TW202317339A - 基板固定構造、機械及機器人 - Google Patents
基板固定構造、機械及機器人 Download PDFInfo
- Publication number
- TW202317339A TW202317339A TW111136447A TW111136447A TW202317339A TW 202317339 A TW202317339 A TW 202317339A TW 111136447 A TW111136447 A TW 111136447A TW 111136447 A TW111136447 A TW 111136447A TW 202317339 A TW202317339 A TW 202317339A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- fixing structure
- machine
- vibration absorbing
- absorbing material
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 276
- 239000011358 absorbing material Substances 0.000 claims description 58
- 238000010438 heat treatment Methods 0.000 claims description 20
- 229920005989 resin Polymers 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 239000006096 absorbing agent Substances 0.000 abstract description 14
- 238000000926 separation method Methods 0.000 description 14
- 238000001514 detection method Methods 0.000 description 13
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- 230000000052 comparative effect Effects 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 210000000707 wrist Anatomy 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- -1 polybutylene terephthalate Polymers 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000009291 secondary effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Motor Or Generator Frames (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
WOPCT/JP2021/039713 | 2021-10-27 | ||
PCT/JP2021/039713 WO2023073843A1 (ja) | 2021-10-27 | 2021-10-27 | 基板固定構造、機械、及びロボット |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202317339A true TW202317339A (zh) | 2023-05-01 |
Family
ID=86159249
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111136447A TW202317339A (zh) | 2021-10-27 | 2022-09-27 | 基板固定構造、機械及機器人 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2023073843A1 (enrdf_load_stackoverflow) |
TW (1) | TW202317339A (enrdf_load_stackoverflow) |
WO (1) | WO2023073843A1 (enrdf_load_stackoverflow) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0477283U (enrdf_load_stackoverflow) * | 1990-11-19 | 1992-07-06 | ||
JP2009208213A (ja) * | 2008-03-06 | 2009-09-17 | Yaskawa Electric Corp | マニピュレータ装置 |
WO2011013509A1 (ja) * | 2009-07-31 | 2011-02-03 | ボッシュ株式会社 | 電子装置 |
JP5852500B2 (ja) * | 2012-04-25 | 2016-02-03 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
JP6698046B2 (ja) * | 2017-03-29 | 2020-05-27 | 富士高分子工業株式会社 | 熱伝導シート |
JP7009935B2 (ja) * | 2017-11-06 | 2022-01-26 | セイコーエプソン株式会社 | ロボット |
JP2020148232A (ja) * | 2019-03-12 | 2020-09-17 | 三菱電機株式会社 | 支持材、組み付け部品、電子機器および組み付け方法 |
-
2021
- 2021-10-27 WO PCT/JP2021/039713 patent/WO2023073843A1/ja active Application Filing
- 2021-10-27 JP JP2023555963A patent/JPWO2023073843A1/ja active Pending
-
2022
- 2022-09-27 TW TW111136447A patent/TW202317339A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2023073843A1 (ja) | 2023-05-04 |
JPWO2023073843A1 (enrdf_load_stackoverflow) | 2023-05-04 |
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