CN117677496A - 无机基板与透明耐热高分子膜的层叠体 - Google Patents

无机基板与透明耐热高分子膜的层叠体 Download PDF

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Publication number
CN117677496A
CN117677496A CN202280048766.XA CN202280048766A CN117677496A CN 117677496 A CN117677496 A CN 117677496A CN 202280048766 A CN202280048766 A CN 202280048766A CN 117677496 A CN117677496 A CN 117677496A
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China
Prior art keywords
polymer film
laminate
heat
resistant polymer
less
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CN202280048766.XA
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English (en)
Chinese (zh)
Inventor
德田桂也
奥山哲雄
前田乡司
米虫治美
水口传一朗
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Toyobo Co Ltd
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Toyobo Co Ltd
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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
CN202280048766.XA 2021-07-16 2022-07-07 无机基板与透明耐热高分子膜的层叠体 Pending CN117677496A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-117965 2021-07-16
JP2021117965 2021-07-16
PCT/JP2022/026928 WO2023286686A1 (ja) 2021-07-16 2022-07-07 無機基板と透明耐熱高分子フィルムの積層体

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