TW202319206A - Method for scribing fragile material substrate - Google Patents

Abstract

Provided is a method for scribing a fragile material substrate, whereby it becomes possible to prolong the life of diamond that scribes the fragile material substrate. The method for scribing a fragile material substrate is a method for scribing a fragile material substrate (G) along a scheduled scribing line (L), the method comprising placing a sheet (S) containing a polymeric compound on the fragile material substrate (G) for 48 to 1000 hours, removing the sheet (S), pressing a diamond-made point (P) of a scribing tool (1) onto the scheduled scribing line (L), and moving the fragile material substrate (G) and the scribing tool (1) relatively to each other to scribe the fragile material substrate (G).

Description

Cutting method of brittle material substrate

The present invention relates to a technique for cutting a brittle material substrate, which is used to cut glass substrates or silicon wafers by using the tip (point) of a diamond (diamond) cutting tool (scribing tool). Wafer) and other brittle material substrates for cutting (scribe).

Generally, glass substrates or silicon wafers are cut with a cutting tool using a wheel or single crystal diamond. In a cutting tool using single crystal diamond, diamond is arranged at a tip that is a point of contact with a substrate, and a cutting line is formed at the tip by moving the cutting tool in a linear direction (for example, refer to Patent Document 1). [Prior art literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2017-65245

[Problem to be Solved by the Invention] In the cutting method performed by the conventional cutting tool, there is a problem that the diamond used for the tip is worn due to use, and the performance of forming a cutting line cannot be fully exhibited. In addition, in recent years, with the reduction in weight and foldability of mobile phone terminals, ultra-thin cover glass has been promoted, and ultra-thin plate glass for cutting thickness of 100 μm or less has been developed. high-strength diamond. High-strength diamond can perform precise cutting, but it also has the disadvantage of short life.

The present invention has been made in view of the above-mentioned current problems, and an object of the present invention is to provide a brittle material substrate dicing method capable of achieving longer life of diamond for dicing brittle material substrates. [Means to solve the problem]

The problems to be solved by the present invention are as described above, and the means for solving the problems will be described next.

That is, the cutting method of the brittle material substrate according to the present invention cuts the brittle material substrate along the planned cutting line, and is characterized in that the thin slice having the polymer compound is placed on the brittle material substrate for a predetermined time and then removed, and the brittle material substrate is made of diamond. The tip of the cutting tool is pressed against the planned cutting line, so that the brittle material substrate and the cutting tool are relatively moved, thereby performing cutting. As described above, in the cutting method of the brittle material substrate of the present invention, by making the lubricating component contained in the sheet adhere to the laminated brittle material substrate, the distance between the brittle material substrate and the tip of the cutting tool can be increased. The lubricity between them can reduce the wear of the diamond blade used in the tip.

Moreover, in the method for cutting a brittle material substrate of the present invention, preferably, the thin sheet is a polyethylene thin sheet. With such a structure, the polyethylene glycol (Polyethylene Glycol, PEG) contained in the polyethylene sheet bleeds out to impart lubricity to the surface of the brittle material substrate, thereby reducing wear of the diamond blade used at the tip.

Furthermore, in the dicing method of the brittle material substrate of the present invention, it is preferable that the mounting of the sheet is performed in an environment of 20° C. to 70° C. for 48 hours to 1000 hours. With such a structure, the PEG contained in the polyethylene sheet is easy to ooze out, and provides lubricity to the surface of the brittle material substrate, thereby reducing wear of the diamond blade used at the tip.

Furthermore, in the method for cutting a brittle material substrate according to the present invention, it is preferable to package the plurality of brittle material substrates laminated with each other and the plurality of thin sheets interposed between the plurality of brittle material substrates. status to load. With such a structure, the PEG contained in the polyethylene sheet tends to ooze out during packaging and storage of multiple brittle material substrates, thereby imparting lubricity to the surface of the brittle material substrate, thereby reducing the amount of fluid used for the tip. Diamond blade wear.

Furthermore, in the cutting method of the brittle material substrate of the present invention, preferably, the plurality of brittle material substrates are placed in a flat state, and the thickness of the brittle material substrate is 300 μm or less. With such a structure, the PEG contained in the polyethylene sheet tends to ooze out due to gravity during the period when multiple brittle material substrates are bundled and stored in a flat state, thereby imparting lubricity to the surface of the brittle material substrate, This reduces wear on the diamond blades used at the tip. [Effect of the invention]

As effects of the present invention, effects as shown below are achieved. That is, according to the cutting method of the brittle material substrate of the present invention, before performing the cutting step, the sheet having the polymer compound is placed on the brittle material substrate for a predetermined time and then removed, thereby improving the bond between the brittle material substrate and the cutting tool. Lubricity between the tips, thereby reducing wear on the diamond blades used for the tips. Thereby, since the life extension of a diamond blade can be achieved, the cost of replacing a blade can be reduced.

Next, an embodiment of the present invention will be described using FIG. 1A and FIG. 1B .

[Structure of the cutting tool] First, the structure of the cutting tool used for realizing the cutting method of the brittle material substrate of this invention is demonstrated using FIG. 1A, FIG. 1B. The cutting tool 1 is a device that forms a cutting line by abutting a tip P on a planned cutting line L of a brittle material substrate G. As shown in FIG.

As shown in FIGS. 1A and 1B , a cutting tool 1 includes a tool body 2 capable of moving in a cutting direction, and a base member 3 mounted on a corner post of the tool body 2 . The tool body 2 is arranged above the brittle material substrate G, and is configured to be movable parallel to the surface of the brittle material substrate G. As shown in FIG. The tool body 2 is supported horizontally on a table 11 on which the brittle material substrate G is placed. The horizontal movement of the tool body 2 relative to the console 11 is controlled by a control device not shown, and in the present embodiment, it is configured to be able to move horizontally along the planned cutting line L for cutting the brittle material substrate G. The brittle material substrate G is a plate-shaped member that is easily broken along flaws (cracks), and is made of, for example, a glass substrate. As the glass substrate, for example, alkali-free glass, silicate glass, silica glass, borosilicate glass, and the like can be used. When the brittle material substrate G is a glass substrate, the thickness is preferably 300 μm or less.

The base member 3 is formed of single crystal diamond. Furthermore, the raw material of the base member 3 is not limited to this embodiment, for example, it may be polycrystalline diamond synthesized by chemical vapor deposition (Chemical Vapor Deposition, CVD), made of particulate graphite (graphite) or non- Graphite carbon does not include polycrystalline diamond sintered in a binder such as iron group elements, or sintered diamond formed by bonding diamond particles with a binder such as iron group elements.

The base member 3 may be formed of single crystal diamond as long as at least the portion where the dicing line is formed including the tip P is formed, and other portions may be formed of metal or ceramic. The base member 3 is fixed on the side of the tool body 2 by fixing members such as screws. The base member 3 is formed of a polygonal column having one or more vertices. Among one or more apexes of the polygonal columns provided on the base member 3 , a point P is formed at the site of the ridge line in contact with the brittle material substrate G. As shown in FIG. The tip P is formed of a corner portion of single crystal diamond, and is configured to be able to form a cutting line on the surface of the brittle material substrate G.

[Cutting method using a cutting tool] Next, a cutting method using the cutting tool 1 will be described using FIG. 2 . First, the brittle material substrate G is packaged and stored in a laminated state (step S05 ). Next, in order to cut the brittle material substrate G, the brittle material substrate G is taken out from the packaged and stored state, and arranged one by one on the workbench 11 (step S10 ). Next, the tip P of the base member 3 is brought into contact with the starting point on the line L to be cut (step S30 ). Next, the tool body 2 is moved parallel to the planned cutting line L (step S40 ). The tool body 2 is moved parallel to the line L to cut, whereby cutting is performed with the tip P. As shown in FIG.

[Laminated brittle material substrate] Next, the form of the bag when storing and transferring the brittle material substrate G in step S05 will be described. As shown in FIG. 3 , the brittle material substrate G is laid flat so that the wide surface becomes horizontal, and stacked in the vertical direction. Between the laminated brittle material substrate G and the brittle material substrate G, a sheet S for improving cushioning performance and protecting the surface is interposed. One piece of sheet S is interposed between the brittle material substrate G and the brittle material substrate G respectively. Both sides of the brittle material substrate G are protected by the thin sheet S. The surface of the brittle material substrate G is protected by the sheet S, thereby preventing other pollutants such as particles or fine particles generated from the substrate itself from adhering to the surface of the brittle material substrate G. The sheet S is composed of a foamed polyethylene sheet. Since the sheet S has air bubbles inside the polyethylene sheet, it has excellent cushioning properties and prevents the brittle material substrates G from colliding with each other to cause damage.

The thin slice S is also arranged on the outer periphery of the laminated brittle material substrate G. The thin piece S protects the peripheral surface of the brittle material substrate G, thereby preventing the brittle material substrate G from being damaged due to an external force during wrapping. It is also possible to protect the peripheral surface of the brittle material substrate G by laminating the thin sheet S around the brittle material substrate G in a larger circle.

The laminated brittle material substrate G is wrapped and stored in a state surrounded by the sheet S. The temperature of the storage place is preferably in an environment of not less than 20°C and not more than 70°C. The polyethylene glycol contained in the foamable polyethylene sheet oozes out by storing in an environment of 20°C to 70°C. In this way, polyethylene glycol is attached to the entire build-up surface of the brittle material substrate G. As shown in FIG. Since the plurality of brittle material substrates G is laid flat, the pressure due to its own weight is uniformly applied to the wide surface. In this way, polyethylene glycol is attached to the entire build-up surface of the brittle material substrate G. As shown in FIG.

Furthermore, the thickness of the packaged brittle material substrate G is preferably 300 μm or less. Since the thickness of the brittle material substrate G becomes thinner, the diamond blade made of the material of the base member 3 used in the dicing step requires higher strength. High-strength diamond can perform precise cutting, but it also has the disadvantage of short life. Therefore, it is possible to achieve a longer life of the base member 3 by allowing enough polyethylene glycol to seep out from the sheet S to prevent abrasion of the diamond.

The laminated brittle material substrate G is placed in an environment of 20° C. to 70° C. for 48 hours to 1000 hours in a packaged state. By placing the laminated brittle material substrate G for 48 hours to 1000 hours, polyethylene glycol sufficient to obtain lubricity can ooze out.

As described above, by oozing polyethylene glycol sufficient to obtain lubricity to the surface of the brittle material substrate G in advance, in the cutting step after step S10, the distance between the brittle material substrate G and the tip P of the cutting tool 1 can be increased. Lubricity, so that the wear of the diamond blade used in the tip P can be reduced.

[Example] Next, a verification experiment for judging its effectiveness in realizing the cutting method of the brittle material substrate G of the present invention will be described.

In the verification experiment, a glass substrate was used as the brittle material substrate G. Then, in the state where the brittle material substrate G was laminated, the sheet S made of a foamable polyethylene sheet was used for wrapping. The packaged brittle material substrate G is heated in an oven. As a result, polyethylene glycol oozes out from the sheet S and adheres to the surface of the brittle material substrate G. As shown in FIG. The heated brittle material substrate G is arranged on the workbench 11 in a state where the sheet S is peeled off in step S10 . Next, in step S30 , the tip P of the base member 3 is brought into contact with a point on the planned cutting line L of the polyethylene glycol-attached brittle material substrate G. Next, in step S40 , the tool body 2 is moved parallel to the line L to cut, whereby cutting is performed by the tip P. As shown in FIG.

Table 1 shows the life measurement results of the base member 3 used in this cutting method.

In Example 1, the heating temperature in the oven in which the brittle material substrate G was stored was set to 40° C. and stored for one week. In Example 2, the heating temperature in the oven in which the brittle material substrate G was stored was set at 60° C., and stored for one week. In Example 3, the brittle material substrate G was stored at room temperature for 2 months.

[Table 1] Example 1 Life [m] Example 2 Life [m] Example 3 Life [m] 700 4400 700

In the case of dicing the brittle material substrate G that was not wrapped with the sheet S and stored at room temperature for 2 weeks, the life of the base member 3 was very short at 350 m or less. When dicing the brittle material substrate G stored at 40° C. in the oven for one week, the life of the base member 3 was extended to 700 m. Furthermore, as in Example 2, when dicing the brittle material substrate G stored for a week with the heating temperature in the oven at 60° C., the life of the base member 3 was extended to 4400 m. Furthermore, as in Example 3, when cutting the brittle material substrate G stored at normal temperature for 2 months, the life of the base member 3 was extended to 700 m.

According to the above results, the lubricity between the brittle material substrate G and the tip P of the cutting tool 1 can be improved by preliminarily exuding polyethylene glycol sufficient to obtain lubricity to the surface of the brittle material substrate G, thereby reducing the sharpness of the tip P. Wear of the diamond blades used.

As mentioned above, the cutting method of the brittle material substrate of the present invention is to cut the brittle material substrate G along the planned cutting line L, place the thin slice S having the polymer compound on the brittle material substrate G for a predetermined time and remove it, The tip P of the formed cutting tool 1 is pressed against the planned cutting line L, and the brittle material substrate G and the cutting tool 1 are relatively moved, thereby performing cutting. By constituting as above, the polyethylene glycol contained in the foamable polyethylene sheet can be exuded, and the lubricity between the brittle material substrate G and the tip P of the cutting tool 1 can be improved, thereby reducing the amount of time used for the tip P. Diamond blade wear. [Industrial availability]

The present invention can be applied to a technique of a dicing method of a brittle material substrate for dicing a brittle material substrate such as a glass substrate or a silicon wafer by using a tip of a diamond cutting tool.

1: Cutting tool 2: Tool body 3: Base member 11: Console G: Brittle material substrate L: cutting scheduled line P: tip S: Flakes

FIG. 1A is a front view showing a cutting tool according to an embodiment of the present invention, and FIG. 1B is a plan view. Fig. 2 is a flow chart showing a cutting step according to one embodiment of the present invention. 3 is a front sectional view showing a laminated brittle material substrate according to an embodiment of the present invention.

1: Cutting tool

2: Tool body

3: Base member

11: Console

G: Brittle material substrate

L: cutting scheduled line

P: tip

Claims (5)

A method for cutting a brittle material substrate, cutting the brittle material substrate along a predetermined cutting line, wherein placing the sheet with the polymer compound on the brittle material substrate for a predetermined period of time and then removing it, pressing the tip of a cutting tool formed of diamond against the planned cutting line, Cutting is performed by relatively moving the brittle material substrate and the cutting tool. The cutting method as claimed in item 1, wherein The flakes are polyethylene flakes. The cutting method as described in claim 1 or claim 2, wherein The mounting of the sheet is performed in an environment of 20° C. to 70° C. for 48 hours to 1000 hours. The cutting method according to any one of claim 1 to claim 3, wherein The multi-chip brittle material substrates stacked on each other, and The plurality of sheets interposed between the plurality of brittle material substrates are placed in a bundled state. The cutting method as described in claim item 4, wherein The plurality of brittle material substrates are placed in a flat state, The thickness of the brittle material substrate is less than 300 μm.

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