WO2023073843A1 - 基板固定構造、機械、及びロボット - Google Patents

基板固定構造、機械、及びロボット Download PDF

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Publication number
WO2023073843A1
WO2023073843A1 PCT/JP2021/039713 JP2021039713W WO2023073843A1 WO 2023073843 A1 WO2023073843 A1 WO 2023073843A1 JP 2021039713 W JP2021039713 W JP 2021039713W WO 2023073843 A1 WO2023073843 A1 WO 2023073843A1
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WO
WIPO (PCT)
Prior art keywords
substrate
fixing structure
machine
housing
board
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Application number
PCT/JP2021/039713
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English (en)
French (fr)
Japanese (ja)
Inventor
泰地 田口
慶太郎 稲垣
秀俊 植松
Original Assignee
ファナック株式会社
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Filing date
Publication date
Application filed by ファナック株式会社 filed Critical ファナック株式会社
Priority to JP2023555963A priority Critical patent/JPWO2023073843A1/ja
Priority to PCT/JP2021/039713 priority patent/WO2023073843A1/ja
Priority to TW111136447A priority patent/TW202317339A/zh
Publication of WO2023073843A1 publication Critical patent/WO2023073843A1/ja

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack

Definitions

  • the present invention relates to substrate fixing technology, and more particularly to substrate fixing structures, machines, and robots.
  • a known technique is to fix the printed circuit board for the actuator that drives the machine inside the machine housing.
  • vibrations or shocks due to external or internal factors are transmitted to the machine housing, and the transmission of vibrations from the housing to the substrate can damage the substrate.
  • the heat generated by the heat generating elements such as power semiconductors and integrated circuits on the substrate is difficult to transfer to the housing of the machine, the heat generating elements will easily reach the rated temperature and the rated current will decrease.
  • Patent Document 1 discloses a radar antenna drive device having a support means for rotatably supporting a radar antenna body and a motor fixed to the support means for rotationally driving the radar antenna body. It is described that a vibration absorbing member made of a ferrite composite material is inserted in the vibration propagation path to.
  • Patent Document 2 discloses a first transmission shaft for extracting rotational power of a drive motor, a second transmission shaft for vertically moving a slider by the power from the first transmission shaft, and a spoiler support member that is connected to the slider and vertically moves the spoiler. are supported by a metal core frame, the core frame is assembled and set in a housing made of synthetic resin, and a vibration absorbing material is interposed in the contact area between the core frame and the housing.
  • Patent Document 3 in an integrated electric power steering device, heat is conducted from a heating element on a control board to a mechanism member via a heat conduction member to suppress the temperature, and the heat conduction member is connected to the control board and the mechanism member. It is described to act as a vibration absorber during
  • Patent Document 4 in an electronic device, spacers are arranged around electronic components and on both sides of a substrate, the spacers are connected to rigid members on both sides of the substrate, It is described that a vibration absorbing member is arranged between the substrate.
  • Patent Document 5 discloses a robot arm having a housing, which converts a DC voltage output from an AC motor having a predetermined drive voltage and a power supply that outputs a predetermined DC voltage into an AC voltage. and a substrate on which a driving circuit for driving the motor is mounted, and the substrate is arranged in surface contact with a predetermined surface of the housing.
  • Patent Document 6 describes that a door that can be opened and closed is provided to the device body, and a printed circuit board is fixed to the door side.
  • An object of the present invention is to provide a board fixing technique that increases the reliability of the board in view of the conventional problems.
  • One aspect of the present disclosure includes a substrate for an actuator that drives a machine, vibration absorbers arranged on both sides of the substrate, and a fixing portion that sandwiches the substrate and the vibration absorber and fixes them to a housing of the machine.
  • a substrate fixing structure comprising: Another aspect of the present disclosure provides a machine or robot comprising a substrate securing structure as described above.
  • the vibrations are absorbed by the vibration absorbing material, and transmission of the vibrations to the board is reduced. damage can be reduced. As a result, the MTBF (Mean Time Between Failures) can be increased. As a result, it is possible to provide a substrate fixing structure that enhances the reliability of the substrate. According to another aspect of the present disclosure, such a substrate fixing structure can provide a highly reliable machine or robot.
  • FIG. 1 is a perspective view of a machine with a substrate fixing structure of the first embodiment;
  • FIG. It is a block diagram of a substrate of the first embodiment. It is a bottom view of the board
  • FIG. 4 is a IV-IV cross-sectional view of the substrate fixing structure of the first embodiment;
  • FIG. 11 is a cross-sectional view taken along line IV-IV of a substrate fixing structure of a modified example;
  • FIG. 11 is a cross-sectional view taken along line IV-IV of a substrate fixing structure of another modified example;
  • It is a bottom view of the board
  • FIG. 4 is a IV-IV cross-sectional view of the substrate fixing structure of the first embodiment
  • FIG. 11 is a cross-sectional view taken along line IV-IV of a substrate fixing structure of a modified example
  • FIG. 11 is a cross-sectional view taken along line IV-IV of a substrate fixing structure of a modified example;
  • FIG. 11 is an isolated view of the substrate fixing structure of the third embodiment;
  • FIG. 4 is a cross-sectional view of a substrate fixing structure of a comparative example;
  • FIG. 1 is a perspective view of a machine 1 with a substrate fixing structure of the first embodiment.
  • the machine 1 is composed of robots such as single-axis robots, multi-axis robots, parallel-link robots, and humanoid robots.
  • the machine 1 may consist of industrial machines such as machine tools, construction machines, agricultural machines, conveyors, or other machines such as vehicles, aircraft, home appliances, and the like.
  • the machine 1 of this embodiment comprises an articulated robot, in particular a collaborative robot.
  • the machine 1 includes hollow housings 10 to 16, actuators 21 to 26 that drive the machine 1, substrates 31 to 36 for the actuators 21 to 26, and a filament 41 that electrically connects the substrates 31 to 36. .about.52.
  • the housings 10 to 16 are links of the machine 1 that are connected to each other for relative movement.
  • the zeroth housing 10 is a fixed base that is fixed at a predetermined position
  • the first housing 11 is a swing barrel that is rotatably supported with respect to the zeroth housing 10 about the first axis J1.
  • the second housing 12 is an upper arm rotatably supported with respect to the first housing 11 about a second axis J2 perpendicular to the first axis J1, and the third housing 13 is parallel to the second axis J2.
  • the forearm is rotatably supported with respect to the second housing 12 about the third axis J3.
  • a fourth housing 14 , a fifth housing 15 , and a sixth housing 16 are triaxial wrist units attached to the second housing 13 .
  • the fourth housing 14 is a first wrist element supported rotatably with respect to the third housing 13 about a fourth axis J4 perpendicular to the third axis J3.
  • the housings 11-14 are provided with separating parts 11a-14a that can be separated from the housings 11-14. Separating portions 11a to 14a are covers that form part of housings 11 to 14, and by separating separating portions 11a to 14a from housings 11 to 14, maintenance and maintenance of actuators 21 to 26 or substrates 31 to 36 can be performed. exchange becomes possible.
  • the actuators 21-26 are fixed inside the housings 10-16. Alternatively, in other embodiments, some or all of the plurality of actuators 21-26 may be fixed outside the housings 10-16. Actuators 21-26 are comprised of rotary actuators, but in other embodiments actuators 21-26 may be comprised of linear actuators.
  • the actuators 21 to 26 are electromagnetic actuators, and although not shown, each includes an electric motor and an operation detection section that detects the operation of the electric motor (see FIG. 2).
  • the actuators 21-26 may consist of actuators in which other mechanical elements such as speed reducers, shafts, bearings, gears, brakes, etc. are coupled to the electric motor.
  • the electric motor is composed of an AC motor such as an induction motor or a synchronous motor, but in other embodiments, the electric motor may be composed of a DC motor.
  • the motion detector is composed of a mechanical, optical, magnetic, electromagnetic induction, or other encoder.
  • the first actuator 21 rotates the first housing 11 around the first axis J1
  • the second actuator 22 rotates the second housing 12 around the second axis J2.
  • the third actuator 23 rotates the third housing 13 around the third axis J3
  • the fourth actuator 24 rotates the fourth housing 14 around the fourth axis J4.
  • the fifth actuator 25 rotates the fifth housing 15 around the fifth axis J5, and the sixth actuator 26 rotates the sixth housing 16 around the sixth axis J6.
  • the boards 31-36 are printed boards (driving devices) that supply electric power to the electric motors of the actuators 21-26.
  • the substrates 31-36 are fixed inside the housings 10-16.
  • the first substrate 31 is fixed inside the first housing 11
  • the second substrate 32 and the third substrate 33 are fixed inside the second housing 12 .
  • the fourth substrate 34 and the fifth substrate 35 are fixed inside the third housing 13
  • the sixth substrate 36 is fixed inside the fourth housing 14 .
  • the first board 31 supplies power to the electric motor of the first actuator 21
  • the second board 32 supplies power to the electric motor of the second actuator 22
  • the third board 33 powers the motor of the third actuator 23 and the fourth board 34 powers the motor of the fourth actuator 24
  • the fifth board 35 powers the motor of the fifth actuator 25 and the sixth board 36 powers the motor of the sixth actuator 26 .
  • the filaments 41-52 are electrical cables electrically connected to the substrates 31-36.
  • a first filament 41 electrically connects the controller 40 of the machine 1 to the first substrate 31 and a second filament 42 electrically connects the first substrate 31 to the first actuator 21 .
  • a third filament 43 electrically connects the first substrate 31 to the second substrate 32 , and a fourth filament 44 electrically connects the second substrate 32 to the second actuator 22 .
  • a fifth filament 45 electrically connects the second substrate 32 to the third substrate 33
  • a sixth filament 46 electrically connects the third substrate 33 to the third actuator 23 .
  • the seventh filament 47 electrically connects the third substrate 33 to the fourth substrate 34
  • the eighth filament 48 electrically connects the fourth substrate 34 to the fourth actuator 24
  • a ninth filament 49 electrically connects the fourth substrate 34 to the fifth substrate 35
  • a tenth filament 50 electrically connects the fifth substrate 35 to the fifth actuator 25
  • the eleventh filament 51 electrically connects the fifth substrate 35 to the sixth substrate 36
  • a twelfth filament 52 electrically connects the sixth substrate 36 to the sixth actuator 26 .
  • the filaments 41, 43, 45, 47, 49, and 51 daisy-chain connect the substrates 31 to 36 and the controller 40, and the controller 40 connects the filaments 41, 43, 45, Power and signals are supplied to the substrates 31-36 via 47,49,51. That is, the filaments 41, 43, 45, 47, 49, 51 are electrical cables including power lines and signal lines.
  • the filaments 41, 43, 45, 47, 49, and 51 pass through through-holes of the actuators 21-26 (see through-holes 21c and 22c in FIG. 7), although not shown.
  • the filaments 42, 44, 46, 48, 50, 52 electrically connect the substrates 31-36 to the actuators 21-26.
  • the substrates 31-36 supply power to the motors of the actuators 21-26 via the filaments 42,44,46,48,50,52. That is, the filaments 42, 44, 46, 48, 50, 52 are electrical cables including power lines.
  • FIG. 2 is a block diagram of the substrate 31 of the first embodiment.
  • the actuator 21 driven and controlled by the substrate 31 includes an electric motor 21a and an operation detection section 21b that detects the operation of the electric motor 21a.
  • the electric motor 21a of this embodiment is composed of an AC motor, but in other embodiments, it may be composed of a DC motor.
  • the substrate 31 includes various electronic components that are heat generating elements.
  • the substrate 31 has a control section 60 , a drive section 61 and a current detection section 69 .
  • the control unit 60 supplies electric power to the electric motor 21a based on a command signal for the electric motor 21a from the host board (the control device 40 in this example) and a detection signal for the electric motor 21a from the operation detection unit 21b and the current detection unit 69. is provided with a control circuit for controlling the
  • the drive unit 61 includes an inverter circuit that converts the power from the host board (control device 40 in this example) from direct current to alternating current based on a signal from the control unit 60 .
  • the current detection unit 69 includes a current sensor of magnetic field detection type, resistance detection type, or the like.
  • the control circuit of the control unit 60 is composed of an integrated circuit that performs PWM (pulse width modulation) control of the inverter circuit of the driving unit 61.
  • PFM pulse frequency modulation
  • PAM pulse amplitude modulation
  • the integrated circuit is implemented by a semiconductor integrated circuit such as an MCU (micro controller unit) or LSI (large-scale integration), which is a heating element.
  • the inverter circuit of the drive unit 61 is composed of a voltage type inverter circuit, but may be composed of a current type inverter circuit in other embodiments.
  • the voltage type inverter circuit includes a capacitor 62 and switching elements 63-68.
  • the switching elements 63 to 68 are implemented by power semiconductors such as FETs (field-effect transistors), IGBTs (Insulated gate bipolar transistors), and IPMs (intelligent power modules), which are heating elements.
  • the control circuit of the control unit 60 adjusts the frequency, cycle, duty, etc. of the U-phase, V-phase, and W-phase three-phase AC voltages based on the command signal and detection signal from the electric motor 21a, and generates switching signals.
  • the inverter circuit of the drive unit 61 sequentially turns on and off the switching elements 63 to 68 based on the switching signal of the control unit 60 to supply the three-phase alternating current to the windings of the electric motor 21a.
  • the electric motor 21a operates, and the first actuator 21 rotates the first housing 11 around the first axis J1.
  • the drive unit 61 sequentially turns on and off the switching elements 63 to 68 based on the switching signal of the control unit 60, supplies three-phase alternating current to the motors of the other actuators 22 to 26,
  • Other actuators 22-26 rotate housings 12-16 about second axis J2-sixth axis J6.
  • the machine 1 operates, but when the vibration or impact of the machine 1 due to external or internal factors is transmitted to the boards 31 to 36 through the housings 11 to 16, soldering on the boards 31 to 36 occurs.
  • the substrates 31 to 36 may be damaged due to peeling of the electronic parts or disconnection of wiring between the electronic parts. Therefore, the substrates 31-36 of this embodiment are fixed to the housings 11-16 via vibration absorbing materials so that the vibration or impact of the machine 1 is less likely to be transmitted to the substrates 31-36.
  • FIG. 3 is a bottom view of the substrate fixing structure of the first embodiment
  • FIG. 4A is a IV-IV sectional view of the substrate fixing structure of the first embodiment.
  • the substrate fixing structure of the first substrate 31 for the first actuator 21 described with reference to FIG. 1 will be described in detail.
  • the substrate fixing structure of the first embodiment includes a substrate 31 for the actuators 21 that drive the machine 1 and vibration absorbers arranged on both sides of the substrate 31 so that the vibration or impact of the machine 1 is less likely to be transmitted to the substrate 31. and a fixing portion 81 that sandwiches the substrate 31 and the vibration absorbing material 80 and fixes them to the housing 11 of the machine.
  • the substrate 31 is formed in a substantially circular or substantially elliptical shape in plan view so as to match the internal shapes of the housings 10-16.
  • the substrate 31 may be substantially rectangular in plan view.
  • the substrate 31 is sandwiched between a vibration absorbing member 80a arranged on the front side of the substrate 31 and a vibration absorbing member 80b arranged on the back side of the substrate 31.
  • the fixing portions 81 are arranged at equal intervals (in this example, at intervals of 120 degrees) in the circumferential direction of the substrate 31 having a shape such as a substantially circular or substantially elliptical shape so that the substrate 31 is not displaced.
  • the fixed portions 81 may be arranged at the corners of the substantially rectangular substrate 31 .
  • the vibration absorbing material 80 is also called a vibration damping material, a shock absorbing material, a shock absorbing material, or the like. Vibration absorbing material 80 is formed of an elastomer such as gel, soft rubber, soft foam, or combinations thereof.
  • the vibration absorbing material 80 includes a vibration absorbing material 80 a arranged on the front side of the substrate 31 and a vibration absorbing material 80 b arranged on the back side of the substrate 31 .
  • the vibration absorbing material 80a arranged on the front side of the substrate 31 and the vibration absorbing material 80b arranged on the back side of the substrate 31 are formed of the same material and in the same shape.
  • the surface of the vibration absorber 80 should have a relatively high coefficient of friction so that the vibration absorber 80 does not slide on the surface of the substrate 31 .
  • the vibration absorbing material 80 may have an uneven surface or a jagged surface.
  • the fixing portion 81 includes a holding member 82 that holds the substrate 31 and the vibration absorbing material 80 between them, and a fixing member 83 that fixes the holding member 82 to the housing 11 of the machine 1 .
  • the holding member 82 is made of a rigid body such as metal or hard resin.
  • the sandwiching member 82 has a substantially U-shaped portion when viewed in cross section.
  • the sandwiching member 82 sandwiches the substrate 31 and the vibration absorbing material 80 with the U-shaped portion.
  • the fixing member 83 has a fastening member such as a screw including a male thread, a female thread and the like.
  • a fixing member 83 fixes the clamping member 82 to the housing 11 of the machine 1 .
  • the inner wall height H of the U-shaped portion of the holding member 82 By forming the inner wall height H of the U-shaped portion of the holding member 82 to be smaller than the thickness T including the substrate 31 and the two vibration absorbing members 80a and 80b arranged on both sides of the substrate 31, the two vibration absorbing members 80a and 80b are compressed, and substrate 31 is tightly attached by vibration absorbing materials 80a and 80b.
  • the height H of the U-shaped portion of the clamping member 82 is drawn larger than the thickness T including the substrate 31 and the two vibration absorbing members 80a and 80b in order to facilitate understanding of the components.
  • the height H of the U-shaped portion is actually smaller than the thickness T including the substrate 31 and the vibration absorbing members 80a and 80b.
  • the substrate 31 is fixed to the housing 11 of the machine 1 .
  • the vibration absorbing material 80 absorbs the vibration, so that the transmission of the vibration to the substrate 31 is reduced.
  • peeling of the electronic components soldered on the substrate 31 and disconnection of wiring between the electronic components are suppressed, and damage to the substrate 31 can be reduced. Consequently, the MTBF (Mean Time Between Failures) can be increased.
  • FIG. 4B is a IV-IV cross-sectional view of a modified substrate fixing structure.
  • the holding member 82 includes two holding members, a first holding member 82a and a second holding member 82b, which hold the substrate 31 and the vibration absorbing material 80, and the fixing member 83 holds the substrate 31 and the vibration absorber 80 together.
  • 4A in that the first holding member 82a and the second holding member 82b are fixed to the housing 11 by penetrating the absorbing member 80, the first holding member 82a, and the second holding member 82b.
  • the two clamping members 82a and 82b do not have the U-shaped portion described above and are completely separated.
  • the fixing member 83 has a fastening member such as a screw including, for example, a male thread and a female thread.
  • the fixing member 83 penetrates the substrate 31 and the two vibration absorbing members 80a and 80b arranged on both sides of the substrate 31, the substrate 31 is prevented from being displaced and the vibration absorbing members 80 are prevented from sliding. can be firmly fixed.
  • the fixing member 83 penetrates the elastically deformable vibration absorbing material 80a and fixes the two completely separated holding members, that is, the first holding member 82a and the second holding member 82b, to the housing 11, the above-mentioned holding is performed. It is not necessary to adjust the dimensions of the height H of the U-shaped portion of the member 82 and the thickness T including the substrate 31 and the two vibration absorbing members 80a and 80b arranged on both sides of the substrate 31 in advance.
  • the substrate fixing structure of the modification also has a secondary effect of being easy to manufacture.
  • the vibration absorbing material 80 does not include two vibration absorbing materials 80a and 80b arranged on both the front side and the back side of the substrate 31, but on the front side and the back side of the substrate 31. It may be composed of one vibration absorbing material 80 having U-shaped portions (U-shaped portions arranged on both sides of the substrate 31) sandwiching both sides of the back side.
  • FIG. 4C is a IV-IV cross-sectional view of another modified substrate fixing structure.
  • the holding member 82 includes two holding members, a first holding member 82a and a second holding member 82b, which hold the substrate 31 and the vibration absorbing material 80, and the fixing member 83 is the first holding member.
  • a support member 83a that supports the member 82a and the second holding member 82b, a fastening member 83b that fastens the first holding member 82a and the second holding member 82b to the support member 83a, and a fastening that fastens the support member 83a to the housing 11. It is different from the substrate fixing structure of FIG. 4A in that the member 83c is provided.
  • the two clamping members 82a and 82b have the above-described U-shaped portions, and clamp the substrate 31 and the vibration absorbing material 80 by the U-shaped portions.
  • the support member 83a is formed in a substantially triangular, substantially L-shaped plate shape when viewed from the side, like a so-called shelf support.
  • the fastening members 83b and 83c are composed of screws including male threads and female threads.
  • the holding member 82 By configuring the holding member 82 with the two holding members 82a and 82b, the assembly process of sandwiching and assembling the substrate 30 and the vibration absorbing material 80 is facilitated. Further, since the fixing member 83 is provided with the supporting member 83a for supporting the two holding members 82a and 82b, the substrate 31, the vibration absorbing member 80, and the holding member 82 can be unitized (hereinafter referred to as "substrate holding unit"). ), by changing the shape of the support member 83, the board clamping unit can be easily fixed to the other housings 12 to 16 having a shape different from the shape of the housing 11. .
  • the vibration absorbing material 80 includes the vibration absorbing material 80a arranged on the front side of the substrate 31 and the vibration absorbing material 80b arranged on the back side of the substrate 31.
  • Vibration absorbers 80a and 80b are also different from the substrate fixing structure of FIG. 4A in that they are both formed in a substantially L shape when viewed in cross section. Since the substantially L-shaped vibration absorbers 80a and 80b are engaged with the side edges of the substrate 31, positioning of the vibration absorbers 80a and 80b is facilitated.
  • the two vibration absorbing members 80a and 80b arranged on the front side and the back side of the substrate 31 are in contact with each other on the side edges of the substrate 31 and have a substantially U-shape in cross section.
  • the vibration absorber 80 does not comprise two vibration absorbers 80a, 80b arranged on both the front and back sides of the substrate 31, but a single vibration absorber sandwiching both the front and back sides of the substrate 31. It may be composed of a vibration absorbing material 80 . Thereby, the vibration absorber 80 can be positioned more easily.
  • FIG. 5 is a bottom view of the substrate fixing structure of the second embodiment
  • FIG. 6A is a cross-sectional view of the substrate fixing structure VI-VI of the second embodiment.
  • the substrate fixing structure of the first substrate 31 for the first actuator 21 described with reference to FIG. 1 will be described, but it should be noted that the second substrate 32 to the sixth substrate 36 also have similar substrate fixing structures.
  • want to be In the substrate fixing structure of the first embodiment since the substrate 31 is separated from the housing 11 of the machine 1 by the vibration absorbing material 80, there is a possibility that the heat dissipation of the heat generating elements on the substrate 31 is deteriorated.
  • the substrate fixing structure of the second embodiment includes power semiconductors (switching elements 63 to 68) such as FETs, IGBTs, and IPMs, which are heating elements on the substrate 31, and integrated circuits such as MCUs and LSIs (control unit 60). ) to the housing 11 of the machine 1 , a heat transfer section 90 is further provided for connecting the heat generating element on the substrate 31 to the housing 11 of the machine 1 .
  • the heat transfer section 90 preferably includes a flexible and thin metal sheet so that the vibration of the housing 11 is less likely to be transferred to the substrate 31 .
  • the metal sheet is formed of a relatively high thermal conductivity metal such as aluminum, copper, or alloys thereof.
  • the heat transfer section 90 includes a heat absorption surface 91 connected to the heat generating elements on the substrate 31 and a heat dissipation surface 92 connected to the housing 11 .
  • the heat transfer section 90 further includes a heat conductive resin that adheres the heat absorbing surface 91 of the metal sheet to the heat generating elements (the switching elements 63 to 68 and the control section 60).
  • the heat absorbing surface 91 is adhered to a plurality of heat generating elements (the switching elements 63 to 68 and the control section 60) with heat conductive resin.
  • the heat absorbing surface 91 of each may be adhered to a specific heat generating element by means of heat conductive resin.
  • the heat transfer section 90 may further include a heat conductive resin that adheres the heat dissipation surface 92 of the metal sheet to the housing 11 of the machine 1 .
  • the heat dissipation surface 92 is adhered to the housing 11 of the machine 1 by thermally conductive resin. Each may be adhered to the body 11 .
  • the heat dissipation surface 92 may be fastened to the housing 11 with metal screws such as bolts and nuts.
  • the thermally conductive resin mentioned above may be a thermally conductive resin in which thermally conductive fibers are interconnected in a matrix resin.
  • the heat-conducting fiber includes aluminum nitride, magnesium oxide, boron nitride, alumina, anhydrous magnesium carbonate, silicon oxide, zinc oxide, etc.
  • the matrix resin includes polyimide resin, silicon resin, epoxy resin, phenolic resin, etc. and heat-resistant resins such as thermoplastic resins such as polyphenylene sulfide resins, polycarbonate resins, polybutylene terephthalate resins, and polyacetal resins.
  • the heat generated by the power semiconductors (switching elements 63 to 68) and the integrated circuit (control section 60), which are heat generating elements on the substrate 31, is transferred to the heat absorption surface 91 of the heat transfer section 90 as indicated by the heat transfer path H1.
  • the heat is radiated to the inside of the housing 11 of the machine 1, and the heat is transferred from the heat absorbing surface 91 to the heat radiating surface 92 of the heat transfer section 90 to the housing 11 of the machine 1 as indicated by the heat transfer path H2.
  • FIG. 6B is a IV-IV cross-sectional view of a modified substrate fixing structure.
  • the board fixing structure of the modification differs from the board fixing structure of FIG. 6A in that the heat transfer section 90 connects the board 31 itself to the housing 11 of the machine 1 . If there is no electronic component on the back side of the substrate 31 , the heat absorbing surface 91 of the heat transfer section 90 should be in close contact with the back side of the substrate 31 . The heat absorption surface 91 is adhered to the back side of the substrate 31 with the heat conductive resin described above, or fastened to the back side of the substrate 31 with metal screws.
  • the heat generated by the heat generating elements (the switching elements 63 to 68 and the control unit 60) arranged on the front side of the substrate 31 is radiated to the gas inside the housing 11 of the machine 1 as indicated by the heat transfer path H1.
  • heat is transferred from the substrate 31 to the heat dissipation surface 92 via the heat absorption surface 91 as indicated by the heat transfer path H2, and is radiated to the housing 11 of the machine 1.
  • the substrate fixing structures shown in FIGS. 6A and 6B may be used together, and the heat absorbing surface 91 of the heat transfer section 90 may be adhered to the heating elements of the substrate 31 and may be in close contact with the back side of the substrate 31 .
  • the transmission of vibration to the substrate 31 is reduced by the vibration absorbing material 80, and the heat generated by the heating element on the substrate 31 is efficiently dissipated by the heat transfer section 90. can.
  • the heating elements on the substrate 31 are less likely to reach the rated temperature, and the rated current can be increased, so the operating performance of the machine 1 can be improved.
  • the substrate fixing structure of the third embodiment will be described in detail below. Note that only parts different from the substrate fixing structure of the first embodiment will be described. Referring to FIG. 1 again, in the substrate fixing structure of the first embodiment, when performing maintenance or replacement of the substrates 31 to 36, two steps are performed: removing the separating portions 11a to 14a and then removing the substrates 31 to 36. It has to go through and takes time. Therefore, the substrate fixing structure of the third embodiment differs from the substrate fixing structure of the first embodiment in that the substrates 31 to 36 are fixed to the separating portions 11a to 14a that can be separated from the housings 11 to 14 of the machine 1. different.
  • FIG. 7 is an exploded view of the substrate fixing structure of the third embodiment.
  • FIG. 7 representatively illustrates two separate parts 11a and 12a separated from the two housings 11 and 12 of the machine 1, respectively.
  • the first substrate 31 is fixed to a first separation portion 11a separable from the first housing 11, and the second substrate 32 and the third substrate 33 are fixed to a second separation portion 12a separable from the second housing 12.
  • the fourth substrate 34 and the fifth substrate 35 are fixed to the third separating portion 13a separable from the third housing 13, and the sixth substrate 36 is attached to the fourth housing.
  • 14 is fixed to a fourth separating portion 14a that can be separated from .
  • the first substrate 31 further includes connectors 70-72 capable of separating the filaments 41-43. (see also Figure 2).
  • the first connector 70 allows the first filament 41 to be separated from the first substrate 31,
  • the second connector 71 allows the second filament 42 to be separated from the first substrate 31, and
  • the third connector 72 allows the third filament.
  • the body 43 is made separable from the first substrate 31 .
  • the second board 32 and the third board 33 are further provided with connectors 73-78 that can separate the filaments 43-47.
  • a fourth connector 73 allows the third filament 43 to be separated from the second substrate 32
  • a fifth connector 74 allows the fourth filament 44 to be separated from the second substrate 32
  • a sixth connector 75 allows the fifth filament to be separated.
  • the body 45 is made separable from the second substrate 32 .
  • a seventh connector 76 allows the fifth filament 45 to be separated from the third substrate 33
  • an eighth connector 77 allows the sixth filament 46 to be separated from the third substrate 33
  • a ninth connector 78 allows the seventh wire to be separated.
  • the strip 47 is made separable from the third substrate 33 .
  • the fourth board 34 to the sixth board 36 are also provided with connectors capable of separating the filaments 47 to 52 in the same manner.
  • first actuator 21 further includes a connector 71a capable of separating the second filamentous body 42 from the first actuator 21 instead of or in addition to the second connector 71 of the first substrate 31.
  • second actuator 22 further comprises a connector 74a capable of separating the fourth filament 44 from the second actuator 22 instead of or in addition to the fifth connector 74 of the second substrate 32.
  • the substrates 31 to 36 are fixed to the separating portions 11a to 14a that are separable from the housings 11 to 14, and the linear bodies 41 to 52 are separable.
  • a substrate fixing structure in which the substrates 31 to 36 and the separation portions 11a to 14a are unitized is configured (hereinafter referred to as "substrate separation unit").
  • the strips 41 to 52 are separated from the connectors 70 to 78, 71a, and 74a while the boards 31 to 36 are fixed to the separating portions 11a to 14a. Since the substrate separation unit can be detached from the machine 1 for maintenance and replacement of the substrates 31 to 36, the maintenance time and replacement time for the substrates 31 to 36 can be shortened. As a result, the MTTR (mean time to restore) can be shortened.
  • FIG. 8 is a cross-sectional view of a substrate fixing structure of a comparative example.
  • the substrate fixing structure of the comparative example includes a substrate 31 for the actuator of the machine 1 , a support metal fitting 84 fixed to the housing 11 to support the substrate 31 , and a fastening system for fastening the substrate 31 and the support metal fitting 84 to the housing 11 .
  • a member 83 is provided.
  • the substrate fixing structure of the comparative example is different from the substrate fixing structure of the above-described embodiment in that it does not include the vibration absorbers 80 arranged on both sides of the substrate 31 .
  • the vibration is transmitted to the substrate 31 via the support bracket 84. Communicate directly.
  • the substrate 31 may be damaged due to peeling of the electronic components soldered on the substrate 31 or disconnection of the wiring between the electronic components.
  • the substrate fixing structure of the above-described embodiment even if vibration or shock occurs in the housings 10 to 16 of the machine 1 when the machine 1 operates, the vibration is absorbed by the vibration absorbing material 80, Since the transmission of vibrations to 31-36 is reduced, breakage of substrates 31-36 can be reduced. In other words, the MTBF (mean time between failures) can be increased. As a result, it is possible to provide a substrate fixing structure that enhances the reliability of the substrates 31-36. Moreover, such a substrate fixing structure can provide a highly reliable machine or robot.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Motor Or Generator Frames (AREA)
PCT/JP2021/039713 2021-10-27 2021-10-27 基板固定構造、機械、及びロボット WO2023073843A1 (ja)

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PCT/JP2021/039713 WO2023073843A1 (ja) 2021-10-27 2021-10-27 基板固定構造、機械、及びロボット
TW111136447A TW202317339A (zh) 2021-10-27 2022-09-27 基板固定構造、機械及機器人

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0477283U (enrdf_load_stackoverflow) * 1990-11-19 1992-07-06
WO2011013509A1 (ja) * 2009-07-31 2011-02-03 ボッシュ株式会社 電子装置
JP2013229414A (ja) * 2012-04-25 2013-11-07 Hitachi Automotive Systems Ltd 電子制御装置
JP2018170357A (ja) * 2017-03-29 2018-11-01 富士高分子工業株式会社 熱伝導シート
JP2020148232A (ja) * 2019-03-12 2020-09-17 三菱電機株式会社 支持材、組み付け部品、電子機器および組み付け方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009208213A (ja) * 2008-03-06 2009-09-17 Yaskawa Electric Corp マニピュレータ装置
JP7009935B2 (ja) * 2017-11-06 2022-01-26 セイコーエプソン株式会社 ロボット

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0477283U (enrdf_load_stackoverflow) * 1990-11-19 1992-07-06
WO2011013509A1 (ja) * 2009-07-31 2011-02-03 ボッシュ株式会社 電子装置
JP2013229414A (ja) * 2012-04-25 2013-11-07 Hitachi Automotive Systems Ltd 電子制御装置
JP2018170357A (ja) * 2017-03-29 2018-11-01 富士高分子工業株式会社 熱伝導シート
JP2020148232A (ja) * 2019-03-12 2020-09-17 三菱電機株式会社 支持材、組み付け部品、電子機器および組み付け方法

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