TW202323307A - 感光性樹脂組合物、硬化物、阻隔壁、有機電致發光元件、及圖像顯示裝置 - Google Patents

感光性樹脂組合物、硬化物、阻隔壁、有機電致發光元件、及圖像顯示裝置 Download PDF

Info

Publication number
TW202323307A
TW202323307A TW111137059A TW111137059A TW202323307A TW 202323307 A TW202323307 A TW 202323307A TW 111137059 A TW111137059 A TW 111137059A TW 111137059 A TW111137059 A TW 111137059A TW 202323307 A TW202323307 A TW 202323307A
Authority
TW
Taiwan
Prior art keywords
group
mass
ring
monomer
resin composition
Prior art date
Application number
TW111137059A
Other languages
English (en)
Chinese (zh)
Inventor
利光恵理子
木村明日香
佐藤嘉秀
倉久稔
Original Assignee
日商三菱化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三菱化學股份有限公司 filed Critical 日商三菱化學股份有限公司
Publication of TW202323307A publication Critical patent/TW202323307A/zh

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H05B33/22—Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Materials For Photolithography (AREA)
  • Electroluminescent Light Sources (AREA)
TW111137059A 2021-10-01 2022-09-29 感光性樹脂組合物、硬化物、阻隔壁、有機電致發光元件、及圖像顯示裝置 TW202323307A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-162453 2021-10-01
JP2021162453 2021-10-01

Publications (1)

Publication Number Publication Date
TW202323307A true TW202323307A (zh) 2023-06-16

Family

ID=85782912

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111137059A TW202323307A (zh) 2021-10-01 2022-09-29 感光性樹脂組合物、硬化物、阻隔壁、有機電致發光元件、及圖像顯示裝置

Country Status (5)

Country Link
JP (1) JPWO2023054597A1 (https=)
KR (1) KR20240063867A (https=)
CN (1) CN118020026A (https=)
TW (1) TW202323307A (https=)
WO (1) WO2023054597A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024190597A1 (ja) * 2023-03-10 2024-09-19 セントラル硝子株式会社 硬化性樹脂材料、撥液剤組成物、感光性樹脂組成物及び隔壁材料

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050071978A (ko) * 2004-01-05 2005-07-08 주식회사 동진쎄미켐 ＫｒＦ 포토레지스트용 유기 반사 방지막 조성물
JP5353632B2 (ja) 2009-10-23 2013-11-27 Ｄｉｃ株式会社 含フッ素硬化性樹脂、活性エネルギー線硬化型塗料組成物及びその硬化物
JP2011099974A (ja) * 2009-11-05 2011-05-19 Fujifilm Corp 着色感光性組成物、カラーフィルタ、及び液晶表示装置
JP5606868B2 (ja) * 2010-10-22 2014-10-15 富士フイルム株式会社 光重合性組成物、カラーフィルタ、その製造方法、及び、固体撮像素子
JP2017207532A (ja) * 2016-05-16 2017-11-24 東洋合成工業株式会社 レジスト組成物及びそれを用いたデバイスの製造方法
JP7234946B2 (ja) 2018-01-26 2023-03-08 三菱ケミカル株式会社 感光性樹脂組成物、隔壁、有機電界発光素子、画像表示装置及び照明

Also Published As

Publication number Publication date
CN118020026A (zh) 2024-05-10
KR20240063867A (ko) 2024-05-10
WO2023054597A1 (ja) 2023-04-06
JPWO2023054597A1 (https=) 2023-04-06

Similar Documents

Publication Publication Date Title
TWI772604B (zh) 感光性樹脂組成物、分隔壁、有機電致發光元件、影像顯示裝置及照明
JP7205089B2 (ja) 感光性樹脂組成物、隔壁、有機電界発光素子、画像表示装置及び照明
TWI819333B (zh) 有機電致發光元件阻隔壁形成用感光性樹脂組合物、阻隔壁、有機電致發光元件、圖像顯示裝置及照明
TW202239773A (zh) 感光性樹脂組合物、硬化物、阻隔壁、有機電致發光元件、彩色濾光器及圖像顯示裝置
JP6183044B2 (ja) 硬化性組成物、硬化膜及び表示素子
JP7040089B2 (ja) 隔壁形成用感光性樹脂組成物、隔壁、有機電界発光素子、画像表示装置及び照明
TW202323307A (zh) 感光性樹脂組合物、硬化物、阻隔壁、有機電致發光元件、及圖像顯示裝置
JP2017227771A (ja) 隔壁形成用感光性樹脂組成物、隔壁、有機電界発光素子、画像表示装置及び照明
JP7236209B2 (ja) 隔壁形成用感光性樹脂組成物、隔壁、有機電界発光素子、画像表示装置及び照明
TWI865691B (zh) 感光性樹脂組合物、阻隔壁、有機電致發光元件、及圖像顯示裝置
WO2025187597A1 (ja) 感光性樹脂組成物、硬化物、隔壁、有機電界発光素子、及び画像表示装置
WO2022209771A1 (ja) 着色感光性樹脂組成物、硬化物、隔壁、有機電界発光素子、発光性ナノ結晶粒子を含むカラーフィルタ及び画像表示装置
TW202248227A (zh) 著色感光性樹脂組合物、硬化物、阻隔壁、彩色濾光器及圖像顯示裝置
KR20230144970A (ko) 렌즈의 제조 방법, 감방사선성 조성물, 표시 소자, 표시 장치, 고체 촬상 소자, 촬상 장치 및 화합물
WO2025075166A1 (ja) 感光性樹脂組成物、硬化物、隔壁、有機電界発光素子及び画像表示装置
TW202348639A (zh) 化合物、聚合性組合物、硬化物、彩色濾光器、阻隔壁及圖像顯示裝置
WO2025084352A1 (ja) 感光性着色組成物、硬化物、隔壁、有機電界発光素子、カラーフィルター、及び画像表示装置
JP2018018036A (ja) 隔壁形成用感光性樹脂組成物、隔壁、有機電界発光素子、画像表示装置及び照明