劑、硬化性樹脂組合物、感光性樹脂組合物、硬化物、電子裝置、芳烷基樹脂之製造方法 Download PDF

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Publication number
TW202330683A
TW202330683A TW111141768A TW111141768A TW202330683A TW 202330683 A TW202330683 A TW 202330683A TW 111141768 A TW111141768 A TW 111141768A TW 111141768 A TW111141768 A TW 111141768A TW 202330683 A TW202330683 A TW 202330683A
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TW
Taiwan
Prior art keywords
integer
general formula
resin
aralkyl resin
atom
Prior art date
Application number
TW111141768A
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English (en)
Chinese (zh)
Inventor
廣瀧謙亮
関啓二朗
名倉裕力
細井健史
Original Assignee
日商中央硝子股份有限公司
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Application filed by 日商中央硝子股份有限公司 filed Critical 日商中央硝子股份有限公司
Publication of TW202330683A publication Critical patent/TW202330683A/zh

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G10/00Condensation polymers of aldehydes or ketones with aromatic hydrocarbons or halogenated aromatic hydrocarbons only
    • C08G10/02Condensation polymers of aldehydes or ketones with aromatic hydrocarbons or halogenated aromatic hydrocarbons only of aldehydes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/18Condensation polymers of aldehydes or ketones with aromatic hydrocarbons or their halogen derivatives only
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/022Quinonediazides
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/22Exposing sequentially with the same light pattern different positions of the same surface

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
  • Epoxy Resins (AREA)
TW111141768A 2021-11-02 2022-11-02 芳烷基樹脂、環氧樹脂之稀釋劑、硬化性樹脂組合物、感光性樹脂組合物、硬化物、電子裝置、芳烷基樹脂之製造方法 TW202330683A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021179571 2021-11-02
JP2021-179571 2021-11-02

Publications (1)

Publication Number Publication Date
TW202330683A true TW202330683A (zh) 2023-08-01

Family

ID=86241151

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111141768A TW202330683A (zh) 2021-11-02 2022-11-02 芳烷基樹脂、環氧樹脂之稀釋劑、硬化性樹脂組合物、感光性樹脂組合物、硬化物、電子裝置、芳烷基樹脂之製造方法

Country Status (5)

Country Link
JP (1) JPWO2023080132A1 (enrdf_load_stackoverflow)
KR (1) KR20240088837A (enrdf_load_stackoverflow)
CN (1) CN118043368A (enrdf_load_stackoverflow)
TW (1) TW202330683A (enrdf_load_stackoverflow)
WO (1) WO2023080132A1 (enrdf_load_stackoverflow)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8629556D0 (en) * 1986-12-10 1987-01-21 Ici Plc Polyarylalkanes
JP7343794B2 (ja) * 2019-02-06 2023-09-13 セントラル硝子株式会社 ポリアミド酸およびポリイミド、光学フィルムおよび表示装置、ならびにそれらの製造方法
KR20220158809A (ko) * 2020-03-27 2022-12-01 샌트랄 글래스 컴퍼니 리미티드 노볼락 수지, 에폭시 수지, 감광성 수지 조성물, 경화성 수지 조성물, 경화물, 전자 디바이스, 노볼락 수지의 제조 방법 및 에폭시 수지의 제조 방법

Also Published As

Publication number Publication date
KR20240088837A (ko) 2024-06-20
WO2023080132A1 (ja) 2023-05-11
JPWO2023080132A1 (enrdf_load_stackoverflow) 2023-05-11
CN118043368A (zh) 2024-05-14

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