TW202321021A - 無機基板與透明耐熱高分子薄膜之積層體 - Google Patents

無機基板與透明耐熱高分子薄膜之積層體 Download PDF

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TW202321021A
TW202321021A TW111125667A TW111125667A TW202321021A TW 202321021 A TW202321021 A TW 202321021A TW 111125667 A TW111125667 A TW 111125667A TW 111125667 A TW111125667 A TW 111125667A TW 202321021 A TW202321021 A TW 202321021A
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Taiwan
Prior art keywords
polymer film
laminate
resistant polymer
heat
bis
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TW111125667A
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English (en)
Chinese (zh)
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德田桂也
奧山哲雄
前田鄉司
米蟲治美
水口傳一朗
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日商東洋紡股份有限公司
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Publication of TW202321021A publication Critical patent/TW202321021A/zh

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
TW111125667A 2021-07-16 2022-07-08 無機基板與透明耐熱高分子薄膜之積層體 TW202321021A (zh)

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JP2021-117965 2021-07-16
JP2021117965 2021-07-16

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TW202321021A true TW202321021A (zh) 2023-06-01

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